JPH0451055B2 - - Google Patents

Info

Publication number
JPH0451055B2
JPH0451055B2 JP61113071A JP11307186A JPH0451055B2 JP H0451055 B2 JPH0451055 B2 JP H0451055B2 JP 61113071 A JP61113071 A JP 61113071A JP 11307186 A JP11307186 A JP 11307186A JP H0451055 B2 JPH0451055 B2 JP H0451055B2
Authority
JP
Japan
Prior art keywords
film
aluminum
semiconductor device
titanium nitride
bonding pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP61113071A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62269332A (ja
Inventor
Hiroshi Kawashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP61113071A priority Critical patent/JPS62269332A/ja
Publication of JPS62269332A publication Critical patent/JPS62269332A/ja
Publication of JPH0451055B2 publication Critical patent/JPH0451055B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Wire Bonding (AREA)
JP61113071A 1986-05-16 1986-05-16 半導体装置 Granted JPS62269332A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61113071A JPS62269332A (ja) 1986-05-16 1986-05-16 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61113071A JPS62269332A (ja) 1986-05-16 1986-05-16 半導体装置

Publications (2)

Publication Number Publication Date
JPS62269332A JPS62269332A (ja) 1987-11-21
JPH0451055B2 true JPH0451055B2 (https=) 1992-08-18

Family

ID=14602755

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61113071A Granted JPS62269332A (ja) 1986-05-16 1986-05-16 半導体装置

Country Status (1)

Country Link
JP (1) JPS62269332A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6508601B2 (ja) 2014-08-11 2019-05-08 パナソニックＩｐマネジメント株式会社 半導体装置
TWI791590B (zh) * 2017-08-14 2023-02-11 美商瓦特隆電子製造公司 接合石英件之方法及接合之石英的石英電極及其他裝置

Also Published As

Publication number Publication date
JPS62269332A (ja) 1987-11-21

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Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term