JPH0554260B2 - - Google Patents

Info

Publication number
JPH0554260B2
JPH0554260B2 JP57196758A JP19675882A JPH0554260B2 JP H0554260 B2 JPH0554260 B2 JP H0554260B2 JP 57196758 A JP57196758 A JP 57196758A JP 19675882 A JP19675882 A JP 19675882A JP H0554260 B2 JPH0554260 B2 JP H0554260B2
Authority
JP
Japan
Prior art keywords
submount
semiconductor laser
capillary
laser chip
die bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57196758A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5987825A (ja
Inventor
Toshio Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP57196758A priority Critical patent/JPS5987825A/ja
Publication of JPS5987825A publication Critical patent/JPS5987825A/ja
Publication of JPH0554260B2 publication Critical patent/JPH0554260B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/073—
    • H10W72/07336—
    • H10W72/07337—
    • H10W72/352—
    • H10W72/354—

Landscapes

  • Semiconductor Lasers (AREA)
  • Die Bonding (AREA)
JP57196758A 1982-11-11 1982-11-11 ダイ・ボンデイング方法 Granted JPS5987825A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57196758A JPS5987825A (ja) 1982-11-11 1982-11-11 ダイ・ボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57196758A JPS5987825A (ja) 1982-11-11 1982-11-11 ダイ・ボンデイング方法

Publications (2)

Publication Number Publication Date
JPS5987825A JPS5987825A (ja) 1984-05-21
JPH0554260B2 true JPH0554260B2 (cg-RX-API-DMAC10.html) 1993-08-12

Family

ID=16363123

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57196758A Granted JPS5987825A (ja) 1982-11-11 1982-11-11 ダイ・ボンデイング方法

Country Status (1)

Country Link
JP (1) JPS5987825A (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0727624Y2 (ja) * 1988-02-12 1995-06-21 九州日本電気株式会社 加熱治具
GB2377402B (en) * 2001-07-12 2004-05-12 Agilent Technologies Inc Improved diebond strip

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54100258A (en) * 1978-01-25 1979-08-07 Hitachi Ltd Pellet bonding method
JPS55110048A (en) * 1979-02-16 1980-08-25 Hitachi Ltd Pellet bonding method
JPS5624941A (en) * 1979-08-07 1981-03-10 Mitsubishi Electric Corp Manufacture of semiconductor device

Also Published As

Publication number Publication date
JPS5987825A (ja) 1984-05-21

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