JPH0582996B2 - - Google Patents
Info
- Publication number
- JPH0582996B2 JPH0582996B2 JP60261647A JP26164785A JPH0582996B2 JP H0582996 B2 JPH0582996 B2 JP H0582996B2 JP 60261647 A JP60261647 A JP 60261647A JP 26164785 A JP26164785 A JP 26164785A JP H0582996 B2 JPH0582996 B2 JP H0582996B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- copper foil
- light transmittance
- clad laminate
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 25
- 239000011889 copper foil Substances 0.000 claims description 23
- 238000002834 transmittance Methods 0.000 claims description 19
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 230000003746 surface roughness Effects 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- 229920002799 BoPET Polymers 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910001872 inorganic gas Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26164785A JPS62122193A (ja) | 1985-11-21 | 1985-11-21 | フレキシブル銅張り積層板 |
| US06/928,396 US4806432A (en) | 1985-11-21 | 1986-11-10 | Copper-foiled laminated sheet for flexible printed circuit board |
| DE8686402584T DE3677714D1 (de) | 1985-11-21 | 1986-11-20 | Mit kupferfolie laminierte platte fuer biegsame gedruckte leiterplatte. |
| EP19860402584 EP0223716B1 (fr) | 1985-11-21 | 1986-11-20 | Laminé comportant une feuille de cuivre pour plaque de circuit imprimé flexible |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26164785A JPS62122193A (ja) | 1985-11-21 | 1985-11-21 | フレキシブル銅張り積層板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62122193A JPS62122193A (ja) | 1987-06-03 |
| JPH0582996B2 true JPH0582996B2 (fr) | 1993-11-24 |
Family
ID=17364805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26164785A Granted JPS62122193A (ja) | 1985-11-21 | 1985-11-21 | フレキシブル銅張り積層板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62122193A (fr) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5756547B1 (ja) * | 2014-04-28 | 2015-07-29 | 株式会社Ｓｈカッパープロダクツ | 表面処理銅箔及び積層板 |
| JP5695253B1 (ja) * | 2014-06-23 | 2015-04-01 | 株式会社Ｓｈカッパープロダクツ | 銅張積層板および該銅張積層板を用いたフレキシブルプリント配線板 |
| JP5732181B1 (ja) * | 2015-02-05 | 2015-06-10 | 株式会社Ｓｈカッパープロダクツ | 銅張積層板および該銅張積層板を用いたフレキシブルプリント配線板 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55132095A (en) * | 1979-04-02 | 1980-10-14 | Kazuo Terada | Method of fabricating printed board |
| JPS59205791A (ja) * | 1983-05-09 | 1984-11-21 | 住友電気工業株式会社 | 透明性プリント回路基板 |
| JPS6027402A (ja) * | 1983-07-23 | 1985-02-12 | Nippon Kokan Kk <Nkk> | 圧延鋼箔 |
-
1985
- 1985-11-21 JP JP26164785A patent/JPS62122193A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55132095A (en) * | 1979-04-02 | 1980-10-14 | Kazuo Terada | Method of fabricating printed board |
| JPS59205791A (ja) * | 1983-05-09 | 1984-11-21 | 住友電気工業株式会社 | 透明性プリント回路基板 |
| JPS6027402A (ja) * | 1983-07-23 | 1985-02-12 | Nippon Kokan Kk <Nkk> | 圧延鋼箔 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62122193A (ja) | 1987-06-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |