JPH0576185B2 - - Google Patents

Info

Publication number
JPH0576185B2
JPH0576185B2 JP58044791A JP4479183A JPH0576185B2 JP H0576185 B2 JPH0576185 B2 JP H0576185B2 JP 58044791 A JP58044791 A JP 58044791A JP 4479183 A JP4479183 A JP 4479183A JP H0576185 B2 JPH0576185 B2 JP H0576185B2
Authority
JP
Japan
Prior art keywords
inspection
wire
output
end point
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58044791A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59171129A (ja
Inventor
Masahito Nakajima
Hiroyuki Tsukahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58044791A priority Critical patent/JPS59171129A/ja
Publication of JPS59171129A publication Critical patent/JPS59171129A/ja
Publication of JPH0576185B2 publication Critical patent/JPH0576185B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/075—
    • H10W72/07531—
    • H10W72/50—
    • H10W72/5449—
    • H10W72/932—
    • H10W90/756—

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP58044791A 1983-03-17 1983-03-17 自動配線検査装置 Granted JPS59171129A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58044791A JPS59171129A (ja) 1983-03-17 1983-03-17 自動配線検査装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58044791A JPS59171129A (ja) 1983-03-17 1983-03-17 自動配線検査装置

Publications (2)

Publication Number Publication Date
JPS59171129A JPS59171129A (ja) 1984-09-27
JPH0576185B2 true JPH0576185B2 (index.php) 1993-10-22

Family

ID=12701235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58044791A Granted JPS59171129A (ja) 1983-03-17 1983-03-17 自動配線検査装置

Country Status (1)

Country Link
JP (1) JPS59171129A (index.php)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2689505B2 (ja) * 1988-08-03 1997-12-10 日本電気株式会社 ボンディングワイヤの形状検査装置
JPH07111998B2 (ja) * 1989-08-18 1995-11-29 株式会社東芝 ワイヤボンディング検査装置
JP2851151B2 (ja) * 1990-10-12 1999-01-27 株式会社東芝 ワイヤボンディング検査装置
CN103091339A (zh) * 2013-03-01 2013-05-08 苏州爱特盟光电有限公司 一种用于键合工艺微缺陷检测的方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57155743A (en) * 1981-03-20 1982-09-25 Fujitsu Ltd Inspection device for semiconductor bonding wire
JP2830091B2 (ja) * 1989-07-04 1998-12-02 住友金属工業株式会社 高温での弾性率低下の少ない鉄骨建築用鋼材の製造方法

Also Published As

Publication number Publication date
JPS59171129A (ja) 1984-09-27

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