JPS61190954A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS61190954A
JPS61190954A JP60263373A JP26337385A JPS61190954A JP S61190954 A JPS61190954 A JP S61190954A JP 60263373 A JP60263373 A JP 60263373A JP 26337385 A JP26337385 A JP 26337385A JP S61190954 A JPS61190954 A JP S61190954A
Authority
JP
Japan
Prior art keywords
temperature
semiconductor element
section
pressing
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60263373A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6356705B2 (cg-RX-API-DMAC10.html
Inventor
Manabu Bonshihara
盆子原　学
Yoshio Ito
伊藤　好雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60263373A priority Critical patent/JPS61190954A/ja
Publication of JPS61190954A publication Critical patent/JPS61190954A/ja
Publication of JPS6356705B2 publication Critical patent/JPS6356705B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/072—
    • H10W72/07236—
    • H10W72/07251—
    • H10W72/20—

Landscapes

  • Wire Bonding (AREA)
JP60263373A 1985-11-22 1985-11-22 半導体装置の製造方法 Granted JPS61190954A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60263373A JPS61190954A (ja) 1985-11-22 1985-11-22 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60263373A JPS61190954A (ja) 1985-11-22 1985-11-22 半導体装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP49120505A Division JPS609343B2 (ja) 1974-10-18 1974-10-18 電子部品製造法

Publications (2)

Publication Number Publication Date
JPS61190954A true JPS61190954A (ja) 1986-08-25
JPS6356705B2 JPS6356705B2 (cg-RX-API-DMAC10.html) 1988-11-09

Family

ID=17388587

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60263373A Granted JPS61190954A (ja) 1985-11-22 1985-11-22 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS61190954A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5208186A (en) * 1989-02-09 1993-05-04 National Semiconductor Corporation Process for reflow bonding of bumps in IC devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5208186A (en) * 1989-02-09 1993-05-04 National Semiconductor Corporation Process for reflow bonding of bumps in IC devices

Also Published As

Publication number Publication date
JPS6356705B2 (cg-RX-API-DMAC10.html) 1988-11-09

Similar Documents

Publication Publication Date Title
CN100440496C (zh) 无焊剂倒装芯片互连
US6713318B2 (en) Flip chip interconnection using no-clean flux
US4540115A (en) Flux-free photodetector bonding
CN100431396C (zh) 减小粘附体之间的伸长失配的芯片接合工艺以及由此制造的半导体封装
JPS61190954A (ja) 半導体装置の製造方法
JP2748870B2 (ja) 基板接続方法
JP5062710B2 (ja) Ａｕ−Ｓｎ合金はんだペーストを用いた基板と素子の接合方法
JP2851779B2 (ja) 電子部品の実装方法
JPH10335805A (ja) 電子部品の実装方法
JP2611716B2 (ja) 複合リードフレームの製造方法
JPH0516950B2 (cg-RX-API-DMAC10.html)
JPH0158866B2 (cg-RX-API-DMAC10.html)
JPS609343B2 (ja) 電子部品製造法
JPS6297341A (ja) ボンディング装置及びボンディング方法
JP2812094B2 (ja) 半田ｔａｂの構造ならびに半田ｔａｂのｉｌｂ装置およびｉｌｂ方法
JPH0878474A (ja) 基板の接続構造及びその接続方法
JP2616254B2 (ja) 加熱用ツール
JPS5893587A (ja) アルミニウムに銅板を接合する方法
JPS6380966A (ja) はんだ付装置
JPS6390195A (ja) はんだ付け方法
JPH03270144A (ja) 半導体装置の製造方法
GB2372473A (en) A method of soldering
JPH02180038A (ja) フィルムキャリアのボンディング方法
JPH07176679A (ja) 複合リードフレームの製造方法
JPH08243736A (ja) ハンダ付け方法