JPH0582293B2 - - Google Patents

Info

Publication number
JPH0582293B2
JPH0582293B2 JP60078874A JP7887485A JPH0582293B2 JP H0582293 B2 JPH0582293 B2 JP H0582293B2 JP 60078874 A JP60078874 A JP 60078874A JP 7887485 A JP7887485 A JP 7887485A JP H0582293 B2 JPH0582293 B2 JP H0582293B2
Authority
JP
Japan
Prior art keywords
epoxy resin
metal foil
adhesive
bisphenol
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60078874A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61235145A (ja
Inventor
Yasuo Fushiki
Minoru Itsushiki
Koji Nakano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanegafuchi Chemical Industry Co Ltd
Original Assignee
Kanegafuchi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanegafuchi Chemical Industry Co Ltd filed Critical Kanegafuchi Chemical Industry Co Ltd
Priority to JP7887485A priority Critical patent/JPS61235145A/ja
Publication of JPS61235145A publication Critical patent/JPS61235145A/ja
Publication of JPH0582293B2 publication Critical patent/JPH0582293B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Laminated Bodies (AREA)
JP7887485A 1985-04-12 1985-04-12 金属箔張り積層板およびその製造法 Granted JPS61235145A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7887485A JPS61235145A (ja) 1985-04-12 1985-04-12 金属箔張り積層板およびその製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7887485A JPS61235145A (ja) 1985-04-12 1985-04-12 金属箔張り積層板およびその製造法

Publications (2)

Publication Number Publication Date
JPS61235145A JPS61235145A (ja) 1986-10-20
JPH0582293B2 true JPH0582293B2 (enrdf_load_stackoverflow) 1993-11-18

Family

ID=13673964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7887485A Granted JPS61235145A (ja) 1985-04-12 1985-04-12 金属箔張り積層板およびその製造法

Country Status (1)

Country Link
JP (1) JPS61235145A (enrdf_load_stackoverflow)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56122825A (en) * 1980-03-03 1981-09-26 Matsushita Electric Works Ltd Epoxy resin composition for laminate
JPS57195120A (en) * 1981-05-27 1982-11-30 Asahi Denka Kogyo Kk Epoxy resin composition

Also Published As

Publication number Publication date
JPS61235145A (ja) 1986-10-20

Similar Documents

Publication Publication Date Title
US5718039A (en) Method of making multilayer printed wiring board
US5674611A (en) Adhesive for copper foils and an adhesive-applied copper foil
US3600263A (en) Metal clad laminates
JPH0582293B2 (enrdf_load_stackoverflow)
JPH0442416B2 (enrdf_load_stackoverflow)
JPH03296587A (ja) 銅張積層板用接着剤
CN114539958A (zh) 一种挠性覆铜板用覆盖膜的胶粘剂及其制备方法和应用
JPS61214495A (ja) 積層板を被覆するための結合剤層を有する金属箔及び印刷回路用基材の製造方法
JP3125582B2 (ja) 金属箔張り積層板の製造法
JPS61227041A (ja) 金属箔張り積層板およびその製造法
JP2000218734A (ja) 金属箔張積層板の製造方法
JPH11172025A (ja) プリント配線板用プリプレグ及びそれを用いた金属箔張積層板
JPH06143448A (ja) 積層板の製造方法
JPH05138807A (ja) 銅張積層板の製造法
JP4759896B2 (ja) プリント配線板製造用材料の製造方法
JP2755158B2 (ja) カバーレイフィルム
JPS59170115A (ja) 難燃性液状エポキシ樹脂組成物およびそれを用いる電気用積層板の製造法
JPH07336054A (ja) 多層プリント配線板用層間絶縁樹脂材料及び多層プリント配線板の製造方法
JPH0477589A (ja) フレキシブルプリント配線基板と補強板との接着方法
JPH04197717A (ja) 電気用積層板の製造方法
JPS61179221A (ja) ガラス・エポキシ銅張積層板
JPS6092844A (ja) 電気用積層板および金属箔張り積層板
JPH06256966A (ja) 表面処理された銅箔
JPH05293928A (ja) 柔軟なポリエーテルイミドシートに銅箔を接着するためのポリエーテルイミド／ジメチルシロキサン共重合体接着剤
JP2005243830A (ja) プリント配線板