JPH01137572U - - Google Patents
Info
- Publication number
- JPH01137572U JPH01137572U JP3386488U JP3386488U JPH01137572U JP H01137572 U JPH01137572 U JP H01137572U JP 3386488 U JP3386488 U JP 3386488U JP 3386488 U JP3386488 U JP 3386488U JP H01137572 U JPH01137572 U JP H01137572U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- multilayer printed
- wiring board
- conductor layer
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims 3
- 239000000463 material Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3386488U JPH0611534Y2 (ja) | 1988-03-14 | 1988-03-14 | 多層印刷配線板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3386488U JPH0611534Y2 (ja) | 1988-03-14 | 1988-03-14 | 多層印刷配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01137572U true JPH01137572U (en, 2012) | 1989-09-20 |
JPH0611534Y2 JPH0611534Y2 (ja) | 1994-03-23 |
Family
ID=31260569
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3386488U Expired - Lifetime JPH0611534Y2 (ja) | 1988-03-14 | 1988-03-14 | 多層印刷配線板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0611534Y2 (en, 2012) |
-
1988
- 1988-03-14 JP JP3386488U patent/JPH0611534Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0611534Y2 (ja) | 1994-03-23 |