JPS57141475A - Surface-protective adhesive sheet - Google Patents

Surface-protective adhesive sheet

Info

Publication number
JPS57141475A
JPS57141475A JP2740981A JP2740981A JPS57141475A JP S57141475 A JPS57141475 A JP S57141475A JP 2740981 A JP2740981 A JP 2740981A JP 2740981 A JP2740981 A JP 2740981A JP S57141475 A JPS57141475 A JP S57141475A
Authority
JP
Japan
Prior art keywords
adhesive
sheet
sputter etching
paste
expelled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2740981A
Other languages
Japanese (ja)
Inventor
Haruo Tabata
Kazuaki Sasa
Suguru Yamamoto
Akio Tsumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP2740981A priority Critical patent/JPS57141475A/en
Publication of JPS57141475A publication Critical patent/JPS57141475A/en
Pending legal-status Critical Current

Links

Landscapes

  • Adhesive Tapes (AREA)

Abstract

PURPOSE: To obtain the titled sheet enhanced in releasability and reduced in an amt. of residual paste, by subjecting the surface of an adhesive in said sheet to high-frequency sputter etching.
CONSTITUTION: The surface of an adhesive in a surface-protective adhesive sheet is subjected to high-frequency sputter etching, whereby an atom and molecule in the polymer constituting the adhesive is expelled by collision with a cation, which reduces thickness of the adhesive and crosslinks the activated polymer. If a low-molecular component causing the remaining of the paste is produced on the surface of the adhesive, it is expelled from the adhesive during the sputter etching, so that it does not remain in the adhesive. Therefore, the adhesion of said sheet is substantially constant without remarkable enhancement, and no paste remains on an adhered surface after release because of the absence of any low-molecular component.
COPYRIGHT: (C)1982,JPO&Japio
JP2740981A 1981-02-25 1981-02-25 Surface-protective adhesive sheet Pending JPS57141475A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2740981A JPS57141475A (en) 1981-02-25 1981-02-25 Surface-protective adhesive sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2740981A JPS57141475A (en) 1981-02-25 1981-02-25 Surface-protective adhesive sheet

Publications (1)

Publication Number Publication Date
JPS57141475A true JPS57141475A (en) 1982-09-01

Family

ID=12220279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2740981A Pending JPS57141475A (en) 1981-02-25 1981-02-25 Surface-protective adhesive sheet

Country Status (1)

Country Link
JP (1) JPS57141475A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62101677A (en) * 1985-10-30 1987-05-12 Nitto Electric Ind Co Ltd Protective member for semiconductor wafer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62101677A (en) * 1985-10-30 1987-05-12 Nitto Electric Ind Co Ltd Protective member for semiconductor wafer
JPH0582868B2 (en) * 1985-10-30 1993-11-22 Nitto Denko Corp

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