JPH0760915B2 - Substrate device - Google Patents
Substrate deviceInfo
- Publication number
- JPH0760915B2 JPH0760915B2 JP1025329A JP2532989A JPH0760915B2 JP H0760915 B2 JPH0760915 B2 JP H0760915B2 JP 1025329 A JP1025329 A JP 1025329A JP 2532989 A JP2532989 A JP 2532989A JP H0760915 B2 JPH0760915 B2 JP H0760915B2
- Authority
- JP
- Japan
- Prior art keywords
- bus bar
- terminal
- caulking
- substrate
- circuit element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Landscapes
- Structure Of Printed Boards (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ この発明は、基板とバスバーとを積層して該バスバーに
回路素子を電気的に接続した基板装置に関するものであ
る。TECHNICAL FIELD The present invention relates to a substrate device in which a substrate and a bus bar are laminated and a circuit element is electrically connected to the bus bar.
［従来の技術］ 第３図は、例えば実開昭55−77882号公報に開示された
従来の基板装置を示す要部断面図である。図において、
１はバスバー、２はそのバスバー１のバーリング部で、
このバーリング部２はテーパー状に形成されている。３
は前記バスバー１に電気的に接続するための回路素子、
４はその回路素子３のリード端子、５は前記バーリング
部２の透孔、６は前記バスバー１を積層させる基板、７
はその基板６に設けられた透孔、８は前記基板６上に形
成された前記バスバー１との間に介在させる銅箔パター
ン、９は前記バスバー１とリード端子４とを結合する半
田である。[Prior Art] FIG. 3 is a cross-sectional view of an essential part showing a conventional substrate device disclosed in, for example, Japanese Utility Model Publication No. 55-77882. In the figure,
1 is a bus bar, 2 is a burring portion of the bus bar 1,
The burring portion 2 is formed in a tapered shape. Three
Is a circuit element for electrically connecting to the bus bar 1,
Reference numeral 4 is a lead terminal of the circuit element 3, 5 is a through hole of the burring portion 2, 6 is a substrate on which the bus bar 1 is laminated, 7
Is a through hole provided in the substrate 6, 8 is a copper foil pattern to be interposed between the bus bar 1 formed on the substrate 6, and 9 is solder for connecting the bus bar 1 and the lead terminal 4. .
以上において、基板６の透孔７にはバスバー１のバーリ
ング部２が挿入され、このバーリング部２の透孔５には
回路素子３のリード端子４が挿入され、この状態におい
て、前記バスバー１と前記リード端子４は溶融半田で半
田９付けされて両者の電気的接続が行われている。In the above, the burring portion 2 of the bus bar 1 is inserted into the through hole 7 of the substrate 6, the lead terminal 4 of the circuit element 3 is inserted into the through hole 5 of the burring portion 2, and in this state, the bus bar 1 and The lead terminal 4 is soldered 9 with molten solder to electrically connect the two.
これにより、回路素子３のリード端子４はバーリング部
２で直接バスバー１と接続されるので、その導通路の電
気インピーダンスを低減させることができる。As a result, the lead terminal 4 of the circuit element 3 is directly connected to the bus bar 1 at the burring portion 2, so that the electrical impedance of the conducting path can be reduced.
