JPH0573789B2 - - Google Patents

Info

Publication number
JPH0573789B2
JPH0573789B2 JP30892686A JP30892686A JPH0573789B2 JP H0573789 B2 JPH0573789 B2 JP H0573789B2 JP 30892686 A JP30892686 A JP 30892686A JP 30892686 A JP30892686 A JP 30892686A JP H0573789 B2 JPH0573789 B2 JP H0573789B2
Authority
JP
Japan
Prior art keywords
resist
component
organic solvent
montmorillonite
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP30892686A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63162775A (ja
Inventor
Masao Kawashima
Tsuyoshi Kobayashi
Ichiro Akutagawa
Ryuichi Fujii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Somar Corp
Original Assignee
Somar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Somar Corp filed Critical Somar Corp
Priority to JP61308926A priority Critical patent/JPS63162775A/ja
Publication of JPS63162775A publication Critical patent/JPS63162775A/ja
Publication of JPH0573789B2 publication Critical patent/JPH0573789B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

Landscapes

  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Chemically Coating (AREA)
JP61308926A 1986-12-26 1986-12-26 無電解メツキ用レジストインキ Granted JPS63162775A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61308926A JPS63162775A (ja) 1986-12-26 1986-12-26 無電解メツキ用レジストインキ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61308926A JPS63162775A (ja) 1986-12-26 1986-12-26 無電解メツキ用レジストインキ

Publications (2)

Publication Number Publication Date
JPS63162775A JPS63162775A (ja) 1988-07-06
JPH0573789B2 true JPH0573789B2 (cg-RX-API-DMAC7.html) 1993-10-15

Family

ID=17986939

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61308926A Granted JPS63162775A (ja) 1986-12-26 1986-12-26 無電解メツキ用レジストインキ

Country Status (1)

Country Link
JP (1) JPS63162775A (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100601091B1 (ko) * 2004-05-11 2006-07-14 주식회사 엘지화학 동박적층판용 에폭시 수지 조성물
JP2012256636A (ja) * 2011-06-07 2012-12-27 Taiyo Holdings Co Ltd めっきレジスト用樹脂組成物および多層プリント配線板

Also Published As

Publication number Publication date
JPS63162775A (ja) 1988-07-06

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees