JPH0670236U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH0670236U
JPH0670236U JP023392U JP2339292U JPH0670236U JP H0670236 U JPH0670236 U JP H0670236U JP 023392 U JP023392 U JP 023392U JP 2339292 U JP2339292 U JP 2339292U JP H0670236 U JPH0670236 U JP H0670236U
Authority
JP
Japan
Prior art keywords
plate
electrode plate
external electrode
semiconductor element
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP023392U
Other languages
English (en)
Inventor
直志 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to JP023392U priority Critical patent/JPH0670236U/ja
Publication of JPH0670236U publication Critical patent/JPH0670236U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/3701—Shape
    • H01L2224/37011—Shape comprising apertures or cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/37099—Material
    • H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/4005—Shape
    • H01L2224/4009—Loop shape
    • H01L2224/40095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/40247—Connecting the strap to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/40247—Connecting the strap to a bond pad of the item
    • H01L2224/40249—Connecting the strap to a bond pad of the item the bond pad protruding from the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/8438—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/84385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/848—Bonding techniques
    • H01L2224/84801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】 （修正有） 【目的】 高低関係に配置された半導体素子と外部リ−
ド線を接続する接続板の位置ずれを防止する。 【構成】 接続板の外部電極板との接続面に孔を設け、
又、外部電極板の前記接続板との接続面に突起部を設け
該接続板の接続面を該孔を介して突起部に載置するよう
に構成する。

Description

【考案の詳細な説明】
【０００１】
【考案の属する分野の説明】
本考案は半導体素子と外部リ−ド線とを接続する接続板を有する半導体装置 の構造に関するものである。
【０００２】
【従来技術とその問題点】
従来この種の半導体装置は、ベ−ス電極板を形成するリ−ドフレ−ム上の半 導体素子搭載部と、外部電極板となるリ−ドフレ−ム上の接続板搭載部にク リ−ム半田、もしくは半田ペレットを配置し、この上に半導体素子、接続板 を配置させ、加熱により半田付けを行っていた。図１は従来の構造、図２は 図１の断面図であり、１は半導体素子、２は金属接続板、３はリ−ドフレ− ムの半導体素子搭載部、４はリ−ドフレ−ムの接続板搭載部である。なお、 同一符号は同一部分を表し以下の図面でも同様とする。
【０００３】 しかして半導体素子１、金属接続板２をリ−ドフレ−ム上の正規な位置に配 置した後加熱により半田付けした場合は、図１に示すような良好な半田付け 状態が得られる。しかし、金属接続板２が正規の位置に配置されない場合、 また搬送中の振動などにより図３、図４のように金属接続板の位置がずれた 場合は、良好な半田付け性は得られず、オ−プン、ル−ズコンタクト等歩留 （２） まり低下の原因となっていた。
【０００４】
【考案の目的】
オ−プン、ル−ズコンタクト等の無い半導体装置を提供することである。
【０００５】
【課題を解決するための本考案の手段】
本考案はベ−ス電極板と、前記ベ−ス電極板上に一方の電極部が接着された 半導体素子と、前記半導体素子の他方の電極部と外部電極板とを夫々半田付 する略断面Ｌ字状接続板を有する半導体装置において、前記接続板の外部電 極板との接続面に孔を設け、又、外部電極板の前記接続板との接続面に突起 部を設け該接続板の接続面を該孔を介して突起部に載置するように構成した ものである。
【０００６】
【実施例】
図５は本考案の実施例、図６は図５の断面図であり、５は略断面Ｌ字状接続 板に設けた穴、６は外部電極板４（リ−ドフレ−ム）に設けた突起部である。 まず、金属接続板２のリ−ドフレ−ム半田付け部に孔５を設ける。この孔５ は、半田付け部の大きさにより適正な大きさとし、打ち抜きまたはエッチン グ等により形成する。 次に外部電極板４の接続板半田付け部に突起部６を設ける。この突起は、上 記穴より小さくその高さも接続板２がずれない程度とし、打ち出し等により 形成する。 製造方法としては、ベ−ス電極板３の半導体素子搭載位置と、金属接続板搭 載位置にクリ−ム半田を印刷し、半導体素子１を搭載後、接続板２を搭載す る。この後加熱により半田付けを行う。
【０００７】
【考案の効果】
以上の説明から明らかなように本考案によれば半導体素子１と高低関係に配 （３） 置された外部電極板４を略断面Ｌ字状接続板２により接続する場合に、金属 接続板２のずれを防止し、オ−プン、ル−コン等がない半田付けが可能とな り、歩留まりが向上した。
【図面の簡単な説明】
【図１】従来構造図
【図２】図１の断面図
【図３】従来装置の説明図
【図４】従来装置の説明図
【図５】本考案の一実施例構造図
【図６】図５の断面図
【符号説明】
１ 半導体素子 ２ 金属接続板 ３ ベ−ス電極板の半導体素子搭載部 ４ 外部電極板の接続板搭載部 ５ 接続板の孔 ６ 外部電極板の突起部

Claims (1)

    【実用新案登録請求の範囲】
  1. 【請求項１】 ベ−ス電極板と、前記ベ−ス電極板上に
    一方の電極部が接着された半導体素子と、前記半導体素
    子の他方の電極部と外部電極板とを夫々半田付する略断
    面Ｌ字状接続板を有する半導体装置において、前記接続
    板の外部電極板との接続面に孔を設け、又、外部電極板
    の前記接続板との接続面に突起部を設けたことを特徴と
    する半導体装置。
JP023392U 1992-03-19 1992-03-19 半導体装置 Pending JPH0670236U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP023392U JPH0670236U (ja) 1992-03-19 1992-03-19 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP023392U JPH0670236U (ja) 1992-03-19 1992-03-19 半導体装置

Publications (1)

Publication Number Publication Date
JPH0670236U true JPH0670236U (ja) 1994-09-30

Family

ID=12109241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP023392U Pending JPH0670236U (ja) 1992-03-19 1992-03-19 半導体装置

Country Status (1)

Country Link
JP (1) JPH0670236U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012169477A (ja) * 2011-02-15 2012-09-06 Shindengen Electric Mfg Co Ltd 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012169477A (ja) * 2011-02-15 2012-09-06 Shindengen Electric Mfg Co Ltd 半導体装置

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