しかしながら、このようなバスバー１と回路素子３の固
定方法では、バスバー１のバーリング部２が各リード端
子４との半田付け性を良くすべくテーパー状に形成さ
れ、そのテーパー先端部で付近で半田付けしているた
め、バスバー１と半田９との電気的接続の信頼性が悪
く、インピーダンスの低減にも限界がある。また、この
ようなバスバー１の形状や固定方法では機械的にも弱
く、大電流を流すのに不向きである。さらに、バスバー
１は基板６の銅箔パターン８を介して半田９付けされて
いるが、バスバー１を固定する目的のみで前記銅箔パタ
ーン８を成形することは、作業が非常に面倒でその成形
工程が長くなって製造コストの低減に逆行するなどの問
題点があった。However, in the method of fixing the bus bar 1 and the circuit element 3 as described above, the burring portion 2 of the bus bar 1 is formed in a taper shape so as to improve the solderability with the lead terminals 4, and the soldering is performed in the vicinity of the taper tip end portion. Since they are attached, the reliability of the electrical connection between the bus bar 1 and the solder 9 is poor, and there is a limit to the reduction of impedance. Further, such a shape of the bus bar 1 and a fixing method are mechanically weak and are not suitable for passing a large current. Further, the bus bar 1 is soldered 9 via the copper foil pattern 8 of the substrate 6, but molding the copper foil pattern 8 only for the purpose of fixing the bus bar 1 is very troublesome work. There is a problem that the process becomes long and it goes against the reduction of manufacturing cost.
そこで本発明者らは、上記のような問題点を解消する目
的で第４図に示す基板装置を提案した。Therefore, the present inventors proposed the substrate device shown in FIG. 4 for the purpose of solving the above problems.
第４図において、21はバスバー１のバーリング部であ
り、このバーリング部21は基板６の透孔７の深さを越え
ない長さに構成され、そのバーリング21を基板６の透孔
７に挿入したとき、この例では間隙10が生じるようにし
てある。41は回路素子３に固定された根元側の大径リー
ド端子であり、その外径は基板６の透孔７の直径より大
きく設定されている。42は先端側の小径リード端子であ
り、前記バーリング部21の透孔５に例えば0.2〜0.5mmの
間隙をもって挿入され、この例では、その長さも前記バ
ーリング部21の透孔５の深さよりも例えば0.2〜0.5mm程
度短く構成されている。バーリング部21と小径リード端
子42との間隙には半田９が介在して両者を接合してい
る。この場合の半田９は例えば毛細管現象でバーリング
部21と小径リード端子42との間隙に入り込んで硬化し、
基板６挟だ状態で回路素子３の小径リード端子42がバス
バー１のバーリング部21に接合されることにより回路素
子３は強固に固定されている。In FIG. 4, reference numeral 21 is a burring portion of the bus bar 1, and the burring portion 21 is configured to have a length not exceeding the depth of the through hole 7 of the substrate 6, and the burring 21 is inserted into the through hole 7 of the substrate 6. Then, in this example, the gap 10 is formed. Reference numeral 41 denotes a large-diameter lead terminal on the base side fixed to the circuit element 3, the outer diameter of which is set larger than the diameter of the through hole 7 of the substrate 6. 42 is a small-diameter lead terminal on the tip side, which is inserted into the through hole 5 of the burring portion 21 with a gap of, for example, 0.2 to 0.5 mm. In this example, the length thereof is smaller than the depth of the through hole 5 of the burring portion 21. For example, it is configured to be about 0.2 to 0.5 mm shorter. Solder 9 is interposed in the gap between the burring portion 21 and the small diameter lead terminal 42 to join them. In this case, the solder 9 enters into the gap between the burring portion 21 and the small diameter lead terminal 42 due to a capillary phenomenon and hardens,
The circuit element 3 is firmly fixed by joining the small-diameter lead terminal 42 of the circuit element 3 to the burring portion 21 of the bus bar 1 while sandwiching the substrate 6.
［発明が解決しようとする課題］ 従来の基板装置は以上のように構成されているので、バ
スバー１とリード端子42とを半田９で接続していること
により、溶融半田の浸漬が必要となり、その結果、製造
工程が増えるのみならず、基板６およびバスバー１が溶
融半田で加熱されるので、その冷却後には、基板６とバ
スバー１との膨張係数の違いによって歪発生の恐れがあ
る。また、バスバー１のバーリング加工は非常に工数が
多くなると共に、その加工には特殊な設備が必要になる
などの問題点があった。[Problems to be Solved by the Invention] Since the conventional substrate device is configured as described above, since the bus bar 1 and the lead terminal 42 are connected by the solder 9, it is necessary to immerse the molten solder. As a result, not only the number of manufacturing steps is increased, but also the substrate 6 and the bus bar 1 are heated by the molten solder. Therefore, after cooling, the strain may occur due to the difference in the expansion coefficient between the substrate 6 and the bus bar 1. Further, there is a problem that the burring process of the bus bar 1 requires an extremely large number of man-hours and requires special equipment for the process.
この発明は上記のような問題点を解消するためになされ
たもので、基板に積層されるバスバーと回路素子との電
気的接続の信頼性向上および機械的強度の向上が図れて
大電流低インピーダンスの通電が可能で、しかも生産性
が向上する基板装置を得ることを目的とする。The present invention has been made to solve the above problems, and it is possible to improve the reliability of the electrical connection between the bus bar laminated on the substrate and the circuit element and the mechanical strength, thereby achieving a large current and low impedance. It is an object of the present invention to obtain a substrate device which can be energized and whose productivity is improved.
［課題を解決するための手段］ この発明に係る基板装置は、基板とバスバー相互の透孔
を貫通してそれらの基板とバスバーとを積層状態でかし
め止めするかしめ部と、該かしめ部に連続して外方に突
出する端子取付用の螺合部とが一体形成された導電性の
かしめターミナルを備え、前記螺合部に螺合した締付け
ねじで前記回路素子のリード端子が前記かしめターミナ
ルに締め付けられて該かしめターミナルが前記回路素子
のリード端子と前記バスバーとの間の電流計路を構成し
ているものである。[Means for Solving the Problem] A substrate device according to the present invention is a caulking portion which penetrates through holes of a substrate and a bus bar and caulks the substrate and the bus bar in a laminated state, and a continuous caulking portion. And a conductive caulking terminal integrally formed with a screwing portion for terminal mounting protruding outward, and the lead terminal of the circuit element is connected to the crimping terminal with a tightening screw screwed into the screwing portion. When clamped, the caulking terminal forms an ammeter path between the lead terminal of the circuit element and the bus bar.
［作用］ この発明における基板装置は、基板とバスバーとがそれ
らの透孔を貫通した導電性かしめターミナルのかしめ部
でかしめ止めされ、そのかしめ部に連続して外方に突出
する端子取付用の螺合部に締付けねじ螺合され、この締
付けねじで前記かしめターミナルに回路素子のリード端
子を締付け固定しているので、半田付けや接着剤および
バーリング加工用の特殊設備等を一切必要とせずに、前
記かしめターミナルと締付けねじだけで、基板とバスバ
ー相互の締付け固定および回路素子とバスバーの電気的
接続を簡単かつ確実に行うことができ、生産性の向上お
よびコストダウンが図れる。しかも、前記かしめターミ
ナルのかしめ部とバスバーおよび前記かしめターミナル
と回路素子のリード端子に面接触状態となって締付け固
定されるので、電気的接続および機械的強度の信頼性が
大幅に向上すると共に、電気インピーダンスが低減し、
大電流を流す上でも有利である。[Operation] In the board device according to the present invention, the board and the bus bar are caulked by the caulking portion of the conductive caulking terminal penetrating the through holes, and the terminal for projecting outwardly continuously to the caulking portion is provided. Since the lead terminal of the circuit element is tightened and fixed to the caulked terminal with the tightening screw that is screwed to the screwed part, no special equipment such as soldering, adhesive or burring processing is required. By only the caulking terminal and the tightening screw, the circuit board and the busbar can be tightened and fixed together and the electric connection between the circuit element and the busbar can be performed easily and surely, thereby improving the productivity and reducing the cost. Moreover, since the caulking portion of the caulking terminal and the bus bar and the caulking terminal and the lead terminal of the circuit element are clamped and fixed in a surface contact state, the reliability of electrical connection and mechanical strength is significantly improved, and Electrical impedance is reduced,
It is also advantageous in passing a large current.
