JPS61235145A - 金属箔張り積層板およびその製造法 - Google Patents

金属箔張り積層板およびその製造法

Info

Publication number
JPS61235145A
JPS61235145A JP7887485A JP7887485A JPS61235145A JP S61235145 A JPS61235145 A JP S61235145A JP 7887485 A JP7887485 A JP 7887485A JP 7887485 A JP7887485 A JP 7887485A JP S61235145 A JPS61235145 A JP S61235145A
Authority
JP
Japan
Prior art keywords
metal foil
epoxy resin
bisphenol
laminate
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7887485A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0582293B2 (enrdf_load_stackoverflow
Inventor
八洲男 伏木
実 一色
中野　弘司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanegafuchi Chemical Industry Co Ltd
Original Assignee
Kanegafuchi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanegafuchi Chemical Industry Co Ltd filed Critical Kanegafuchi Chemical Industry Co Ltd
Priority to JP7887485A priority Critical patent/JPS61235145A/ja
Publication of JPS61235145A publication Critical patent/JPS61235145A/ja
Publication of JPH0582293B2 publication Critical patent/JPH0582293B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Laminated Bodies (AREA)
JP7887485A 1985-04-12 1985-04-12 金属箔張り積層板およびその製造法 Granted JPS61235145A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7887485A JPS61235145A (ja) 1985-04-12 1985-04-12 金属箔張り積層板およびその製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7887485A JPS61235145A (ja) 1985-04-12 1985-04-12 金属箔張り積層板およびその製造法

Publications (2)

Publication Number Publication Date
JPS61235145A true JPS61235145A (ja) 1986-10-20
JPH0582293B2 JPH0582293B2 (enrdf_load_stackoverflow) 1993-11-18

Family

ID=13673964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7887485A Granted JPS61235145A (ja) 1985-04-12 1985-04-12 金属箔張り積層板およびその製造法

Country Status (1)

Country Link
JP (1) JPS61235145A (enrdf_load_stackoverflow)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56122825A (en) * 1980-03-03 1981-09-26 Matsushita Electric Works Ltd Epoxy resin composition for laminate
JPS57195120A (en) * 1981-05-27 1982-11-30 Asahi Denka Kogyo Kk Epoxy resin composition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56122825A (en) * 1980-03-03 1981-09-26 Matsushita Electric Works Ltd Epoxy resin composition for laminate
JPS57195120A (en) * 1981-05-27 1982-11-30 Asahi Denka Kogyo Kk Epoxy resin composition

Also Published As

Publication number Publication date
JPH0582293B2 (enrdf_load_stackoverflow) 1993-11-18

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