JPH056094Y2 - - Google Patents
Info
- Publication number
- JPH056094Y2 JPH056094Y2 JP1988095240U JP9524088U JPH056094Y2 JP H056094 Y2 JPH056094 Y2 JP H056094Y2 JP 1988095240 U JP1988095240 U JP 1988095240U JP 9524088 U JP9524088 U JP 9524088U JP H056094 Y2 JPH056094 Y2 JP H056094Y2
- Authority
- JP
- Japan
- Prior art keywords
- template
- mold
- cavity
- side wall
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 68
- 229920005989 resin Polymers 0.000 claims description 68
- 238000000465 moulding Methods 0.000 claims description 38
- 239000000463 material Substances 0.000 claims description 21
- 238000007789 sealing Methods 0.000 claims description 13
- 238000004891 communication Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 22
- 230000008569 process Effects 0.000 description 20
- 238000004140 cleaning Methods 0.000 description 8
- 238000005538 encapsulation Methods 0.000 description 7
- 230000009471 action Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988095240U JPH056094Y2 (fr) | 1988-07-18 | 1988-07-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988095240U JPH056094Y2 (fr) | 1988-07-18 | 1988-07-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0217318U JPH0217318U (fr) | 1990-02-05 |
| JPH056094Y2 true JPH056094Y2 (fr) | 1993-02-17 |
Family
ID=31319881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988095240U Expired - Lifetime JPH056094Y2 (fr) | 1988-07-18 | 1988-07-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH056094Y2 (fr) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2842272B2 (ja) * | 1995-01-09 | 1998-12-24 | 日本電気株式会社 | 半導体装置の樹脂封止方法及びその封止装置 |
| JP5353462B2 (ja) * | 2009-06-17 | 2013-11-27 | パナソニック株式会社 | 樹脂モールド型コンデンサの製造方法 |
| CN102187412B (zh) * | 2009-06-17 | 2014-03-12 | 松下电器产业株式会社 | 树脂模制型电子部件的制造方法 |
| TW201119829A (en) * | 2009-12-08 | 2011-06-16 | Orient Semiconductor Elect Ltd | Molding apparatus and molding method using the same |
| JP6067475B2 (ja) * | 2013-05-15 | 2017-01-25 | アピックヤマダ株式会社 | Ｌｅｄ装置の製造方法、金型、及び、樹脂成形装置 |
| JP6300510B2 (ja) * | 2013-12-18 | 2018-03-28 | キヤノン株式会社 | トランスファ成形方法および成形金型 |
-
1988
- 1988-07-18 JP JP1988095240U patent/JPH056094Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0217318U (fr) | 1990-02-05 |
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