JPH0565055B2 - - Google Patents

Info

Publication number
JPH0565055B2
JPH0565055B2 JP61179532A JP17953286A JPH0565055B2 JP H0565055 B2 JPH0565055 B2 JP H0565055B2 JP 61179532 A JP61179532 A JP 61179532A JP 17953286 A JP17953286 A JP 17953286A JP H0565055 B2 JPH0565055 B2 JP H0565055B2
Authority
JP
Japan
Prior art keywords
film
diffusion prevention
phosphorus
phosphorus diffusion
silicon dioxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61179532A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6334939A (ja
Inventor
Hiroshi Kawashita
Koichi Nakagawa
Ko Shimomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP61179532A priority Critical patent/JPS6334939A/ja
Publication of JPS6334939A publication Critical patent/JPS6334939A/ja
Publication of JPH0565055B2 publication Critical patent/JPH0565055B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H10W72/01931—Manufacture or treatment of bond pads using blanket deposition
    • H10W72/01938—Manufacture or treatment of bond pads using blanket deposition in gaseous form, e.g. by CVD or PVD
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Wire Bonding (AREA)
JP61179532A 1986-07-29 1986-07-29 半導体装置およびその製造方法 Granted JPS6334939A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61179532A JPS6334939A (ja) 1986-07-29 1986-07-29 半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61179532A JPS6334939A (ja) 1986-07-29 1986-07-29 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JPS6334939A JPS6334939A (ja) 1988-02-15
JPH0565055B2 true JPH0565055B2 (https=) 1993-09-16

Family

ID=16067398

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61179532A Granted JPS6334939A (ja) 1986-07-29 1986-07-29 半導体装置およびその製造方法

Country Status (1)

Country Link
JP (1) JPS6334939A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0814018B2 (ja) * 1987-12-14 1996-02-14 アルミニウム カンパニー オブ アメリカ アルミニウム合金の熱処理方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58219741A (ja) * 1982-06-15 1983-12-21 Nippon Gakki Seizo Kk 半導体装置

Also Published As

Publication number Publication date
JPS6334939A (ja) 1988-02-15

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