JPH0584214B2 - - Google Patents
Info
- Publication number
- JPH0584214B2 JPH0584214B2 JP61002700A JP270086A JPH0584214B2 JP H0584214 B2 JPH0584214 B2 JP H0584214B2 JP 61002700 A JP61002700 A JP 61002700A JP 270086 A JP270086 A JP 270086A JP H0584214 B2 JPH0584214 B2 JP H0584214B2
- Authority
- JP
- Japan
- Prior art keywords
- thermoplastic resin
- heat
- core plate
- resin
- fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP270086A JPS62160234A (ja) | 1986-01-09 | 1986-01-09 | 金属複合積層板の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP270086A JPS62160234A (ja) | 1986-01-09 | 1986-01-09 | 金属複合積層板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62160234A JPS62160234A (ja) | 1987-07-16 |
JPH0584214B2 true JPH0584214B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-12-01 |
Family
ID=11536557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP270086A Granted JPS62160234A (ja) | 1986-01-09 | 1986-01-09 | 金属複合積層板の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62160234A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2508737B2 (ja) * | 1987-07-28 | 1996-06-19 | 三菱樹脂株式会社 | 金属複合積層板 |
JPS6473695A (en) * | 1987-09-14 | 1989-03-17 | Mitsubishi Plastics Ind | Substrate for printed-circuit board |
CN116945739A (zh) * | 2023-05-08 | 2023-10-27 | 北京机科国创轻量化科学研究院有限公司 | 一种逆向蜂窝夹层结构的纤维-金属混杂层板及制备方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5512754A (en) * | 1978-07-13 | 1980-01-29 | Nec Corp | Semiconductor device manufacturing method |
JPS60236295A (ja) * | 1984-05-10 | 1985-11-25 | 松下電工株式会社 | 金属ベ−ス配線基板 |
-
1986
- 1986-01-09 JP JP270086A patent/JPS62160234A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS62160234A (ja) | 1987-07-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4769270A (en) | Substrate for a printed circuit board | |
JPH09289128A (ja) | プリントコイル用多層板の製造方法 | |
JPH0584214B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
JPH08157621A (ja) | プリプレグ並びにこれを用いたプリント基板及びカバーレイフィルム | |
JP2501331B2 (ja) | 積層板 | |
JPH084195B2 (ja) | 多層プリント配線板 | |
JPH05291711A (ja) | 高周波回路用基板 | |
JPH02244786A (ja) | プリント回路用複合基板 | |
JP2508737B2 (ja) | 金属複合積層板 | |
JPH01313998A (ja) | 金属複合積層板の製造方法 | |
JPH04171796A (ja) | 低誘電率配線基板 | |
JP3299501B2 (ja) | 積層板成形用プレート及び積層板 | |
JPH07117174A (ja) | 金属箔張り積層板及びその製造方法 | |
JPH0219989B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
JPH0815235B2 (ja) | 多層プリント配線板 | |
JPH0564879B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
JPS62295930A (ja) | 積層板の製造方法 | |
JPH04291782A (ja) | 電気用金属張積層板 | |
JPH0716089B2 (ja) | 電気用積層板 | |
JPH0334677B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
JPS63290736A (ja) | 積層板 | |
JPS63199245A (ja) | 積層板 | |
JPH06260764A (ja) | 多層配線基板及び多層配線板の製造方法 | |
JPH05315718A (ja) | 電気用積層板 | |
JPH04291784A (ja) | 電気用金属張積層板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |