JPH055670B2 - - Google Patents

Info

Publication number
JPH055670B2
JPH055670B2 JP58220023A JP22002383A JPH055670B2 JP H055670 B2 JPH055670 B2 JP H055670B2 JP 58220023 A JP58220023 A JP 58220023A JP 22002383 A JP22002383 A JP 22002383A JP H055670 B2 JPH055670 B2 JP H055670B2
Authority
JP
Japan
Prior art keywords
bonding
heat generating
wire
wiring
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58220023A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60110471A (ja
Inventor
Shigeru Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konica Minolta Inc
Original Assignee
Konica Minolta Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Inc filed Critical Konica Minolta Inc
Priority to JP58220023A priority Critical patent/JPS60110471A/ja
Publication of JPS60110471A publication Critical patent/JPS60110471A/ja
Publication of JPH055670B2 publication Critical patent/JPH055670B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07521—
    • H10W72/07551—
    • H10W72/07554—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/547—
    • H10W72/5524—
    • H10W72/59—
    • H10W72/884—
    • H10W72/932—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electronic Switches (AREA)
  • Wire Bonding (AREA)
JP58220023A 1983-11-21 1983-11-21 感熱記録ヘッド Granted JPS60110471A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58220023A JPS60110471A (ja) 1983-11-21 1983-11-21 感熱記録ヘッド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58220023A JPS60110471A (ja) 1983-11-21 1983-11-21 感熱記録ヘッド

Publications (2)

Publication Number Publication Date
JPS60110471A JPS60110471A (ja) 1985-06-15
JPH055670B2 true JPH055670B2 (enExample) 1993-01-22

Family

ID=16744719

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58220023A Granted JPS60110471A (ja) 1983-11-21 1983-11-21 感熱記録ヘッド

Country Status (1)

Country Link
JP (1) JPS60110471A (enExample)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS578177A (en) * 1980-06-17 1982-01-16 Matsushita Electric Ind Co Ltd Thermal head
JPS5764944A (en) * 1980-10-08 1982-04-20 Hitachi Ltd Forming and bonding methods for ball of metallic wire
JPS57116665A (en) * 1981-01-14 1982-07-20 Nippon Telegr & Teleph Corp <Ntt> Thermal head incorporated in driving circuit
JPS5819953A (ja) * 1981-07-29 1983-02-05 Nec Corp マイクロプログラム制御方式
US4387283A (en) * 1981-08-03 1983-06-07 Texas Instruments Incorporated Apparatus and method of forming aluminum balls for ball bonding
JPS5827329A (ja) * 1981-08-11 1983-02-18 Toshiba Corp ワイヤ−ボンデイング方法

Also Published As

Publication number Publication date
JPS60110471A (ja) 1985-06-15

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