JPH0621357B2 - 移送プレート回転装置 - Google Patents

移送プレート回転装置

Info

Publication number
JPH0621357B2
JPH0621357B2 JP60096853A JP9685385A JPH0621357B2 JP H0621357 B2 JPH0621357 B2 JP H0621357B2 JP 60096853 A JP60096853 A JP 60096853A JP 9685385 A JP9685385 A JP 9685385A JP H0621357 B2 JPH0621357 B2 JP H0621357B2
Authority
JP
Japan
Prior art keywords
wafer
transfer
transfer plate
pressure plate
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60096853A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60244711A (ja
Inventor
マーチン・エイ・ハツチンソン
アール・ハワード・シヨー
ジヨージ・コード
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Medical Systems Inc
Original Assignee
Varian Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Associates Inc filed Critical Varian Associates Inc
Publication of JPS60244711A publication Critical patent/JPS60244711A/ja
Publication of JPH0621357B2 publication Critical patent/JPH0621357B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Multi-Process Working Machines And Systems (AREA)
  • Attitude Control For Articles On Conveyors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP60096853A 1984-05-17 1985-05-09 移送プレート回転装置 Expired - Lifetime JPH0621357B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/611,551 US4548699A (en) 1984-05-17 1984-05-17 Transfer plate rotation system
US611551 1984-05-17

Publications (2)

Publication Number Publication Date
JPS60244711A JPS60244711A (ja) 1985-12-04
JPH0621357B2 true JPH0621357B2 (ja) 1994-03-23

Family

ID=24449480

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60096853A Expired - Lifetime JPH0621357B2 (ja) 1984-05-17 1985-05-09 移送プレート回転装置

Country Status (4)

Country Link
US (1) US4548699A (de)
EP (2) EP0344823A3 (de)
JP (1) JPH0621357B2 (de)
DE (1) DE3579622D1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2471883C1 (ru) * 2011-11-23 2013-01-10 Федеральное государственное унитарное предприятие "Научно-производственное предприятие "Исток" (ФГУП НПП "Исток") Устройство для вакуумного нанесения материала

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3413001A1 (de) * 1984-04-06 1985-10-17 Leybold-Heraeus GmbH, 5000 Köln Katodenzerstaeubungsanlage mit nebeneinander angeordneten stationen
JPS6169966A (ja) * 1984-09-14 1986-04-10 Hitachi Ltd 真空処理装置
US4790921A (en) * 1984-10-12 1988-12-13 Hewlett-Packard Company Planetary substrate carrier method and apparatus
JPH07105345B2 (ja) * 1985-08-08 1995-11-13 日電アネルバ株式会社 基体処理装置
US4728863A (en) * 1985-12-04 1988-03-01 Wertheimer Michael R Apparatus and method for plasma treatment of substrates
US4909695A (en) * 1986-04-04 1990-03-20 Materials Research Corporation Method and apparatus for handling and processing wafer-like materials
EP0244950B1 (de) * 1986-04-04 1994-11-09 Materials Research Corporation Verfahren und Vorrichtung zur Handhabung und Behandlung von scheibenartigen Materialien
US4915564A (en) * 1986-04-04 1990-04-10 Materials Research Corporation Method and apparatus for handling and processing wafer-like materials
US4715921A (en) * 1986-10-24 1987-12-29 General Signal Corporation Quad processor
US5102495A (en) * 1986-04-18 1992-04-07 General Signal Corporation Method providing multiple-processing of substrates
US5013385A (en) * 1986-04-18 1991-05-07 General Signal Corporation Quad processor
US5308431A (en) * 1986-04-18 1994-05-03 General Signal Corporation System providing multiple processing of substrates
EP0246453A3 (de) * 1986-04-18 1989-09-06 General Signal Corporation Kontaminierungsfreie Plasma-Ätzvorrichtung mit mehreren Behandlungsstellen
US6103055A (en) * 1986-04-18 2000-08-15 Applied Materials, Inc. System for processing substrates
US4670126A (en) * 1986-04-28 1987-06-02 Varian Associates, Inc. Sputter module for modular wafer processing system
DE3716498C2 (de) * 1987-05-16 1994-08-04 Leybold Ag Vorrichtung zum Ein- und Ausschleusen von Werkstücken in eine Beschichtungskammer
US4851101A (en) * 1987-09-18 1989-07-25 Varian Associates, Inc. Sputter module for modular wafer processing machine
GB8729262D0 (en) * 1987-12-15 1988-01-27 Vg Instr Group Sample treatment apparatus
US4795300A (en) * 1988-01-20 1989-01-03 The Perkin-Elmer Corporation Loading apparatus for a work chamber
US5076205A (en) * 1989-01-06 1991-12-31 General Signal Corporation Modular vapor processor system
DE59001747D1 (de) * 1989-03-30 1993-07-22 Leybold Ag Vorrichtung zum ein- und ausschleusen eines werkstuecks in eine vakuumkammer.
US5259942A (en) * 1989-03-30 1993-11-09 Leybold Aktiengesellschaft Device for transferring a workpiece into and out from a vacuum chamber
DE3912297C2 (de) * 1989-04-14 1996-07-18 Leybold Ag Katodenzerstäubungsanlage
DE3912295C2 (de) * 1989-04-14 1997-05-28 Leybold Ag Katodenzerstäubungsanlage
DE3915039A1 (de) * 1989-05-08 1990-11-15 Balzers Hochvakuum Hubtisch
IT1232241B (it) * 1989-09-11 1992-01-28 Cetev Cent Tecnolog Vuoto Dispositivo per il caricamento veloce di substrati in impianti da vuoto
DE59001807D1 (de) * 1990-03-26 1993-07-22 Leybold Ag Vorrichtung zum ein- und ausschleusen eines werkstuecks in eine vakuumkammer.
JPH07116586B2 (ja) * 1990-05-31 1995-12-13 株式会社芝浦製作所 バルブ機構を備えた配管装置
JP3066507B2 (ja) * 1990-11-30 2000-07-17 日本テキサス・インスツルメンツ株式会社 半導体処理装置
DE4110490C2 (de) * 1991-03-30 2002-02-28 Unaxis Deutschland Holding Kathodenzerstäubungsanlage
US5223112A (en) * 1991-04-30 1993-06-29 Applied Materials, Inc. Removable shutter apparatus for a semiconductor process chamber
AU4652993A (en) 1992-06-26 1994-01-24 Materials Research Corporation Transport system for wafer processing line
US5248371A (en) * 1992-08-13 1993-09-28 General Signal Corporation Hollow-anode glow discharge apparatus
US5482607A (en) * 1992-09-21 1996-01-09 Nissin Electric Co., Ltd. Film forming apparatus
DE4302851A1 (de) * 1993-02-02 1994-08-04 Leybold Ag Vorrichtung zum Anbringen und/oder Entfernen einer Maske an einem Substrat
GB9324002D0 (en) * 1993-11-22 1994-01-12 Electrotech Ltd Processing system
US5753795A (en) * 1996-05-10 1998-05-19 Hewlett-Packard Company Demountable vacuum-sealing plate assembly
JP3704883B2 (ja) * 1997-05-01 2005-10-12 コニカミノルタホールディングス株式会社 有機エレクトロルミネセンス素子及びその製造方法
DE19742923A1 (de) 1997-09-29 1999-04-01 Leybold Systems Gmbh Vorrichtung zum Beschichten eines im wesentlichen flachen, scheibenförmigen Substrats
US6328814B1 (en) 1999-03-26 2001-12-11 Applied Materials, Inc. Apparatus for cleaning and drying substrates
US6413381B1 (en) 2000-04-12 2002-07-02 Steag Hamatech Ag Horizontal sputtering system
US6264804B1 (en) 2000-04-12 2001-07-24 Ske Technology Corp. System and method for handling and masking a substrate in a sputter deposition system
US7513062B2 (en) * 2001-11-02 2009-04-07 Applied Materials, Inc. Single wafer dryer and drying methods
EP1446827A2 (de) * 2001-11-02 2004-08-18 Applied Materials, Inc. Einzelscheibe-trockner und trocknungsverfahren
US7001491B2 (en) * 2003-06-26 2006-02-21 Tokyo Electron Limited Vacuum-processing chamber-shield and multi-chamber pumping method
DE10355683B4 (de) * 2003-11-28 2008-08-14 Singulus Technologies Ag Vakuumschleusenanordnung, Verfahren zum Transportieren eines Objekts mit der Vakuumschleusenanordnung und Verwendung der Vakuumschleusenanordnung zum Beschichten und Reinigen von Objekten
KR100614649B1 (ko) * 2004-07-27 2006-08-23 삼성전자주식회사 웨이퍼 로딩 장치, 이를 이용한 반도체 제조 설비 및웨이퍼 로딩 방법
JP5665679B2 (ja) * 2011-07-14 2015-02-04 住友重機械工業株式会社 不純物導入層形成装置及び静電チャック保護方法
DE102016107990A1 (de) * 2016-04-29 2017-11-02 Von Ardenne Gmbh Vakuumprozesskammer
CN111620086A (zh) * 2020-05-20 2020-09-04 苏州悦力佳智能科技有限公司 一种应用于智慧工业的物料输送装置
CN112366160B (zh) * 2020-11-30 2021-08-20 杭州闻典通讯技术有限公司 一种计算机用节能型usb接口芯片自动生产设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1235463A (fr) * 1959-05-27 1960-07-08 Commissariat Energie Atomique Perfectionnements aux dispositifs pour la production d'un mouvement de rotation discontinu
DE2034213C3 (de) * 1969-10-10 1985-04-25 Ferrofluidics Corp., Burlington, Mass. Magnetdichtung zur Abdichtung von Dichtungsspalten
US3620584A (en) 1970-05-25 1971-11-16 Ferrofluidics Corp Magnetic fluid seals
US3796649A (en) * 1971-12-13 1974-03-12 Varian Associates Coaxial sputtering apparatus
US4274936A (en) * 1979-04-30 1981-06-23 Advanced Coating Technology, Inc. Vacuum deposition system and method
US4311427A (en) * 1979-12-21 1982-01-19 Varian Associates, Inc. Wafer transfer system
US4756815A (en) * 1979-12-21 1988-07-12 Varian Associates, Inc. Wafer coating system
US4416759A (en) * 1981-11-27 1983-11-22 Varian Associates, Inc. Sputter system incorporating an improved blocking shield for contouring the thickness of sputter coated layers

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2471883C1 (ru) * 2011-11-23 2013-01-10 Федеральное государственное унитарное предприятие "Научно-производственное предприятие "Исток" (ФГУП НПП "Исток") Устройство для вакуумного нанесения материала

Also Published As

Publication number Publication date
EP0161928A2 (de) 1985-11-21
EP0161928A3 (en) 1987-10-28
EP0344823A2 (de) 1989-12-06
EP0161928B1 (de) 1990-09-12
EP0344823A3 (de) 1990-01-03
US4548699A (en) 1985-10-22
JPS60244711A (ja) 1985-12-04
DE3579622D1 (de) 1990-10-18

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