JPH0582981B2 - - Google Patents
Info
- Publication number
- JPH0582981B2 JPH0582981B2 JP61163032A JP16303286A JPH0582981B2 JP H0582981 B2 JPH0582981 B2 JP H0582981B2 JP 61163032 A JP61163032 A JP 61163032A JP 16303286 A JP16303286 A JP 16303286A JP H0582981 B2 JPH0582981 B2 JP H0582981B2
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- lead frame
- lead
- size
- internal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H10W70/413—
-
- H10W72/5449—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61163032A JPS6318652A (ja) | 1986-07-11 | 1986-07-11 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61163032A JPS6318652A (ja) | 1986-07-11 | 1986-07-11 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6318652A JPS6318652A (ja) | 1988-01-26 |
| JPH0582981B2 true JPH0582981B2 (cg-RX-API-DMAC10.html) | 1993-11-24 |
Family
ID=15765889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61163032A Granted JPS6318652A (ja) | 1986-07-11 | 1986-07-11 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6318652A (cg-RX-API-DMAC10.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0653400A (ja) * | 1992-07-28 | 1994-02-25 | Nec Corp | リードフレーム |
| JP2809206B2 (ja) | 1995-06-26 | 1998-10-08 | 松下電器産業株式会社 | 光ディスク記録再生方法及び光ディスク装置 |
| KR19980067079A (ko) * | 1997-01-31 | 1998-10-15 | 이대원 | 트랜지스터용 리드프레임 제조방법 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4141712A (en) * | 1977-07-18 | 1979-02-27 | Diacon Inc. | Manufacturing process for package for electronic devices |
| JPS6095941A (ja) * | 1983-10-31 | 1985-05-29 | Toshiba Corp | 半導体装置 |
-
1986
- 1986-07-11 JP JP61163032A patent/JPS6318652A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6318652A (ja) | 1988-01-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |