JPH0557119B2 - - Google Patents

Info

Publication number
JPH0557119B2
JPH0557119B2 JP57184566A JP18456682A JPH0557119B2 JP H0557119 B2 JPH0557119 B2 JP H0557119B2 JP 57184566 A JP57184566 A JP 57184566A JP 18456682 A JP18456682 A JP 18456682A JP H0557119 B2 JPH0557119 B2 JP H0557119B2
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit chip
recess
thin
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57184566A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5974639A (ja
Inventor
Kenzo Masuda
Kenichi Ishibashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57184566A priority Critical patent/JPS5974639A/ja
Publication of JPS5974639A publication Critical patent/JPS5974639A/ja
Publication of JPH0557119B2 publication Critical patent/JPH0557119B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/30—
    • H10W70/682—
    • H10W72/073—
    • H10W72/07337—
    • H10W72/5363—
    • H10W90/754—

Landscapes

  • Credit Cards Or The Like (AREA)
  • Die Bonding (AREA)
JP57184566A 1982-10-22 1982-10-22 薄板状集積回路基板の製法 Granted JPS5974639A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57184566A JPS5974639A (ja) 1982-10-22 1982-10-22 薄板状集積回路基板の製法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57184566A JPS5974639A (ja) 1982-10-22 1982-10-22 薄板状集積回路基板の製法

Publications (2)

Publication Number Publication Date
JPS5974639A JPS5974639A (ja) 1984-04-27
JPH0557119B2 true JPH0557119B2 (cg-RX-API-DMAC10.html) 1993-08-23

Family

ID=16155445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57184566A Granted JPS5974639A (ja) 1982-10-22 1982-10-22 薄板状集積回路基板の製法

Country Status (1)

Country Link
JP (1) JPS5974639A (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0517269Y2 (cg-RX-API-DMAC10.html) * 1986-05-15 1993-05-10
JP2578443B2 (ja) * 1987-10-13 1997-02-05 大日本印刷株式会社 Ｉｃカードおよびｉｃカード用ｉｃモジュール
JPH0789281A (ja) * 1993-11-29 1995-04-04 Ryoden Kasei Co Ltd Ｉｃカード

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5329260A (en) * 1976-08-31 1978-03-18 Ishikawajima Harima Heavy Ind Device for penetrating plate of tension bridle
JPS5819639Y2 (ja) * 1978-10-02 1983-04-22 富士通株式会社 メモリ−カ−ド
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
DE3151408C1 (de) * 1981-12-24 1983-06-01 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit einem IC-Baustein

Also Published As

Publication number Publication date
JPS5974639A (ja) 1984-04-27

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