JPH0582868B2 - - Google Patents

Info

Publication number
JPH0582868B2
JPH0582868B2 JP60243594A JP24359485A JPH0582868B2 JP H0582868 B2 JPH0582868 B2 JP H0582868B2 JP 60243594 A JP60243594 A JP 60243594A JP 24359485 A JP24359485 A JP 24359485A JP H0582868 B2 JPH0582868 B2 JP H0582868B2
Authority
JP
Japan
Prior art keywords
sensitive adhesive
pressure
layer
semiconductor wafer
surface layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60243594A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62101677A (ja
Inventor
Takemasa Uemura
Seishiro Matsuzaki
Yoshinari Satoda
Eiji Shigemura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP60243594A priority Critical patent/JPS62101677A/ja
Publication of JPS62101677A publication Critical patent/JPS62101677A/ja
Publication of JPH0582868B2 publication Critical patent/JPH0582868B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP60243594A 1985-10-30 1985-10-30 半導体ウエハの保護部材 Granted JPS62101677A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60243594A JPS62101677A (ja) 1985-10-30 1985-10-30 半導体ウエハの保護部材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60243594A JPS62101677A (ja) 1985-10-30 1985-10-30 半導体ウエハの保護部材

Publications (2)

Publication Number Publication Date
JPS62101677A JPS62101677A (ja) 1987-05-12
JPH0582868B2 true JPH0582868B2 (enExample) 1993-11-22

Family

ID=17106137

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60243594A Granted JPS62101677A (ja) 1985-10-30 1985-10-30 半導体ウエハの保護部材

Country Status (1)

Country Link
JP (1) JPS62101677A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6235387B1 (en) 1998-03-30 2001-05-22 3M Innovative Properties Company Semiconductor wafer processing tapes
JP5428149B2 (ja) * 2007-11-19 2014-02-26 富士電機株式会社 半導体素子の製造方法
CN105778833A (zh) * 2016-03-21 2016-07-20 苏州华周胶带有限公司 一种用于压敏胶带的压敏胶

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52114632A (en) * 1976-03-22 1977-09-26 Sekisui Chem Co Ltd Pressure sensitive adhesive tape or sheet
JPS57141475A (en) * 1981-02-25 1982-09-01 Nitto Electric Ind Co Ltd Surface-protective adhesive sheet
DE3374944D1 (en) * 1982-11-04 1988-01-28 Minnesota Mining & Mfg Removable pressure-sensitive adhesive tape

Also Published As

Publication number Publication date
JPS62101677A (ja) 1987-05-12

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term