JPH0661217A - 金属汚染物の除去方法 - Google Patents

金属汚染物の除去方法

Info

Publication number
JPH0661217A
JPH0661217A JP5127338A JP12733893A JPH0661217A JP H0661217 A JPH0661217 A JP H0661217A JP 5127338 A JP5127338 A JP 5127338A JP 12733893 A JP12733893 A JP 12733893A JP H0661217 A JPH0661217 A JP H0661217A
Authority
JP
Japan
Prior art keywords
metal
solution
removal
water
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5127338A
Other languages
English (en)
Japanese (ja)
Inventor
Monte A Douglas
エイ．ダグラス モンテ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of JPH0661217A publication Critical patent/JPH0661217A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10P70/15—
    • H10P52/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
    • H10P72/0416—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
JP5127338A 1992-05-29 1993-05-28 金属汚染物の除去方法 Pending JPH0661217A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US890415 1986-07-25
US89041592A 1992-05-29 1992-05-29

Publications (1)

Publication Number Publication Date
JPH0661217A true JPH0661217A (ja) 1994-03-04

Family

ID=25396646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5127338A Pending JPH0661217A (ja) 1992-05-29 1993-05-28 金属汚染物の除去方法

Country Status (4)

Country Link
EP (2) EP0702400A3 (cg-RX-API-DMAC10.html)
JP (1) JPH0661217A (cg-RX-API-DMAC10.html)
KR (1) KR930024112A (cg-RX-API-DMAC10.html)
TW (1) TW267240B (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7052994B2 (en) 2000-04-28 2006-05-30 Nec Electronics Corporation Method for manufacturing semiconductor device, and processing system and semiconductor device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6296714B1 (en) * 1997-01-16 2001-10-02 Mitsubishi Materials Silicon Corporation Washing solution of semiconductor substrate and washing method using the same
US6482269B1 (en) 1997-05-29 2002-11-19 Memc Electronic Materials, Inc. Process for the removal of copper and other metallic impurities from silicon

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61275200A (ja) * 1985-05-28 1986-12-05 Tokai Carbon Co Ltd ＳｉＣウイスカ−の精製方法
JPH0719764B2 (ja) * 1986-07-28 1995-03-06 大日本スクリ−ン製造株式会社 表面洗浄方法
EP0286233B1 (en) * 1987-03-11 1992-01-02 Omco Co. Ltd. Water electrolyzing apparatus
JP2540583B2 (ja) * 1988-03-07 1996-10-02 日本電信電話株式会社 基板の清浄化処理方法およびその装置
JPH02102529A (ja) * 1988-10-12 1990-04-16 Matsushita Electron Corp マスク洗浄方法
JPH069195B2 (ja) * 1989-05-06 1994-02-02 大日本スクリーン製造株式会社 基板の表面処理方法
JPH0382029A (ja) * 1989-08-24 1991-04-08 Nec Corp 湿式処理装置
JPH0475339A (ja) * 1990-07-17 1992-03-10 Seiko Epson Corp 電界洗浄法
EP0502356A3 (en) * 1991-02-28 1993-03-10 Texas Instruments Incorporated Photo-stimulated removal of trace metals
EP0567939A3 (en) * 1992-04-29 1993-12-15 Texas Instruments Inc Method of removing small particles from a surface

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7052994B2 (en) 2000-04-28 2006-05-30 Nec Electronics Corporation Method for manufacturing semiconductor device, and processing system and semiconductor device

Also Published As

Publication number Publication date
EP0702400A2 (en) 1996-03-20
KR930024112A (ko) 1993-12-21
EP0571950A3 (en) 1993-12-15
EP0571950A2 (en) 1993-12-01
TW267240B (cg-RX-API-DMAC10.html) 1996-01-01
EP0702400A3 (en) 1996-05-15

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