201119829 六、發明說明： t發明所屬之技術領域】 本發明係有關一種鑄模裝置及方法，更特別有 關一種形成封膠體以及蓋子的鑄模裝置及方法。 【先前技術】 徑卞月型積體電路裝置 曰日月卞是 — …一 y且 ^ 丹，各式 用k例如數位資料儲存、身份或物品辨識等應用。 晶片卡是將積體電路晶片組配成卡片，並以卡^插 入或卡片壓貼等接觸方式達到對外電訊號傳輸，且 根據種類及功能的不同，晶片卡會包含有數 :晶片。-般來說’為使晶片卡的體積減小，J 卡上的晶片大都是以堆疊的方式設置在一 並以輯时式，料些W包覆在基板上 缺而為片形成封谬體，不免會使用到模具。 二二_日片增峰亦即所要形成的封膠 增加時，根據習知的作法，勢必要更換一 增：。临W采度的模具，如此會造成成本上的 J工 的方式保護晶片之冰 ^ w , 會利用蓋子來保護晶片。詳 卜業界七 置在蓋子内，並以超音波 ；’就是將晶片認 在盖子裡。而形成上述蓋子的 將日日片封衣 的模具’以例如射出成型的^亦是利用適當 八t成。與形成封膠 201119829 =情況—樣，當堆疊的晶片增加時，同樣也是要 :奥：套具有不同模穴深度的模具，這也會造成成 本上的增加。 【發明内容】 =明提供—種鑄模裝置，則人―中模塊來 = 的上模具或者是母模，以藉此降低生 產戚本。 ❿ 含有二目的’本發明-實施例之鑄模裝置包 且後田、、 弟一杈具及一中模塊。第二模 一系用以承载一基板，其一 對移動。而令模塊且右：與弟-_可相 =具之間，且與第一模具或第二模具中之宜中 者可拆式地連接。本中握# '、 拉具上的基板形成密合時，中 及弟— 注膠空間。 中杈塊的間口内形成― 模I本：：另：實施例之鑄模裝置，包含有-第- 弟一模具及一令模塊。第二 起部分’其中第-與第二模星係可相對;:：有一大 模塊具有一 ^ /、係了相對移動。而中 戸弓幵，设置於第—模具與第二握1 + 曰，且與第一模具或第二 7 地連接。當中模塊盘第一及第'之其中一者可拆式 第二模具的突起部;:伸 —鑄模空間。 且開口内形成 201119829 本發明還提供利用上述鑄模裂置來形成封膠體 以及實行鑄模的方法。 為了讓本發明之上述和其他目的、特徵、和優 點能更明顯，下文將配合所附圖示，作詳細說明如 下。 【實施方式】 參考第1及2圖，本發明第-實施例之鑄模裝 置⑽包含有一上模具110、—中模塊12〇以及一 下模具130,其中上模具11〇具有一模穴ιΐ6，而中 模塊⑽係以鋼製成，具有至少—開口 122，並與 上模具U0或下模具130中之其中一者可拆式地連 接。應注意’第1圖所顯示者，係中模塊12〇盥上 模具110可拆式地連接。 參考第3a至3c圖，當使用本發明之禱模裝置 1〇0進行賴製程時，先將—基板190放置在下模 具130上，並使基板190上的晶片192朝上（見第 3a圖）。而後將上模具11〇朝基板19〇下壓，使得中 模塊120與上模具11〇以及基板19〇形成密合， 於開口 122内形成密閉的注膠空間18〇。這時上模 具110的模穴116係與令模塊120的開口 122相通 而基f 190上的晶片192則隱沒在注夥空間⑽内 (見第3b圖>接著將熔融的膠材注入注膠空間丨如 内，待膠材固化後’將上模具11〇與中模塊120上 201119829 移，基板190上即形成有包覆晶片192的封膠體夏舛 根據本發明第一實施例之鑄模裝置1〇〇，若欲形 成不同厚度的封膠體194,僅需要更換不同厚 中模塊120，而不需要更換整組上模具11〇。由於中 模塊120的價格遠較上模具11〇的價格來的低，因 此可降低生產成本。再請參考第丨以及3a至孔圖， 為使封膠體194形成後容易與中模塊12〇分離，θ本 實施例之鑄模裝置100另包含有設置於上模具 之凹槽内的彈簧裝置112及導桿114。彈簧裝置Μ〕 可伸縮地連設於上模具11〇與導桿114間，中模塊 120以螺接或卡接等方式與導桿114連接，以藉由 導桿114幻單簧裝置112形成與上模具ιι〇可拆 地連接。當上模具110朝基板19〇下壓時，中模塊 12〇亦會朝基板190移動。在中模塊12〇與基板I% 接觸後，彈簧裝置112會開始履縮，最後中模塊⑽ 會與上模具110以及基板190形成密合。在注膠完 成後上模具110上移時，彈簧裝置112會開始二 而使得中模塊m與上模具11()分離，這時封卿 =也會因彈簧裝置112的作用而與中模塊⑽^ 體19應^意厂者，上模具n〇的模穴116係可對封膠 " 勺厚度有部分的貢獻，但吾人應瞭解，上模 201119829 的模八116於本貫施例中並非必須。若模穴 W舁開D 122完全對應時，其對封膠體194厚度 的部分貢獻’可藉由等量增加中模塊12〇的厚度來 取，之另外，為避免溢膠的情況發生，開口 122 的^度較佳係略大於模穴116的寬度。除此之外， :丁為了符合某些規定或需要，封膠體194的項部 需要具有若干的凹凸結構，這時模穴116内便需要 具有對應的凹凸結構方可形成。 參考第4及5圖，本發明第二實施例之鑄模裝 置彻包含有一上模具41〇、一中模塊42〇以及一 下杈具430。上模具410具有一模穴416,而中模塊 420以鋼製成’具有一開口似，並與上模具仙可 拆式地連接。 翏考第6a至6b圖，當使用本實施例之鑄模裝 置400進仃鑄模製程時，將上模具壓向下模具 430’使得中模塊42〇與上模具41〇及下模具4扣形 成密合，而於開口 422内形成密閉的禱模空間彻。 這時上模具410的模穴416係與中模塊42()的開口 422相通，而下模具43〇的突起部分432則伸入中 模塊420的開口 422内（見第6a圖）。接著將熔融 的塑枓注入轉模空間480内，待塑料固化後，將上 模具410及中模塊42〇與下模具43〇分開，即形成 如第6b圖所示的蓋子490。 201119829201119829 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a molding apparatus and method, and more particularly to a molding apparatus and method for forming an encapsulant and a cover. [Prior Art] The 卞 型 积 积 积 积 积 曰 曰 曰 ... ... ... ... ... ... ... ... ... ... ... ... ... , , , , , , , , , , , , , , , , , , , , The chip card integrates the integrated circuit chip into a card and transmits the external electrical signal by means of card insertion or card pressing, and the wafer card contains a number of wafers depending on the type and function. Generally speaking, in order to reduce the volume of the wafer card, the wafers on the J card are mostly arranged in a stacking manner in a time-sharing manner, and the W-coated on the substrate is formed to form a sealing body. It will inevitably use the mold. When the increase in the seal of the 22nd-day film is also increased, according to the conventional practice, it is necessary to replace it with a new one: The mold that is used for the W, which will cause the cost of the workman to protect the ice of the wafer, will use the cover to protect the wafer. The details of the industry are placed in the cover and supersonic; 'that is, the wafer is recognized in the cover. On the other hand, the mold for forming the sun-dried film of the above-mentioned cover is formed by, for example, injection molding. With the formation of sealant 201119829 = situation, when the stacked wafers increase, it is also the same: Austria: sets of molds with different cavity depths, which will also increase the cost. [Description of the Invention] = The mold is provided, and the upper mold or the female mold of the human-medium module is used to reduce the production cost.含有 A molding device package containing the two objects of the present invention-the embodiment and a module of Houtian, Xidi, and a middle. The second module is used to carry a substrate that moves in pairs. Let the module and the right side be separated from the younger one and be detachably connected to the first mold or the second mold. The middle grip # ', the substrate on the puller forms a tight fit, the middle and the younger - the glue injection space. Forming in the middle of the middle block - Mode I:: Another: The casting device of the embodiment includes a -D-die and a command module. The second portion 'where the first-and second-mode galaxies are opposite;:: there is a large module having a ^ /, relative movement. The middle jaw is disposed on the first mold and the second grip 1 + , and is connected to the first mold or the second ground. One of the first and the second of the module disk is detachable from the protrusion of the second mold; the extension is a mold space. And forming in the opening 201119829 The present invention also provides a method of forming a sealant by using the above-described mold splitting and performing a mold. The above and other objects, features, and advantages of the present invention will become more apparent from the accompanying drawings. [Embodiment] Referring to Figures 1 and 2, a molding apparatus (10) according to a first embodiment of the present invention comprises an upper mold 110, a middle module 12A, and a lower mold 130, wherein the upper mold 11 has a cavity ΐ6, and the middle The module (10) is made of steel having at least an opening 122 and is detachably coupled to one of the upper mold U0 or the lower mold 130. It should be noted that the one shown in Fig. 1 is in the middle of the module 12, and the mold 110 is detachably connected. Referring to Figures 3a through 3c, when the wafer processing apparatus of the present invention is used to perform the Lai process, the substrate 190 is first placed on the lower mold 130, and the wafer 192 on the substrate 190 is placed upward (see Figure 3a). . Then, the upper mold 11 is pressed down toward the substrate 19 so that the middle mold 120 is brought into close contact with the upper mold 11 and the substrate 19, and a closed injection space 18 is formed in the opening 122. At this time, the cavity 116 of the upper mold 110 is in communication with the opening 122 of the module 120 and the wafer 192 on the base f 190 is hidden in the injection space (10) (see Figure 3b). The molten material is then injected into the injection space. For example, after the rubber material is cured, the upper mold 11〇 and the middle module 120 are moved on 201119829, and the sealing material of the coated wafer 192 is formed on the substrate 190. The molding apparatus according to the first embodiment of the present invention is disposed. 〇, if it is desired to form the sealant 194 of different thicknesses, only the different thick medium modules 120 need to be replaced, and the entire set of upper molds 11〇 need not be replaced. Since the price of the middle module 120 is much lower than the price of the upper mold 11〇, Therefore, the production cost can be reduced. Referring to the third and third to the hole pattern, in order to make the sealing body 194 easily separated from the middle module 12, the mold apparatus 100 of the embodiment further includes a groove provided in the upper mold. The inner spring device 112 and the guide rod 114. The spring device 可 is telescopically connected between the upper mold 11 〇 and the guide rod 114, and the middle module 120 is connected to the guide rod 114 by screwing or snapping, etc., by Guide rod 114 magical single spring device 112 is formed and upper mold The 装置 is detachably connected. When the upper mold 110 is pressed down toward the substrate 19, the middle module 12 〇 also moves toward the substrate 190. After the middle module 12 接触 is in contact with the substrate I%, the spring device 112 starts to shrink. Finally, the middle module (10) will form a close contact with the upper mold 110 and the substrate 190. When the upper mold 110 moves up after the injection is completed, the spring device 112 will start to separate the middle module m from the upper mold 11 (). = also due to the action of the spring device 112 and the middle module (10) body 19 should be the manufacturer, the mold hole 116 of the upper mold n〇 can contribute to the thickness of the sealer, but we should understand that The die VIII 116 of the upper die 201119829 is not necessary in the present embodiment. If the cavity W 舁 D 122 corresponds completely, its contribution to the thickness of the sealant 194 can be increased by the thickness of the module 12 等In addition, in order to avoid the occurrence of overflow, the opening 122 is preferably slightly larger than the width of the cavity 116. In addition, in order to meet certain regulations or needs, the term of the sealing body 194 The part needs to have a number of concave and convex structures, in which case the cavity 116 needs to have The corresponding concave-convex structure can be formed. Referring to Figures 4 and 5, the mold apparatus of the second embodiment of the present invention completely includes an upper mold 41, a middle mold 42 and a lower cookware 430. The upper mold 410 has a cavity. 416, and the middle module 420 is made of steel and has an opening and is detachably connected to the upper mold. Referring to Figures 6a to 6b, when the molding apparatus 400 of the present embodiment is used for the casting process, The upper mold is pressed against the lower mold 430' so that the middle mold 42 is buckled with the upper mold 41 and the lower mold 4 to form a closed prayer space in the opening 422. At this time, the cavity 416 of the upper mold 410 communicates with the opening 422 of the middle module 42 (), and the raised portion 432 of the lower mold 43 extends into the opening 422 of the middle module 420 (see Fig. 6a). The molten plastic is then injected into the mold cavity 480. After the plastic is cured, the upper mold 410 and the middle mold 42 are separated from the lower mold 43 to form a cover 490 as shown in Fig. 6b. 201119829
根據本發明第二實施例之鑄模裝置400，若欲形 成具有不同高度的蓋子490，除了必須更換下模具 430之外’僅需要更換不同厚度的中模塊420，而不 :要更換整組上模具4。由於中模塊的價格 遠車乂上杈具41〇的價格來的低，因此可降低更換模 /、所而要的費用。同樣地，為使蓋子490形成後容 易=中杈塊420分離，本實施例之鑄模裝置4〇〇另 匕含有s又於上模具410之凹槽中的彈簧裝置412 及# 干414。彈簧裝置412可伸縮地連係設置於 、Ί、410與上，導桿414間，申模塊420以螺接 接等方式與導桿414連接，以藉由導桿414及 ，：：裝置412形成與上模具41()可拆式地連接。與 第1施㈣鑄模裝置1()()相同’本實施例中所使 :的裝置412在上模具41〇接近下模具43〇的 =中會㈣縮，而在上模具遠離下模具43〇 會伸展助蓋子_與中 〇 分離。 六、你1對蓋子Μ 的:的貢獻，但吾人仍應瞭解，上模具4〗 於本實施例中亦非必須。若模穴叫 :完全對應時，其對蓋子4卯高度的部分, 獻了猎由等量增加令模塊420的厚度來 除此之外，為避免塑料溢出的情況發生，門口 4; 的寬度較佳係略大於模穴416的寬度。竭 — 201119829 来4考第7圖，本發明第三實施例之鑄模裝置700 浐似第一貫施例之鑄模裴置400，在此相同的標號 τ :相同的το件。而與第二實施例之鑄模裝置4〇〇 ，『的疋，本實施例之鑄模裝置7〇〇的中模塊42〇 :可拆式地設置於下模具43G i。由於本實施例所 用的7L件與製程原理皆與第二實施例相同，因此 不再敘述。 姑應注意者，本發明中的可拆式連接係可為螺 接、卡接或者是其他種連接方式。 根據本發明之鑄難置1欲形成不同厚度的 封膠體或者是不同高度的芸 ]1子不需要更換昂貴的 I，僅需要更換價格較為低廉的中模塊，可藉 此降低生產成本。 曰 =料明已以前述實施例揭示1其並非用 常二任何本發明所屬技術領域中具有场 :=者，在不脫離本發明之精神和範圍内，當可 ^各種之更動與修改。因此本發明之保護範圍當視 後附之申凊專利範圍所界定者為準。 【圖式簡單說明】 貫施例之鑄模裝置之剖 第1圖：為本發明第一 視圖。 201119829 第2圖：為第1圖中對中模塊沿著線 視圖。 、2'2的剖 封模第製=圖:為使用第1圖之鑄模裝置進行According to the molding apparatus 400 of the second embodiment of the present invention, if the cover 490 having different heights is to be formed, in addition to the replacement of the lower mold 430, it is only necessary to replace the intermediate modules 420 of different thicknesses, instead of: replacing the entire upper mold 4. Since the price of the middle module is lower than the price of the 41 〇 cookware, the cost of replacing the mold can be reduced. Similarly, in order to make the cover 490 easy to form and the middle block 420 to be separated, the mold apparatus 4 of the present embodiment further includes spring means 412 and # dry 414 which are in the grooves of the upper mold 410. The spring device 412 is telescopically disposed on the Ί, 410 and the upper, between the guide rods 414, and the application module 420 is connected to the guide rod 414 by screwing or the like to form and be formed by the guide rod 414 and the device 412. The upper mold 41() is detachably connected. The apparatus 412 which is the same as that of the first (fourth) molding apparatus 1 () (the present embodiment) is slid in the upper mold 41 〇 close to the lower mold 43 ,, and the upper mold is away from the lower mold 43 〇 Will stretch the cover _ separated from the chin. 6. Your contribution to the cover ,: However, we should still understand that the upper mold 4 is not necessary in this embodiment. If the cavity is called: when it is completely corresponding, the height of the cover 4卯 is provided by the equal increase of the thickness of the module 420, in order to avoid the plastic overflow, the width of the door 4; The preferred system is slightly larger than the width of the cavity 416. The present invention is the same as the first embodiment of the mold apparatus 400, and the same reference numeral τ: the same τ. Further, with the molding apparatus 4 of the second embodiment, the middle module 42 of the molding apparatus 7 of the present embodiment is detachably provided to the lower mold 43G i. Since the 7L member and the manufacturing principle used in the present embodiment are the same as those in the second embodiment, they will not be described. It should be noted that the detachable connection in the present invention may be screwed, snapped or otherwise connected. According to the present invention, it is not necessary to replace the expensive I, and it is only necessary to replace the expensive intermediate I, and the production cost can be reduced by replacing the expensive I with the different thickness of the sealant.曰 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Therefore, the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a first view of the present invention. 201119829 Figure 2: A view of the alignment of the module in Figure 1 along the line. , 2'2 of the sealing die system = figure: for the use of the mold device of Figure 1
視圖 視圖 第4圖：為本發明第二實施例之鑄模襞置 第5圖.為第4圖中對中模塊沿著線 之剖 的剖 圖之禱模 示鑄模製 裝置進行View View Fig. 4: A mold set according to a second embodiment of the present invention. Fig. 5 is a cross-sectional view of the centering module taken along line 4 in Fig. 4, showing the mold making apparatus.
第6a至6b圖：為使用第4 鑄模製程之方法，其中第6b圖顯 所形成的蓋子。Figures 6a to 6b: A method of using the fourth molding process, in which the cover formed by the sixth drawing is shown.
視圖。 7圖：為本發明第三實施例之鑄模 、衣直之剖view. 7 is a cross section of a mold and a garment according to a third embodiment of the present invention;
要元件符號說明】 【主 100 112 116 122 180 192 4〇〇 鑄模裝置 110 上模具 彈簧裝置 114 導桿 模穴 120 中模塊 開口 130 下模具 注膠空間 190 基板 晶片 194 封膠體 鑄模裝置 410 上模具 201119829 412 彈簧裝置 414 導桿 416 模穴 420 中模塊 422 開口 430 下模具 432 突起部分 480 鑄模空間 490 蓋子Description of the symbol of the component] [Main 100 112 116 122 180 192 4〇〇Molding device 110 Upper mold spring device 114 Guide hole 120 in the module opening 130 Lower mold injection space 190 Substrate wafer 194 Sealing mold molding device 410 Upper mold 201119829 412 Spring device 414 Guide rod 416 Cavity 420 Medium module 422 Opening 430 Lower mold 432 Projection portion 480 Mold space 490 Cover
1212