JPH0564992B2 - - Google Patents

Info

Publication number
JPH0564992B2
JPH0564992B2 JP63072887A JP7288788A JPH0564992B2 JP H0564992 B2 JPH0564992 B2 JP H0564992B2 JP 63072887 A JP63072887 A JP 63072887A JP 7288788 A JP7288788 A JP 7288788A JP H0564992 B2 JPH0564992 B2 JP H0564992B2
Authority
JP
Japan
Prior art keywords
composite oxide
impregnation
dispersed
particle size
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63072887A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01245038A (ja
Inventor
Takaaki Sakamoto
Munehiko Ito
Shuji Maeda
Takahiro Heiuchi
Takayoshi Koseki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP7288788A priority Critical patent/JPH01245038A/ja
Publication of JPH01245038A publication Critical patent/JPH01245038A/ja
Publication of JPH0564992B2 publication Critical patent/JPH0564992B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Graft Or Block Polymers (AREA)
JP7288788A 1988-03-27 1988-03-27 無機物粒子分散樹脂の含浸方法 Granted JPH01245038A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7288788A JPH01245038A (ja) 1988-03-27 1988-03-27 無機物粒子分散樹脂の含浸方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7288788A JPH01245038A (ja) 1988-03-27 1988-03-27 無機物粒子分散樹脂の含浸方法

Publications (2)

Publication Number Publication Date
JPH01245038A JPH01245038A (ja) 1989-09-29
JPH0564992B2 true JPH0564992B2 (enrdf_load_html_response) 1993-09-16

Family

ID=13502301

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7288788A Granted JPH01245038A (ja) 1988-03-27 1988-03-27 無機物粒子分散樹脂の含浸方法

Country Status (1)

Country Link
JP (1) JPH01245038A (enrdf_load_html_response)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100920535B1 (ko) * 2001-08-31 2009-10-08 스미토모 베이클리트 컴퍼니 리미티드 수지 조성물, 프리프레그, 적층판 및 반도체 패키지
US8173519B2 (en) 2006-03-03 2012-05-08 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP5288581B2 (ja) * 2006-03-03 2013-09-11 株式会社半導体エネルギー研究所 半導体装置の作製方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5894461A (ja) * 1981-12-01 1983-06-04 松下電工株式会社 白色エポキシ樹脂積層板
JPS5894449A (ja) * 1981-12-01 1983-06-04 松下電工株式会社 難燃性積層板
JPS63165446A (ja) * 1986-12-27 1988-07-08 Toyo Electric Mfg Co Ltd 樹脂硬化促進剤
JPH01115965A (ja) * 1987-10-28 1989-05-09 Chuo Hatsumei Kenkyusho:Kk モノマー・無機コロイドゾル含浸剤およびその製造方法

Also Published As

Publication number Publication date
JPH01245038A (ja) 1989-09-29

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