JPS6356705B2 - - Google Patents

Info

Publication number
JPS6356705B2
JPS6356705B2 JP60263373A JP26337385A JPS6356705B2 JP S6356705 B2 JPS6356705 B2 JP S6356705B2 JP 60263373 A JP60263373 A JP 60263373A JP 26337385 A JP26337385 A JP 26337385A JP S6356705 B2 JPS6356705 B2 JP S6356705B2
Authority
JP
Japan
Prior art keywords
temperature
lead
pressure
maintaining
protruding electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60263373A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61190954A (ja
Inventor
Manabu Bonshihara
Yoshio Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP60263373A priority Critical patent/JPS61190954A/ja
Publication of JPS61190954A publication Critical patent/JPS61190954A/ja
Publication of JPS6356705B2 publication Critical patent/JPS6356705B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/072—
    • H10W72/07236—
    • H10W72/07251—
    • H10W72/20—

Landscapes

  • Wire Bonding (AREA)
JP60263373A 1985-11-22 1985-11-22 半導体装置の製造方法 Granted JPS61190954A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60263373A JPS61190954A (ja) 1985-11-22 1985-11-22 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60263373A JPS61190954A (ja) 1985-11-22 1985-11-22 半導体装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP49120505A Division JPS609343B2 (ja) 1974-10-18 1974-10-18 電子部品製造法

Publications (2)

Publication Number Publication Date
JPS61190954A JPS61190954A (ja) 1986-08-25
JPS6356705B2 true JPS6356705B2 (cg-RX-API-DMAC10.html) 1988-11-09

Family

ID=17388587

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60263373A Granted JPS61190954A (ja) 1985-11-22 1985-11-22 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS61190954A (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5208186A (en) * 1989-02-09 1993-05-04 National Semiconductor Corporation Process for reflow bonding of bumps in IC devices

Also Published As

Publication number Publication date
JPS61190954A (ja) 1986-08-25

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