JPH0553821B2 - - Google Patents

Info

Publication number
JPH0553821B2
JPH0553821B2 JP60291251A JP29125185A JPH0553821B2 JP H0553821 B2 JPH0553821 B2 JP H0553821B2 JP 60291251 A JP60291251 A JP 60291251A JP 29125185 A JP29125185 A JP 29125185A JP H0553821 B2 JPH0553821 B2 JP H0553821B2
Authority
JP
Japan
Prior art keywords
addition
thermal expansion
diamine
coefficient
unsaturated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP60291251A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62148528A (ja
Inventor
Masahiro Matsumura
Kenji Ogasawara
Yoshihisa Sugawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP29125185A priority Critical patent/JPS62148528A/ja
Publication of JPS62148528A publication Critical patent/JPS62148528A/ja
Publication of JPH0553821B2 publication Critical patent/JPH0553821B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP29125185A 1985-12-23 1985-12-23 付加型イミド樹脂組成物 Granted JPS62148528A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29125185A JPS62148528A (ja) 1985-12-23 1985-12-23 付加型イミド樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29125185A JPS62148528A (ja) 1985-12-23 1985-12-23 付加型イミド樹脂組成物

Publications (2)

Publication Number Publication Date
JPS62148528A JPS62148528A (ja) 1987-07-02
JPH0553821B2 true JPH0553821B2 (enrdf_load_stackoverflow) 1993-08-11

Family

ID=17766441

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29125185A Granted JPS62148528A (ja) 1985-12-23 1985-12-23 付加型イミド樹脂組成物

Country Status (1)

Country Link
JP (1) JPS62148528A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0578420U (ja) * 1992-02-27 1993-10-26 三菱マテリアル株式会社 切削工具

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7081127B2 (ja) * 2017-12-05 2022-06-07 昭和電工マテリアルズ株式会社 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール
JP7176186B2 (ja) * 2017-12-05 2022-11-22 昭和電工マテリアルズ株式会社 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール
JP2019099710A (ja) * 2017-12-05 2019-06-24 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5216513A (en) * 1975-07-31 1977-02-07 Ishikawajima Harima Heavy Ind Method of melting raw materials for glass and apparatus thereof
JPS5342079A (en) * 1976-09-28 1978-04-17 Citizen Watch Co Ltd Electronic watch
JPS6116964A (ja) * 1984-07-02 1986-01-24 Toray Ind Inc 炭素繊維補強耐熱性樹脂組成物
FR2589869B1 (fr) * 1985-11-13 1988-01-08 Rhone Poulenc Spec Chim Polymeres a groupements imides et procede de preparation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0578420U (ja) * 1992-02-27 1993-10-26 三菱マテリアル株式会社 切削工具

Also Published As

Publication number Publication date
JPS62148528A (ja) 1987-07-02

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees