JPH0648901Y2 - High current wiring board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a large-current wiring board having a circuit for large-current power.

[Prior Art] Generally, in a printed wiring board, a desired conductor pattern is formed by laminating a copper foil having a thickness of 5 to 70 μm on an insulating substrate such as glass epoxy and etching the copper foil.

Therefore, this type of printed wiring board uses an extremely thin copper foil and therefore has a limited current capacity and can be used only for small current applications such as electronic circuits and control circuits.

On the other hand, inside the electric device, there is a power circuit through which a large current is passed, and it is generally formed by an insulated wire with a crimp terminal or a copper bar punched out of a copper plate.

[Problems to be Solved by the Invention] As described above, in the conventional electric equipment, since the insulated wire and the copper bar are used, it is necessary to manpower the wiring of the power circuit and the space for the wiring is required. Therefore, it is difficult to automate the assembly of electronic devices and make the electronic devices compact.

The present invention has been made based on the above, and makes it possible to automate the assembly of an electric device and make the electric device compact. The purpose is to provide a high-current wiring board.

[Means for Solving Problems] In the large current wiring board of the present invention, a plurality of large current power circuits made of oxygen-free copper plate are formed on the surface of the insulating substrate. One or both of a hollow protrusion that enables electrical connection to the lower component by bolting and a holding portion that enables retention and electrical connection of the upper component on the substrate by bolting are formed. Is provided by protruding to the back surface of the insulating substrate by burring or drawing, and the holding portion is provided by press-fitting and fixing a self-clinching nut into a hole formed in the circuit for high current power. It is what

[Operation] The present invention provides a high current power circuit with a burring process (or a drawing process) and / or a press-fitting fixation of a self-clinching nut. This makes it possible to connect, and thereby, it is possible to easily realize automation of assembly by downsizing the electric device and downsizing of the electric device.

Further, in the present invention, a circuit for large current and power is formed with oxygen-free copper. Since oxygen-free copper has high workability, burring processing (or drawing processing) and press-fitting fixing of self-clinching nut are performed. Work can be performed easily. Further, since oxygen-free copper has an excellent electric conductivity, it is possible to suppress circuit heat generation to a small level.

[Embodiment of the Invention] An embodiment of the high-current wiring board of the present invention will be described below with reference to FIGS. Reference numeral 1 denotes an insulating substrate made of glass epoxy or the like, on which a large-current power circuit 2 is formed. The circuit 2 for high current power has an oxygen content
It is formed using a copper bar stamped from an oxygen-free copper plate of 10 ppm or less. By applying a resist to the large-current power circuit 2, it is possible to prevent corrosion due to rust or the like and to perform electrical insulation.

The large current power circuit 2 is fixed on the insulating substrate 1 by soldering or bolting.

As shown in FIG. 2, the large current power circuit 2 has a hollow protrusion 3 formed in a hole 6 of an insulating substrate by performing a burring process. The hollow protrusion 3 is an insulating substrate 1.
It is formed so as to project about 0 to 1 mm on the back surface of the board, and it is possible to easily connect to the electrical contact surface of the electric component arranged under the board through the hollow projecting portion 3 by using a bolt. Electrical connection with the parts is facilitated.

Further, as shown in FIG. 3, in the hole 7 of the insulating substrate 1,
A holding portion 4 is formed which holds the electric components arranged on the substrate and enables the electric connection with the large current power circuit. This holding portion is formed by press-fitting and fixing a self-clinching nut 5 having a threaded portion made of carbon steel into a hole 8 provided in the high-current power circuit 2, and is used for electric components of electric parts arranged on the substrate. The connection to the contact surface can be easily made with bolts.

In this way, by providing a hollow projecting portion by burring and a holding portion by press-fitting and fixing a self-clinching nut in the high-current power circuit, it is easy to fix and electrically connect the electric components arranged above and below the board. Moreover, each can be surely performed.

In the above embodiment, the burring process is applied to the second current power circuit 2 as means for making electrical contact with the lower part of the insulating substrate. However, in the present invention, the drawing process is performed as shown in FIG. The hollow protrusion 3 ′ may be formed by applying.

[Effects of the Invention] As described above, the present invention forms a circuit for high-current power made of an oxygen-free copper plate on the surface of an insulating substrate, and a hollow protrusion and a self-clinching formed by burring (or drawing) on the circuit. Since either or both of the holding portions are provided by press-fitting and fixing the ring nut, it is possible to automate the assembly and reduce the size of the electric device by eliminating the wiring of the electric device.

[Brief description of drawings]

FIG. 1 is an overall perspective explanatory view of an embodiment of the present invention, FIG. 2 is a sectional explanatory view of a hollow protruding portion, FIG. 3 is a sectional explanatory view of a holding portion, and FIG. 4 is another explanation of a hollow protruding portion. It is a figure. 1: Insulation board, 2: High current power circuit 3, 3 ': Hollow protrusion, 4: Holding part 5: Self clinching nut

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Hisashi Takahashi, 1500 Kawajiri-cho, Hitachi, Hitachi, Ibaraki Prefecture, Hitachi Cable Kako Co., Ltd. (72) Rikio Saito, 1500, Kawajiri, Hitachi, Ibaraki, Hitachi Cable, Ltd. (72) Inventor Junichi Aoi 2-1-2 Marunouchi, Chiyoda-ku, Tokyo Nitrate Electric Wire & Cable Co., Ltd. (56) References: Kaikaihei 2-45665 (JP, U)

Claims (1)

[Scope of utility model registration request] 1. A plurality of high-current power circuits made of an oxygen-free copper plate are formed on the surface of an insulating substrate, and the high-current power circuits can be electrically connected to a lower part of the substrate by bolting. One or both of the hollow protruding portion and a holding portion capable of holding and electrically connecting the components on the board by bolting are formed, and the hollow protruding portion is provided so as to project on the back surface of the insulating substrate by burring processing or drawing processing. Has been
A large-current wiring board, wherein the holding portion is provided by press-fitting and fixing a self-clinching nut into a hole formed in the large-current power circuit.