JPH0565229B2 - - Google Patents

Info

Publication number
JPH0565229B2
JPH0565229B2 JP62283820A JP28382087A JPH0565229B2 JP H0565229 B2 JPH0565229 B2 JP H0565229B2 JP 62283820 A JP62283820 A JP 62283820A JP 28382087 A JP28382087 A JP 28382087A JP H0565229 B2 JPH0565229 B2 JP H0565229B2
Authority
JP
Japan
Prior art keywords
adhesive
printed circuit
circuit board
application
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62283820A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01135561A (ja
Inventor
Koichi Asai
Mamoru Tsuda
Kunio Ooe
Takamoto Iwatsuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Machine Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Machine Manufacturing Co Ltd filed Critical Fuji Machine Manufacturing Co Ltd
Priority to JP62283820A priority Critical patent/JPH01135561A/ja
Publication of JPH01135561A publication Critical patent/JPH01135561A/ja
Publication of JPH0565229B2 publication Critical patent/JPH0565229B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
JP62283820A 1987-08-27 1987-11-10 接着剤塗布装置 Granted JPH01135561A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62283820A JPH01135561A (ja) 1987-08-27 1987-11-10 接着剤塗布装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP62-213658 1987-08-27
JP21365887 1987-08-27
JP62283820A JPH01135561A (ja) 1987-08-27 1987-11-10 接着剤塗布装置

Related Child Applications (4)

Application Number Title Priority Date Filing Date
JP4102107A Division JP2535474B2 (ja) 1987-08-27 1992-03-27 試し打ち機能を備えた高粘性流体塗布装置
JP4102106A Division JP2535473B2 (ja) 1987-08-27 1992-03-27 プリント基板用高粘性流体塗布装置
JP7327624A Division JP2669811B2 (ja) 1987-08-27 1995-12-15 高粘性流体塗布装置
JP7327623A Division JP2863475B2 (ja) 1987-08-27 1995-12-15 高粘性流体塗布装置

Publications (2)

Publication Number Publication Date
JPH01135561A JPH01135561A (ja) 1989-05-29
JPH0565229B2 true JPH0565229B2 (zh) 1993-09-17

Family

ID=16642811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62283820A Granted JPH01135561A (ja) 1987-08-27 1987-11-10 接着剤塗布装置

Country Status (1)

Country Link
JP (1) JPH01135561A (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4818558A (en) * 1987-08-04 1989-04-04 Worthington Foods, Inc. Fiber/tofu food product and method for making the same
JP2612899B2 (ja) * 1988-06-06 1997-05-21 松下電器産業株式会社 粘性流体塗布装置
JPH02214577A (ja) * 1989-02-14 1990-08-27 Matsushita Electric Ind Co Ltd 接着剤塗布方法
JP2865310B2 (ja) * 1989-05-15 1999-03-08 三洋電機株式会社 ディスペンサ装置及びディスペンサ制御方法
JP2801033B2 (ja) * 1989-07-28 1998-09-21 松下電器産業株式会社 粘性流体塗布方法と粘性流体塗布装置
JP2772058B2 (ja) * 1989-09-05 1998-07-02 武蔵エンジニアリング株式会社 マルチプリセット式ディスペンサー
JP4701976B2 (ja) * 2005-10-05 2011-06-15 Ｔｄｋ株式会社 吐出制御装置
JP7467176B2 (ja) 2020-03-16 2024-04-15 日本発條株式会社 接着剤の塗布方法および塗布装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57164310A (en) * 1981-04-03 1982-10-08 Hitachi Ltd Automatic assembling device
JPS59152689A (ja) * 1983-02-18 1984-08-31 三洋電機株式会社 チツプ状電子部品固定用接着剤塗布装置
JPS601900A (ja) * 1983-06-17 1985-01-08 松下電器産業株式会社 認識付電子部品実装装置
JPS6156500A (ja) * 1984-08-28 1986-03-22 株式会社東芝 電子部品装着装置
JPS6271239A (ja) * 1985-09-25 1987-04-01 Hitachi Ltd 半導体製造方法及び製造装置
JPS62110775A (ja) * 1985-11-11 1987-05-21 Hitachi Ltd 塗布装置
JPS62130596A (ja) * 1985-12-02 1987-06-12 三菱電機株式会社 電子部品自動組立装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59128735U (ja) * 1983-02-17 1984-08-30 新日本無線株式会社 半導体チツプの接着装置
JPS647967A (en) * 1987-07-01 1989-01-11 Sharp Kk Paste coating device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57164310A (en) * 1981-04-03 1982-10-08 Hitachi Ltd Automatic assembling device
JPS59152689A (ja) * 1983-02-18 1984-08-31 三洋電機株式会社 チツプ状電子部品固定用接着剤塗布装置
JPS601900A (ja) * 1983-06-17 1985-01-08 松下電器産業株式会社 認識付電子部品実装装置
JPS6156500A (ja) * 1984-08-28 1986-03-22 株式会社東芝 電子部品装着装置
JPS6271239A (ja) * 1985-09-25 1987-04-01 Hitachi Ltd 半導体製造方法及び製造装置
JPS62110775A (ja) * 1985-11-11 1987-05-21 Hitachi Ltd 塗布装置
JPS62130596A (ja) * 1985-12-02 1987-06-12 三菱電機株式会社 電子部品自動組立装置

Also Published As

Publication number Publication date
JPH01135561A (ja) 1989-05-29

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