JPH0611534Y2 - 多層印刷配線板 - Google Patents
多層印刷配線板Info
- Publication number
- JPH0611534Y2 JPH0611534Y2 JP3386488U JP3386488U JPH0611534Y2 JP H0611534 Y2 JPH0611534 Y2 JP H0611534Y2 JP 3386488 U JP3386488 U JP 3386488U JP 3386488 U JP3386488 U JP 3386488U JP H0611534 Y2 JPH0611534 Y2 JP H0611534Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- multilayer printed
- board
- inner layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005476 soldering Methods 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 239000011889 copper foil Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 4
- 238000011179 visual inspection Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3386488U JPH0611534Y2 (ja) | 1988-03-14 | 1988-03-14 | 多層印刷配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3386488U JPH0611534Y2 (ja) | 1988-03-14 | 1988-03-14 | 多層印刷配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01137572U JPH01137572U (en, 2012) | 1989-09-20 |
| JPH0611534Y2 true JPH0611534Y2 (ja) | 1994-03-23 |
Family
ID=31260569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3386488U Expired - Lifetime JPH0611534Y2 (ja) | 1988-03-14 | 1988-03-14 | 多層印刷配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0611534Y2 (en, 2012) |
-
1988
- 1988-03-14 JP JP3386488U patent/JPH0611534Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01137572U (en, 2012) | 1989-09-20 |
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