WO2008102582A1 - Method for manufacturing optical element, and optical element - Google Patents
Method for manufacturing optical element, and optical element Download PDFInfo
- Publication number
- WO2008102582A1 WO2008102582A1 PCT/JP2008/050596 JP2008050596W WO2008102582A1 WO 2008102582 A1 WO2008102582 A1 WO 2008102582A1 JP 2008050596 W JP2008050596 W JP 2008050596W WO 2008102582 A1 WO2008102582 A1 WO 2008102582A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- optical element
- manufacturing
- thermosetting resin
- die
- optical elements
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/003—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor characterised by the choice of material
- B29C39/006—Monomers or prepolymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
- B29C48/07—Flat, e.g. panels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
- B29C48/12—Articles with an irregular circumference when viewed in cross-section, e.g. window profiles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
- B29C48/13—Articles with a cross-section varying in the longitudinal direction, e.g. corrugated pipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00365—Production of microlenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0012—Arrays characterised by the manufacturing method
- G02B3/0031—Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/022—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2101/00—Use of unspecified macromolecular compounds as moulding material
- B29K2101/10—Thermosetting resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2301/00—Use of unspecified macromolecular compounds as reinforcement
- B29K2301/10—Thermosetting resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2011/00—Optical elements, e.g. lenses, prisms
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Ophthalmology & Optometry (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Led Device Packages (AREA)
Abstract
Provided are an optical element manufacturing method for manufacturing a large number of optical elements having uniform characteristics, and an optical element. Since a seal member (30) is sandwiched between an upper die (10) and a lower die (20), a resin does not leak out to the external from the separating surface between the upper die (10) and the lower die (20), even when the viscosity of the applied thermosetting resin is low. The applied thermosetting resin cures when brought into contact with a heated upper cavity (11) and a lower cavity (21), and a circular member (CY) (Fig. 2) including optical elements (OE) arranged in matrix is formed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009500106A JP5105260B2 (en) | 2007-02-19 | 2008-01-18 | Optical element manufacturing method and optical element |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007037674 | 2007-02-19 | ||
JP2007-037674 | 2007-02-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008102582A1 true WO2008102582A1 (en) | 2008-08-28 |
Family
ID=39709861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/050596 WO2008102582A1 (en) | 2007-02-19 | 2008-01-18 | Method for manufacturing optical element, and optical element |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5105260B2 (en) |
WO (1) | WO2008102582A1 (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009116371A1 (en) * | 2008-03-19 | 2009-09-24 | コニカミノルタオプト株式会社 | Method for producing wafer lens |
JP2010103491A (en) * | 2008-09-25 | 2010-05-06 | Sharp Corp | Optical element, optical element wafer, optical element wafer module, optical element module, method of manufacturing optical element module, electronic element wafer module, method of manufacturing electronic element module, electronic element module, and electronic information device |
JP2010103490A (en) * | 2008-09-25 | 2010-05-06 | Sharp Corp | Optical element, optical element wafer, optical element wafer module, optical element module, method of manufacturing optical element module, electron device wafer module, method of manufacturing electronic device module, electronic element module, and electronic information device |
JP2010103493A (en) * | 2008-09-25 | 2010-05-06 | Sharp Corp | Optical element, optical element wafer, optical element wafer module, optical element module, method of manufacturing optical element module, electronic element wafer module, method of manufacturing electronic element module, electronic element module, and electronic information device |
JP2010103492A (en) * | 2008-09-25 | 2010-05-06 | Sharp Corp | Optical element, optical element wafer, optical element wafer module, optical element module, method of manufacturing optical element module, electronic element wafer module, method of manufacturing electronic element module, electronic element module, and electronic information device |
CN101887136A (en) * | 2009-05-14 | 2010-11-17 | 富士能株式会社 | Wafer level lens array and manufacture method |
JP2010264652A (en) * | 2009-05-14 | 2010-11-25 | Fujifilm Corp | Method and apparatus for manufacturing shaped article |
JP2010266665A (en) * | 2009-05-14 | 2010-11-25 | Fujifilm Corp | Manufacturing method for wafer-level lens array, wafer-level lens array, lens module, and imaging unit |
JP2011064873A (en) * | 2009-09-16 | 2011-03-31 | Fujifilm Corp | Method of manufacturing wafer-level lens array, wafer-level lens array, lens module and imaging unit |
CN102023326A (en) * | 2009-09-14 | 2011-04-20 | 富士胶片株式会社 | Wafer-level lens array, method of manufacturing wafer-level lens array, lens module and imaging unit |
JP2011206980A (en) * | 2010-03-29 | 2011-10-20 | Maxell Finetech Ltd | Optical element, molded article, and method for manufacturing optical element |
WO2014119751A1 (en) * | 2013-02-02 | 2014-08-07 | コニカミノルタ株式会社 | Lens array, compound eye optical system and lens array manufacturing method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001124902A (en) * | 1999-10-25 | 2001-05-11 | Konica Corp | Optical element, optical unit, molded parts provided with the optical element and manufacturing method therefor |
JP2005001313A (en) * | 2003-06-13 | 2005-01-06 | Sony Corp | Production method for optical element with projection for gap control |
JP2006056246A (en) * | 2004-07-20 | 2006-03-02 | Hoya Corp | Gasket for mold for forming plastic lens and designing method of gasket |
-
2008
- 2008-01-18 JP JP2009500106A patent/JP5105260B2/en active Active
- 2008-01-18 WO PCT/JP2008/050596 patent/WO2008102582A1/en active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001124902A (en) * | 1999-10-25 | 2001-05-11 | Konica Corp | Optical element, optical unit, molded parts provided with the optical element and manufacturing method therefor |
JP2005001313A (en) * | 2003-06-13 | 2005-01-06 | Sony Corp | Production method for optical element with projection for gap control |
JP2006056246A (en) * | 2004-07-20 | 2006-03-02 | Hoya Corp | Gasket for mold for forming plastic lens and designing method of gasket |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009116371A1 (en) * | 2008-03-19 | 2009-09-24 | コニカミノルタオプト株式会社 | Method for producing wafer lens |
JP5440492B2 (en) * | 2008-03-19 | 2014-03-12 | コニカミノルタ株式会社 | Wafer lens manufacturing method |
JP2010103491A (en) * | 2008-09-25 | 2010-05-06 | Sharp Corp | Optical element, optical element wafer, optical element wafer module, optical element module, method of manufacturing optical element module, electronic element wafer module, method of manufacturing electronic element module, electronic element module, and electronic information device |
JP2010103490A (en) * | 2008-09-25 | 2010-05-06 | Sharp Corp | Optical element, optical element wafer, optical element wafer module, optical element module, method of manufacturing optical element module, electron device wafer module, method of manufacturing electronic device module, electronic element module, and electronic information device |
JP2010103493A (en) * | 2008-09-25 | 2010-05-06 | Sharp Corp | Optical element, optical element wafer, optical element wafer module, optical element module, method of manufacturing optical element module, electronic element wafer module, method of manufacturing electronic element module, electronic element module, and electronic information device |
JP2010103492A (en) * | 2008-09-25 | 2010-05-06 | Sharp Corp | Optical element, optical element wafer, optical element wafer module, optical element module, method of manufacturing optical element module, electronic element wafer module, method of manufacturing electronic element module, electronic element module, and electronic information device |
JP2010266665A (en) * | 2009-05-14 | 2010-11-25 | Fujifilm Corp | Manufacturing method for wafer-level lens array, wafer-level lens array, lens module, and imaging unit |
JP2010264652A (en) * | 2009-05-14 | 2010-11-25 | Fujifilm Corp | Method and apparatus for manufacturing shaped article |
EP2251717A1 (en) * | 2009-05-14 | 2010-11-17 | Fujinon Corporation | Wafer level lens array and manufacturing method therefor |
CN101887136A (en) * | 2009-05-14 | 2010-11-17 | 富士能株式会社 | Wafer level lens array and manufacture method |
CN102023326A (en) * | 2009-09-14 | 2011-04-20 | 富士胶片株式会社 | Wafer-level lens array, method of manufacturing wafer-level lens array, lens module and imaging unit |
CN102023326B (en) * | 2009-09-14 | 2015-04-29 | 富士胶片株式会社 | Wafer-level lens array, method of manufacturing wafer-level lens array, lens module and imaging unit |
JP2011064873A (en) * | 2009-09-16 | 2011-03-31 | Fujifilm Corp | Method of manufacturing wafer-level lens array, wafer-level lens array, lens module and imaging unit |
CN102023322A (en) * | 2009-09-16 | 2011-04-20 | 富士胶片株式会社 | Wafer-level lens array, method of manufacturing wafer-level lens array, lens module and imaging unit |
US8427748B2 (en) | 2009-09-16 | 2013-04-23 | Fujifilm Corporation | Wafer-level lens array, method of manufacturing wafer-level lens array, lens module and imaging unit |
JP2011206980A (en) * | 2010-03-29 | 2011-10-20 | Maxell Finetech Ltd | Optical element, molded article, and method for manufacturing optical element |
WO2014119751A1 (en) * | 2013-02-02 | 2014-08-07 | コニカミノルタ株式会社 | Lens array, compound eye optical system and lens array manufacturing method |
Also Published As
Publication number | Publication date |
---|---|
JP5105260B2 (en) | 2012-12-26 |
JPWO2008102582A1 (en) | 2010-05-27 |
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