JPH0710497Y2 - Jig for partial plating of lead frame - Google Patents

Jig for partial plating of lead frame

Info

Publication number
JPH0710497Y2
JPH0710497Y2 JP1988086408U JP8640888U JPH0710497Y2 JP H0710497 Y2 JPH0710497 Y2 JP H0710497Y2 JP 1988086408 U JP1988086408 U JP 1988086408U JP 8640888 U JP8640888 U JP 8640888U JP H0710497 Y2 JPH0710497 Y2 JP H0710497Y2
Authority
JP
Japan
Prior art keywords
lead frame
plating
jig
partial plating
holding plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988086408U
Other languages
Japanese (ja)
Other versions
JPH028149U (en
Inventor
智明 古閑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui High Tech Inc
Original Assignee
Mitsui High Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui High Tech Inc filed Critical Mitsui High Tech Inc
Priority to JP1988086408U priority Critical patent/JPH0710497Y2/en
Publication of JPH028149U publication Critical patent/JPH028149U/ja
Application granted granted Critical
Publication of JPH0710497Y2 publication Critical patent/JPH0710497Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、リードフレームを部分メッキする際に使用す
る治具に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a jig used for partial plating of a lead frame.

〔従来の技術〕[Conventional technology]

半導体装置を組み立てるとき、ダイボンディング又はワ
イヤボンディングを確実に行うため、リードフレームの
インナーリード先端やパッド部に金，銀等の貴金属メッ
キが施されている。At the time of assembling a semiconductor device, in order to surely perform die bonding or wire bonding, the inner lead tips and pads of the lead frame are plated with a precious metal such as gold or silver.

貴金属のメッキ層は、樹脂封止機との密着性及びはんだ
付け性の低下、またマイグレーションの発生等の問題に
より、必要最小限にとどめられる。また、不要部分に対
しても貴金属メッキ層を設けるとき、メッキ液の消費量
が増加し、生産コストを上げるだけでなく、品質低下の
原因となる。The noble metal plating layer is kept to a necessary minimum due to problems such as deterioration of adhesion and solderability with the resin sealing machine and occurrence of migration. Further, when the noble metal plating layer is provided also on the unnecessary portion, the consumption of the plating solution increases, which not only raises the production cost but also deteriorates the quality.

そこで、第２図に示すように、押え板とマスク板との間
にリードフレームを挟持してメッキすることが知られて
いる（実開昭62−135446公報参照）。すなわち、所定の
形状にスタンピング成形或いはエッチング成形されたリ
ードフレーム１を、押え板２とマスク板３との間に挟み
込み、この状態でメッキ液４を供給する。メッキ液４
は、リードフレーム１に対応してマスク板３に形成され
た開口部を介してリードフレーム１と接触し、所定部分
にメッキ層を形成する。なお、押え板２及びマスク板３
は、リードフレーム１に対する密着性を良くするため、
弾性体2a,3aがそれぞれ貼付されている。Therefore, as shown in FIG. 2, it is known to sandwich a lead frame between a holding plate and a mask plate for plating (see Japanese Utility Model Laid-Open No. 62-135446). That is, the lead frame 1 stamped or etched into a predetermined shape is sandwiched between the pressing plate 2 and the mask plate 3, and the plating solution 4 is supplied in this state. Plating solution 4
Contacts the lead frame 1 through an opening formed in the mask plate 3 corresponding to the lead frame 1 and forms a plating layer on a predetermined portion. The pressing plate 2 and the mask plate 3
In order to improve the adhesion to the lead frame 1,
Elastic bodies 2a and 3a are attached respectively.

〔考案が解決しようとする課題〕[Problems to be solved by the device]

ところが、マスク板３上に配置されたリードフレーム１
に対して押え板２を押圧するとき、押圧力によってイン
ナーリード先端やサポートバーが変形し、押え板２とリ
ードフレーム１との間に隙間５が生じ易い。この隙間５
は、メッキ液４がリードフレーム１の裏面に漏れる原因
となる。その結果、メッキ液の消費量が増加することは
勿論、リードフレーム１の裏面側にもメッキ層が形成さ
れ、樹脂封止機との密着があり、IC装置の強度が低下す
る。その他、マイグレーションの発生，リードフレーム
の酸化されやすさ等の原因により、IC装置の機能が低下
することもあり得る。However, the lead frame 1 arranged on the mask plate 3
On the other hand, when the pressing plate 2 is pressed, the tips of the inner leads and the support bars are deformed by the pressing force, and a gap 5 is likely to be formed between the pressing plate 2 and the lead frame 1. This gap 5
Causes the plating solution 4 to leak to the back surface of the lead frame 1. As a result, not only the consumption of the plating solution increases, but also the plating layer is formed on the back surface side of the lead frame 1, and the plating layer is in close contact with the resin encapsulating machine, which reduces the strength of the IC device. In addition, the function of the IC device may be deteriorated due to the occurrence of migration, the easiness of oxidation of the lead frame, and the like.

そこで、本考案は、リードフレームを吸着する磁性体を
埋設した押え板を使用することにより、隙間の発生を無
くし、リードフレームの特定された表面部分に正確なメ
ッキ層を形成することを目的とする。In view of this, the present invention aims to eliminate the occurrence of gaps and form an accurate plating layer on a specified surface portion of the lead frame by using a holding plate in which a magnetic material that attracts the lead frame is embedded. To do.

〔課題を解決するための手段〕[Means for Solving the Problems]

本考案の部分メッキ用治具は、その目的を達成するため
に、リードフレームの非メッキ側表面に当接する押え板
の内部に、前記非メッキ側表面を前記押え板に吸着させ
る磁力を発生させる磁性体を埋設したことを特徴とす
る。In order to achieve the object, the jig for partial plating of the present invention generates a magnetic force for adsorbing the non-plating side surface to the holding plate inside the holding plate contacting the non-plating side surface of the lead frame. It is characterized in that a magnetic material is embedded.

〔実施例〕〔Example〕

第１図は、本考案に従った部分メッキ用治具を使用し
て、リードフレームを部分メッキしている状態を示す。
なお、同図において、第２図に示した部材等に対応する
ものについては、同一の符番で指示した。FIG. 1 shows a state where a lead frame is partially plated using a jig for partial plating according to the present invention.
In the figure, parts corresponding to the members shown in FIG. 2 are designated by the same reference numerals.

本例においても、リードフレーム１は、押え板２とマス
ク板３との間に挟持され、マスク板３に形成された開口
部を介してメッキ液４がリードフレーム１に供給され
る。このとき、押え板２内に磁性体６を埋設している。
この磁性体６によってリードフレーム１が押え板２に吸
着される。したがって、押え板２をマスク板３に押圧し
た場合にあっても、第２図で示した隙間５がリードフレ
ーム１と押え板２との間に形成されることがない。その
ため、メッキ作業中にメッキ液４がリードフレーム１の
裏面に廻り込むことがなく、リードフレーム１の所定部
分が正確にメッキされる。Also in this example, the lead frame 1 is sandwiched between the pressing plate 2 and the mask plate 3, and the plating liquid 4 is supplied to the lead frame 1 through the opening formed in the mask plate 3. At this time, the magnetic body 6 is embedded in the holding plate 2.
The lead frame 1 is attracted to the holding plate 2 by the magnetic body 6. Therefore, even when the pressing plate 2 is pressed against the mask plate 3, the gap 5 shown in FIG. 2 is not formed between the lead frame 1 and the pressing plate 2. Therefore, the plating liquid 4 does not flow around the back surface of the lead frame 1 during the plating operation, and a predetermined portion of the lead frame 1 is accurately plated.

なお、第１図の例では、押え板２の本体と弾性体2aとの
間に磁性体６を介在させている。しかし本考案は、これ
に拘束されるものではなく、たとえば弾性体2aの中に磁
性体を埋め込んだものを使用しても同様な効果が得られ
る。In the example of FIG. 1, the magnetic body 6 is interposed between the main body of the pressing plate 2 and the elastic body 2a. However, the present invention is not limited to this, and the same effect can be obtained by using, for example, an elastic body 2a in which a magnetic body is embedded.

〔考案の効果〕[Effect of device]

以上に説明したように、本考案においては、押え板にリ
ードフレームが密着した状態でメッキが行われるため、
パッドやインナーリード先端の裏面にメッキ金属が付着
することなく、最低限必要なメッキ液の消費量で、安定
した品質のリードフレームを製造することができる。As described above, in the present invention, the plating is performed with the lead frame in close contact with the holding plate,
It is possible to manufacture a lead frame of stable quality with the minimum required consumption of the plating solution without the plating metal adhering to the back surface of the pad or the inner lead tip.

【図面の簡単な説明】[Brief description of drawings]

第１図は本考案実施例を説明するための図であり、第２
図は従来の問題点を説明するための図である。 1:リードフレーム、2:押え板、3:マスク板、2a,3a:弾性
体、4:メッキ液、5:隙間、6:磁性体FIG. 1 is a diagram for explaining an embodiment of the present invention, and FIG.
The figure is a figure for demonstrating the conventional problem. 1: Lead frame, 2: Holding plate, 3: Mask plate, 2a, 3a: Elastic body, 4: Plating liquid, 5: Gap, 6: Magnetic body

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項１】リードフレームの非メッキ側表面に当接す
る押え板の内部に、前記非メッキ側表面を前記押え板に
吸着させる磁力を発生させる磁性体を埋設したことを特
徴とするリードフレームの部分メッキ用治具。1. A lead frame, wherein a magnetic body for generating a magnetic force for adsorbing the non-plated side surface to the holding plate is embedded inside the holding plate that abuts the non-plated side surface of the lead frame. Jig for partial plating.
JP1988086408U 1988-06-28 1988-06-28 Jig for partial plating of lead frame Expired - Lifetime JPH0710497Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988086408U JPH0710497Y2 (en) 1988-06-28 1988-06-28 Jig for partial plating of lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988086408U JPH0710497Y2 (en) 1988-06-28 1988-06-28 Jig for partial plating of lead frame

Publications (2)

Publication Number Publication Date
JPH028149U JPH028149U (en) 1990-01-19
JPH0710497Y2 true JPH0710497Y2 (en) 1995-03-08

Family

ID=31311046

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988086408U Expired - Lifetime JPH0710497Y2 (en) 1988-06-28 1988-06-28 Jig for partial plating of lead frame

Country Status (1)

Country Link
JP (1) JPH0710497Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2581342B2 (en) * 1991-04-30 1997-02-12 株式会社村田製作所 Lead frame holder

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5569290A (en) * 1978-11-13 1980-05-24 Mitsubishi Electric Corp Method and apparatus for production of partially plated metal material
JPS62135446U (en) * 1986-02-19 1987-08-26

Also Published As

Publication number Publication date
JPH028149U (en) 1990-01-19

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