JPS63162775A - 無電解メツキ用レジストインキ - Google Patents

無電解メツキ用レジストインキ

Info

Publication number
JPS63162775A
JPS63162775A JP61308926A JP30892686A JPS63162775A JP S63162775 A JPS63162775 A JP S63162775A JP 61308926 A JP61308926 A JP 61308926A JP 30892686 A JP30892686 A JP 30892686A JP S63162775 A JPS63162775 A JP S63162775A
Authority
JP
Japan
Prior art keywords
component
resist ink
resist
organic
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61308926A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0573789B2 (cg-RX-API-DMAC7.html
Inventor
Masao Kawashima
川島　征夫
Tsuyoshi Kobayashi
強 小林
Ichiro Akutagawa
芥川　一郎
Ryuichi Fujii
隆一 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Somar Corp
Original Assignee
Somar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Somar Corp filed Critical Somar Corp
Priority to JP61308926A priority Critical patent/JPS63162775A/ja
Publication of JPS63162775A publication Critical patent/JPS63162775A/ja
Publication of JPH0573789B2 publication Critical patent/JPH0573789B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

Landscapes

  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Chemically Coating (AREA)
JP61308926A 1986-12-26 1986-12-26 無電解メツキ用レジストインキ Granted JPS63162775A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61308926A JPS63162775A (ja) 1986-12-26 1986-12-26 無電解メツキ用レジストインキ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61308926A JPS63162775A (ja) 1986-12-26 1986-12-26 無電解メツキ用レジストインキ

Publications (2)

Publication Number Publication Date
JPS63162775A true JPS63162775A (ja) 1988-07-06
JPH0573789B2 JPH0573789B2 (cg-RX-API-DMAC7.html) 1993-10-15

Family

ID=17986939

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61308926A Granted JPS63162775A (ja) 1986-12-26 1986-12-26 無電解メツキ用レジストインキ

Country Status (1)

Country Link
JP (1) JPS63162775A (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005108488A1 (en) * 2004-05-11 2005-11-17 Lg Chem, Ltd. Epoxy resin composition for copper clad laminate
WO2012169384A1 (ja) * 2011-06-07 2012-12-13 太陽ホールディングス株式会社 めっきレジスト用樹脂組成物および多層プリント配線板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005108488A1 (en) * 2004-05-11 2005-11-17 Lg Chem, Ltd. Epoxy resin composition for copper clad laminate
WO2012169384A1 (ja) * 2011-06-07 2012-12-13 太陽ホールディングス株式会社 めっきレジスト用樹脂組成物および多層プリント配線板

Also Published As

Publication number Publication date
JPH0573789B2 (cg-RX-API-DMAC7.html) 1993-10-15

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees