JPS62269332A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS62269332A
JPS62269332A JP61113071A JP11307186A JPS62269332A JP S62269332 A JPS62269332 A JP S62269332A JP 61113071 A JP61113071 A JP 61113071A JP 11307186 A JP11307186 A JP 11307186A JP S62269332 A JPS62269332 A JP S62269332A
Authority
JP
Japan
Prior art keywords
film
aluminum
titanium nitride
psg
aluminum film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61113071A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0451055B2 (https=
Inventor
Hiroshi Kawashita
川下　浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP61113071A priority Critical patent/JPS62269332A/ja
Publication of JPS62269332A publication Critical patent/JPS62269332A/ja
Publication of JPH0451055B2 publication Critical patent/JPH0451055B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Wire Bonding (AREA)
JP61113071A 1986-05-16 1986-05-16 半導体装置 Granted JPS62269332A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61113071A JPS62269332A (ja) 1986-05-16 1986-05-16 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61113071A JPS62269332A (ja) 1986-05-16 1986-05-16 半導体装置

Publications (2)

Publication Number Publication Date
JPS62269332A true JPS62269332A (ja) 1987-11-21
JPH0451055B2 JPH0451055B2 (https=) 1992-08-18

Family

ID=14602755

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61113071A Granted JPS62269332A (ja) 1986-05-16 1986-05-16 半導体装置

Country Status (1)

Country Link
JP (1) JPS62269332A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016024387A1 (ja) * 2014-08-11 2016-02-18 パナソニックＩｐマネジメント株式会社 半導体装置
US20220148904A1 (en) * 2017-08-14 2022-05-12 Watlow Electric Manufacturing Company Method for joining quartz pieces and quartz electrodes and other devices of joined quartz

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016024387A1 (ja) * 2014-08-11 2016-02-18 パナソニックＩｐマネジメント株式会社 半導体装置
JPWO2016024387A1 (ja) * 2014-08-11 2017-06-01 パナソニックＩｐマネジメント株式会社 半導体装置
US10090220B2 (en) 2014-08-11 2018-10-02 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
US20220148904A1 (en) * 2017-08-14 2022-05-12 Watlow Electric Manufacturing Company Method for joining quartz pieces and quartz electrodes and other devices of joined quartz
US12020971B2 (en) * 2017-08-14 2024-06-25 Watlow Electric Manufacturing Company Method for joining quartz pieces and quartz electrodes and other devices of joined quartz

Also Published As

Publication number Publication date
JPH0451055B2 (https=) 1992-08-18

Similar Documents

Publication Publication Date Title
JPS62269332A (ja) 半導体装置
US5087578A (en) Semiconductor device having multi-layered wiring
JPS63232447A (ja) 半導体装置
US4824801A (en) Method of manufacturing aluminum bonding pad with PSG coating
JPS6367751A (ja) 半導体装置
JPS6340333A (ja) 半導体装置
JPH01262654A (ja) 半導体装置
JPS62219541A (ja) 半導体装置
JPS6367754A (ja) 半導体装置
JPH0565055B2 (https=)
JPS59213165A (ja) 半導体装置
JPS6334938A (ja) 半導体装置
JPS6367750A (ja) 半導体装置
JPS5846644A (ja) 半導体素子
JPS6276536A (ja) 半導体集積回路装置
JPH03227539A (ja) 半導体装置
JPH02308539A (ja) 半導体装置及びその製造方法
JPS58137233A (ja) 半導体装置
JPS6367753A (ja) 半導体装置
JPS61198651A (ja) 半導体集積回路装置
JPS5898939A (ja) 半導体装置
JPS63104342A (ja) 半導体集積回路
JPS6340332A (ja) 半導体装置
JPS61203653A (ja) 配線の接続方法
JPS6378554A (ja) 半導体装置

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term