JPH0573359B2 - - Google Patents

Info

Publication number
JPH0573359B2
JPH0573359B2 JP62260087A JP26008787A JPH0573359B2 JP H0573359 B2 JPH0573359 B2 JP H0573359B2 JP 62260087 A JP62260087 A JP 62260087A JP 26008787 A JP26008787 A JP 26008787A JP H0573359 B2 JPH0573359 B2 JP H0573359B2
Authority
JP
Japan
Prior art keywords
copper foil
coverlay
solder
film
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62260087A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01101697A (ja
Inventor
Yutaka Hibino
Seiichi Yamaoka
Masanari Watase
Tadahito Kudo
Hiroyoshi Harada
Atsushi Kanezaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arkray Inc
Sumitomo Electric Industries Ltd
Original Assignee
Arkray Inc
Sumitomo Electric Industries Ltd
Kyoto Daiichi Kagaku KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arkray Inc, Sumitomo Electric Industries Ltd, Kyoto Daiichi Kagaku KK filed Critical Arkray Inc
Priority to JP26008787A priority Critical patent/JPH01101697A/ja
Publication of JPH01101697A publication Critical patent/JPH01101697A/ja
Publication of JPH0573359B2 publication Critical patent/JPH0573359B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP26008787A 1987-10-14 1987-10-14 フレキシブル印刷配線板の製造方法 Granted JPH01101697A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26008787A JPH01101697A (ja) 1987-10-14 1987-10-14 フレキシブル印刷配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26008787A JPH01101697A (ja) 1987-10-14 1987-10-14 フレキシブル印刷配線板の製造方法

Publications (2)

Publication Number Publication Date
JPH01101697A JPH01101697A (ja) 1989-04-19
JPH0573359B2 true JPH0573359B2 (enEXAMPLES) 1993-10-14

Family

ID=17343120

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26008787A Granted JPH01101697A (ja) 1987-10-14 1987-10-14 フレキシブル印刷配線板の製造方法

Country Status (1)

Country Link
JP (1) JPH01101697A (enEXAMPLES)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0525644A1 (en) * 1991-07-24 1993-02-03 Denki Kagaku Kogyo Kabushiki Kaisha Circuit substrate for mounting a semiconductor element
US6217987B1 (en) * 1996-11-20 2001-04-17 Ibiden Co. Ltd. Solder resist composition and printed circuit boards
JP2001044638A (ja) * 1999-07-30 2001-02-16 Kyocera Corp 多層配線基板及びその製造方法
JP2005340382A (ja) * 2004-05-25 2005-12-08 Mitsui Mining & Smelting Co Ltd フレキシブルプリント配線板及びそのフレキシブルプリント配線板の製造方法
JP6793510B2 (ja) * 2016-09-28 2020-12-02 日本メクトロン株式会社 伸縮性配線基板及び伸縮性配線基板の製造方法
JP6932060B2 (ja) * 2017-10-18 2021-09-08 日本メクトロン株式会社 伸縮性配線基板、伸縮性配線基板の製造方法及び電子部品付伸縮性配線基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6154592A (ja) * 1984-08-24 1986-03-18 株式会社日立製作所 現金自動取引装置

Also Published As

Publication number Publication date
JPH01101697A (ja) 1989-04-19

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