［実施例］ 以下、この発明の一実施例を図について説明する。第１
図はこの発明の一実施例による基板装置の要部を示す断
面図である。[Embodiment] An embodiment of the present invention will be described below with reference to the drawings. First
FIG. 1 is a sectional view showing a main part of a substrate device according to an embodiment of the present invention.
第１図において、1aはバスバー１に設けられたターミナ
ル挿通用の透孔、6aは基板６に設けられて前記透孔1aを
合致させるターミナル挿通用の透孔、12は前記透孔1a,6
aの相互に貫通させるかしめターミナルであり、該かし
めターミナル12は、前記バスバー１と基板６とを積層状
態でかしめ止めするかしめ部12aと、このかしめ部12aに
連続して外方に突出する円筒状部の内周面に雌ねじ部
（螺合部）12bとが一体形成された導電部材からなって
いる。In FIG. 1, 1a is a through hole for inserting a terminal provided in the bus bar 1, 6a is a through hole for inserting a terminal which is provided in the substrate 6 to match the through hole 1a, 12 is the through holes 1a, 6
a is a caulking terminal penetrating each other, and the caulking terminal 12 is a caulking portion 12a for caulking the bus bar 1 and the substrate 6 in a laminated state, and a cylinder protruding outward from the caulking portion 12a. It is made of a conductive member integrally formed with an internal thread portion (screw portion) 12b on the inner peripheral surface of the shaped portion.
斯様なかしめターミナル12としては、例えば日本ドラヴ
ィット社製の商品名：ナットサート、製品番号:9488−0
620、M6用および9658−5821、M6用が挙げられる。As such a caulking terminal 12, for example, product name: Nutsart manufactured by Nippon Dravit Co., Ltd., product number: 9488-0
620, for M6 and 9658-5821, for M6.
ここで、前記バスバー１の透孔1aおよび前記基板６の透
孔6aは、前記かしめターミナル12の外径よりも0.1mm程
度大きな孔径に設定される。Here, the through hole 1a of the bus bar 1 and the through hole 6a of the substrate 6 are set to have a hole diameter that is about 0.1 mm larger than the outer diameter of the caulking terminal 12.
4aは前記かしめターミナル12の雌ねじ部12bに螺合して
回路素子３のリード端子４を前記かしめターミナル12に
締付け固定するための締付けねじである。Reference numeral 4a is a tightening screw for screwing the female screw portion 12b of the crimping terminal 12 to fix the lead terminal 4 of the circuit element 3 to the crimping terminal 12.
次に、基板装置の組立について説明する。Next, the assembly of the substrate device will be described.
先ず、基板６の透孔6aとバスバー１の透孔1aと合致させ
て、それらの基板６とバスバーとを積層する。この状態
において、前記各透孔6a,1a相互にかしめターミナル12
を貫通させ、そのかしめ部12aによって前記基板６とバ
スバー１とをかしめ止めする。次いで、前記かしめター
ミナル12の雌ねじ部12bに締付けねじ4aを螺合すること
により、該締付けねじ4aによって、回路素子３のリード
端子４を前記かしめターミナル12の突端に締付け固定す
る。First, the through holes 6a of the substrate 6 and the through holes 1a of the bus bar 1 are aligned with each other, and the substrate 6 and the bus bar are laminated. In this state, the through holes 6a, 1a are crimped to each other and the terminal 12 is
Through, and the caulking portion 12a crimps the substrate 6 and the bus bar 1. Then, the tightening screw 4a is screwed into the female screw portion 12b of the caulking terminal 12, whereby the lead terminal 4 of the circuit element 3 is tightened and fixed to the projecting end of the caulking terminal 12.
これによって、基板６とバスバー１とが一体的に締付け
固定されると共に、そのバスバー１と回路素子３のリー
ド端子４とが電気的に接続される。この場合、かしめタ
ーミナル12のかしめ部12aとバスバー１およびかしめタ
ーミナル12の突端と前記リード端子４とは面接触状態に
締付け固定される。As a result, the board 6 and the bus bar 1 are integrally tightened and fixed, and the bus bar 1 and the lead terminal 4 of the circuit element 3 are electrically connected. In this case, the caulking portion 12a of the caulking terminal 12, the bus bar 1, the protruding end of the caulking terminal 12 and the lead terminal 4 are tightened and fixed in a surface contact state.
従って、かしめターミナル12のかしめ部12aと締付けね
じ4aとにより、前記バスバー１と回路素子３との電気的
接続の信頼性が向上すると共に、基板６とバスバー１と
の機械的強度およびかしめターミナル12と回路素子３の
リード端子４との機械的強度も充分に満足させ得る。Therefore, the caulking portion 12a of the caulking terminal 12 and the tightening screw 4a improve the reliability of the electrical connection between the bus bar 1 and the circuit element 3, and the mechanical strength between the substrate 6 and the bus bar 1 and the caulking terminal 12 Also, the mechanical strength of the lead terminal 4 of the circuit element 3 can be sufficiently satisfied.
第２図はこの発明の他の実施例による基板装置の要部を
示す断面図であり、この実施例では、回路素子３に対す
る基板６とバスバー１との関係が第１図のものとは反対
になっており、この場合も同様の効果が得られる。FIG. 2 is a sectional view showing a main part of a substrate device according to another embodiment of the present invention. In this embodiment, the relationship between the substrate 6 and the bus bar 1 with respect to the circuit element 3 is opposite to that shown in FIG. The same effect can be obtained in this case as well.
なお、前記基板１はその両面にバスバー１が積層される
ものであってもよく、この場合も同様の効果が得られ
る。The bus bar 1 may be laminated on both surfaces of the substrate 1, and the same effect can be obtained in this case as well.
［発明の効果］ 以上のように、この発明によれば、 この発明における基板装置は、基板とバスバーとがそれ
らの透孔を貫通した導電性かしめターミナルのかしめ部
でかしめ止めされ、そのかしめ部に連続して外方に突出
する端子取付用の螺合部に螺合した締付けねじで前記か
しめターミナルに回路素子にリード端子を締付け固定す
る構成としたので、半田付けや接着剤およびバーリング
加工用の特殊設備等を一切必要とせずに、前記かしめタ
ーミナルと締付けねじだけで、基板とバスバー相互の締
付け固定および回路素子とバスバーの電気的を簡単かつ
確実に行うことができ、生産性の向上およびコストダウ
ンが図れるという効果がある。しかも、前記かしめター
ミナルのかしめ部とバスバーおよび前記かしめターミナ
ルと回路素子のリード端子は共に面接触状態となって締
付け固定されるので、電気的接続および機械的強度の信
頼性が大幅に向上すると共に、電気インピーダンスが低
減し、大電流を流しても何ら問題が生じないという効果
がある。As described above, according to the present invention, in the board device according to the present invention, the board and the bus bar are caulked by the caulking portion of the conductive caulking terminal penetrating their through holes, and the caulking portion thereof is secured. Since the lead terminal is tightened and fixed to the circuit element on the caulked terminal with the tightening screw that is screwed into the screwing part for terminal mounting that continuously protrudes to the outside, it is for soldering, adhesive and burring processing. Without any special equipment etc., it is possible to tighten and fix the board and the bus bar mutually and electrically and easily the circuit element and the bus bar only by the caulking terminal and the tightening screw, improving the productivity. This has the effect of reducing costs. Moreover, since the caulking portion of the caulking terminal and the bus bar, and the caulking terminal and the lead terminal of the circuit element are both brought into surface contact with each other and tightened and fixed, the reliability of electrical connection and mechanical strength is significantly improved. The electric impedance is reduced, and there is no problem even if a large current is passed.
第１図はこの発明の一実施例による基板装置の要部を示
す断面図、第２図はこの発明の他の実施例による基板装
置の要部を示す断面図、第３図は従来の基板装置の要部
を示す断面図、第４図は先行する基板装置の要部を示す
断面図である。 図において、１はバスバー、1aは透孔、３は回路素子、
４はリード端子、4aは締付けねじ、６は基板、6aは透
孔、12はかしめターミナル、12aはかしめ部、12bは雌ね
じ部（螺合部）である。 なお、図中、同一符号は同一または相当部分を示す。FIG. 1 is a sectional view showing an essential part of a substrate device according to an embodiment of the present invention, FIG. 2 is a sectional view showing an essential part of a substrate device according to another embodiment of the present invention, and FIG. 3 is a conventional substrate. FIG. 4 is a sectional view showing an essential part of the apparatus, and FIG. 4 is a sectional view showing an essential part of the preceding substrate device. In the figure, 1 is a bus bar, 1a is a through hole, 3 is a circuit element,
Reference numeral 4 is a lead terminal, 4a is a tightening screw, 6 is a base plate, 6a is a through hole, 12 is a caulking terminal, 12a is a caulking portion, and 12b is a female screw portion (screw portion). In the drawings, the same reference numerals indicate the same or corresponding parts.
Claims (1)
透孔を合致させて積層し、前記バスバーに回路素子を電
気的に接続する基板装置において、前記基板とバスバー
相互の前記透孔を貫通してそれらの基板とバスバーを積
層状態でかしめ止めするかしめ部と、該かしめ部に連続
して外方に突出する端子取付用の螺合部とが一体形成さ
れた導電性のかしめターミナルを備え、前記螺合部に螺
合した締付けねじで前記回路素子のリード端子が前記か
しめターミナルに締め付けられて該かしめターミナルが
前記回路素子のリード端子と前記バスバーとの間の電流
経路を構成していることを特徴とする基板装置。1. A substrate device in which a board and a bus bar are laminated such that through holes provided in the board and the bus bar are aligned with each other, and a circuit element is electrically connected to the bus bar. A conductive caulking terminal is integrally formed with a caulking portion that penetrates through the substrate and the bus bar in a laminated state to prevent caulking, and a screwing portion for terminal mounting that continuously projects outward from the caulking portion. A lead terminal of the circuit element is fastened to the caulking terminal with a tightening screw screwed into the screwing portion, and the caulking terminal forms a current path between the lead terminal of the circuit element and the bus bar. Substrate device characterized in that
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1025329A JPH0760915B2 (en) | 1989-02-03 | 1989-02-03 | Substrate device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1025329A JPH0760915B2 (en) | 1989-02-03 | 1989-02-03 | Substrate device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02205386A JPH02205386A (en) | 1990-08-15 |
| JPH0760915B2 true JPH0760915B2 (en) | 1995-06-28 |
Family
ID=12162904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1025329A Expired - Lifetime JPH0760915B2 (en) | 1989-02-03 | 1989-02-03 | Substrate device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0760915B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2743762B2 (en) * | 1992-09-30 | 1998-04-22 | 三菱電機株式会社 | Large current circuit board |
| DE10211154A1 (en) * | 2002-03-14 | 2003-09-25 | Bosch Gmbh Robert | Termination device for electrical machine e.g. starter motor, has 2 electrically-insulating parts, holder and separate conductive part coupled together in non-detachable manner |
| CN106415933A (en) | 2014-06-16 | 2017-02-15 | 三菱电机株式会社 | Terminal-connection structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52163767U (en) * | 1976-06-04 | 1977-12-12 |
-
1989
- 1989-02-03 JP JP1025329A patent/JPH0760915B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02205386A (en) | 1990-08-15 |
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