JPH0648901Y2 - 大電流配線板 - Google Patents
大電流配線板Info
- Publication number
- JPH0648901Y2 JPH0648901Y2 JP1988124176U JP12417688U JPH0648901Y2 JP H0648901 Y2 JPH0648901 Y2 JP H0648901Y2 JP 1988124176 U JP1988124176 U JP 1988124176U JP 12417688 U JP12417688 U JP 12417688U JP H0648901 Y2 JPH0648901 Y2 JP H0648901Y2
- Authority
- JP
- Japan
- Prior art keywords
- current power
- wiring board
- insulating substrate
- power circuit
- holding portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988124176U JPH0648901Y2 (ja) | 1988-09-22 | 1988-09-22 | 大電流配線板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988124176U JPH0648901Y2 (ja) | 1988-09-22 | 1988-09-22 | 大電流配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0245667U JPH0245667U (enrdf_load_stackoverflow) | 1990-03-29 |
JPH0648901Y2 true JPH0648901Y2 (ja) | 1994-12-12 |
Family
ID=31373682
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988124176U Expired - Lifetime JPH0648901Y2 (ja) | 1988-09-22 | 1988-09-22 | 大電流配線板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0648901Y2 (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0639256Y2 (ja) * | 1989-04-13 | 1994-10-12 | サンデン株式会社 | ヘッダパイプ |
JPH0737205Y2 (ja) * | 1992-08-31 | 1995-08-23 | 日本メクトロン株式会社 | 内部端子型積層母線 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63124174A (ja) * | 1986-11-14 | 1988-05-27 | Hitachi Ltd | 読取りコ−ド化装置 |
-
1988
- 1988-09-22 JP JP1988124176U patent/JPH0648901Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0245667U (enrdf_load_stackoverflow) | 1990-03-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH06302932A (ja) | プリント配線基板 | |
US6830459B2 (en) | High current, high mechanical strength connectors for insulated metal substrate circuit boards | |
JPS5998591A (ja) | 両面回路接続方法 | |
JPH0648901Y2 (ja) | 大電流配線板 | |
JPH0642360Y2 (ja) | プリント配線板 | |
US4945190A (en) | Circuit board device for magnetics circuit and method of manufacturing same | |
JPH0623019Y2 (ja) | 大電流配線板ユニット | |
JPS6026458Y2 (ja) | 圧着端子構造 | |
JP2508690Y2 (ja) | 大電流配線板 | |
CN219761435U (zh) | 一种具备大电流过流能力的电路板结构 | |
CN222381849U (zh) | 具有抗杂讯电流传输结构的电路装置及抗杂讯电流传输结构 | |
JP2811790B2 (ja) | 電子回路装置 | |
JPH0729874U (ja) | 大電流プリント板の接続構造 | |
JPH0741093Y2 (ja) | 基板実装用コネクタの取付け構造 | |
JPS63105480A (ja) | プリント配線板の接続装置 | |
JP3354308B2 (ja) | 大電流回路基板およびその製造方法 | |
JPS58131674A (ja) | 電源母線の接続構造 | |
JP2001284757A (ja) | 大電流プリント配線板 | |
JPH0760915B2 (ja) | 基板装置 | |
JPS59163968U (ja) | プリント回路板検査装置 | |
JP2001250606A (ja) | 回路基板用接続端子及びそれを備えた回路基板 | |
JPH03227094A (ja) | 大電流プリント配線板 | |
JPH0134300Y2 (enrdf_load_stackoverflow) | ||
JPH0311815Y2 (enrdf_load_stackoverflow) | ||
JPH05191010A (ja) | 大電流回路基板 |