JPH0569390B2 - - Google Patents
Info
- Publication number
- JPH0569390B2 JPH0569390B2 JP61085771A JP8577186A JPH0569390B2 JP H0569390 B2 JPH0569390 B2 JP H0569390B2 JP 61085771 A JP61085771 A JP 61085771A JP 8577186 A JP8577186 A JP 8577186A JP H0569390 B2 JPH0569390 B2 JP H0569390B2
- Authority
- JP
- Japan
- Prior art keywords
- calibration
- printed board
- measured
- mark
- robot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000523 sample Substances 0.000 claims description 22
- 238000012360 testing method Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 9
- 238000003384 imaging method Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 18
- 238000012545 processing Methods 0.000 description 9
- 238000003745 diagnosis Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000004164 analytical calibration Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
Landscapes
- Tests Of Electronic Circuits (AREA)
- Image Analysis (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Manipulator (AREA)
- Image Processing (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61085771A JPS62240871A (ja) | 1986-04-14 | 1986-04-14 | プリント板測定装置のプロービング方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61085771A JPS62240871A (ja) | 1986-04-14 | 1986-04-14 | プリント板測定装置のプロービング方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62240871A JPS62240871A (ja) | 1987-10-21 |
JPH0569390B2 true JPH0569390B2 (zh) | 1993-09-30 |
Family
ID=13868136
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61085771A Granted JPS62240871A (ja) | 1986-04-14 | 1986-04-14 | プリント板測定装置のプロービング方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62240871A (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02131888A (ja) * | 1988-11-14 | 1990-05-21 | Agency Of Ind Science & Technol | 布地ハンドリング装置 |
DE4406538A1 (de) | 1994-02-28 | 1995-08-31 | Mania Gmbh | Leiterplatten-Prüfeinrichtung mit Prüfadapter und Verfahren zum Einstellen desselben |
JP4820731B2 (ja) * | 2006-10-17 | 2011-11-24 | 日本電産リード株式会社 | 基板検査装置及び基板検査方法 |
JP4650411B2 (ja) * | 2006-12-29 | 2011-03-16 | 三菱電機株式会社 | コネクタ自動挿抜装置及びコネクタ挿抜方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59142405A (ja) * | 1983-02-02 | 1984-08-15 | Shimizu Constr Co Ltd | 鋼板セルの位置検知方法 |
JPS60233503A (ja) * | 1984-05-02 | 1985-11-20 | Matsushita Electric Works Ltd | 位置検出方法 |
-
1986
- 1986-04-14 JP JP61085771A patent/JPS62240871A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59142405A (ja) * | 1983-02-02 | 1984-08-15 | Shimizu Constr Co Ltd | 鋼板セルの位置検知方法 |
JPS60233503A (ja) * | 1984-05-02 | 1985-11-20 | Matsushita Electric Works Ltd | 位置検出方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS62240871A (ja) | 1987-10-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4934064A (en) | Alignment method in a wafer prober | |
JPH01127238A (ja) | 可動部材用の限定的再位置決め区域における位置フイードバック向上 | |
JPH0221274A (ja) | 潜在的歪曲プリント回路板点検のための補償システム | |
CN114441942B (zh) | Pcb板的飞针测试方法、系统、设备及存储介质 | |
JP2006234510A (ja) | 検査装置及び検査方法並びに位置決め方法 | |
JP5464468B2 (ja) | 基板検査装置及び検査治具 | |
JPH07297242A (ja) | プローブ方法及びその装置 | |
KR20220128206A (ko) | 플라잉 프로브 테스터를 이용한 pcb 칩 측정방법 | |
JPH0569390B2 (zh) | ||
JP7174555B2 (ja) | 基板検査装置、その位置合せ、及び基板検査方法 | |
JP2003098216A (ja) | 回路基板検査装置 | |
JP3090630B2 (ja) | Bga、csp等におけるicチップ実装基板の導通検査システム | |
JP3509040B2 (ja) | 回路基板検査装置におけるプローブの移動制御方法 | |
JP2633147B2 (ja) | 部品実装方法 | |
JP2003279624A (ja) | 電子部品試験装置 | |
JP3725993B2 (ja) | 電子部品実装回路基板の検査方法及びその装置 | |
JP3222598B2 (ja) | 狭小部品実装プリント配線基板ユニット検査システム | |
JPH06129831A (ja) | 基板検査装置 | |
JP3088146B2 (ja) | 基板検査方法及び該方法に用いる基板 | |
KR102382569B1 (ko) | Pcba 검사장치의 pcba 검사방법 | |
JPH07140088A (ja) | 回路基板検査装置における外観検査用カメラの単位移動量補正方法 | |
KR102449983B1 (ko) | Pcba 검사장치 | |
JP2847351B2 (ja) | 実装済印刷配線板自動検査装置 | |
JPH0278970A (ja) | 導体パターンの導通検査機及び導通検査機におけるプローブの座標設定方法 | |
JP3337794B2 (ja) | 回路基板検査方法およびその装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |