JPH0551179B2 - - Google Patents
Info
- Publication number
- JPH0551179B2 JPH0551179B2 JP61011770A JP1177086A JPH0551179B2 JP H0551179 B2 JPH0551179 B2 JP H0551179B2 JP 61011770 A JP61011770 A JP 61011770A JP 1177086 A JP1177086 A JP 1177086A JP H0551179 B2 JPH0551179 B2 JP H0551179B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- semiconductor chip
- electrode
- electrode connection
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 20
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000011651 chromium Substances 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- -1 aluminum-copper-silicon Chemical compound 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61011770A JPS62169433A (ja) | 1986-01-22 | 1986-01-22 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61011770A JPS62169433A (ja) | 1986-01-22 | 1986-01-22 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62169433A JPS62169433A (ja) | 1987-07-25 |
| JPH0551179B2 true JPH0551179B2 (zh) | 1993-07-30 |
Family
ID=11787208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61011770A Granted JPS62169433A (ja) | 1986-01-22 | 1986-01-22 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62169433A (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0720958U (ja) * | 1993-09-29 | 1995-04-18 | 陽 石川 | 開閉式遮蔽シート |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2647047B2 (ja) * | 1995-03-01 | 1997-08-27 | 日本電気株式会社 | 半導体素子のフリップチップ実装方法およびこの実装方法に用いられる接着剤 |
| JP3801674B2 (ja) | 1995-12-15 | 2006-07-26 | 松下電器産業株式会社 | 電子部品の実装方法 |
| JP3065549B2 (ja) | 1997-01-09 | 2000-07-17 | 富士通株式会社 | 半導体チップ部品の実装方法 |
| US20020014688A1 (en) * | 1999-03-03 | 2002-02-07 | Suresh Ramalingam | Controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materials |
| JP2000299553A (ja) * | 1999-04-13 | 2000-10-24 | Ricoh Microelectronics Co Ltd | 電子回路基板製造方法 |
| CN112968109A (zh) * | 2020-11-27 | 2021-06-15 | 重庆康佳光电技术研究院有限公司 | 一种驱动背板及其制作方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56167340A (en) * | 1980-05-27 | 1981-12-23 | Toshiba Corp | Junction of semicondctor pellet with substrate |
| JPS60262430A (ja) * | 1984-06-08 | 1985-12-25 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
| JPS62132331A (ja) * | 1985-12-05 | 1987-06-15 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
-
1986
- 1986-01-22 JP JP61011770A patent/JPS62169433A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56167340A (en) * | 1980-05-27 | 1981-12-23 | Toshiba Corp | Junction of semicondctor pellet with substrate |
| JPS60262430A (ja) * | 1984-06-08 | 1985-12-25 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
| JPS62132331A (ja) * | 1985-12-05 | 1987-06-15 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0720958U (ja) * | 1993-09-29 | 1995-04-18 | 陽 石川 | 開閉式遮蔽シート |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62169433A (ja) | 1987-07-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3597754B2 (ja) | 半導体装置及びその製造方法 | |
| JP5421863B2 (ja) | 半導体パッケージの製造方法 | |
| JP2003133508A (ja) | 半導体装置 | |
| JP2003007902A (ja) | 電子部品の実装基板及び実装構造 | |
| JP2000082722A (ja) | 半導体装置及びその製造方法、回路基板並びに電子機器 | |
| US6998293B2 (en) | Flip-chip bonding method | |
| JPH0551179B2 (zh) | ||
| JPH08213425A (ja) | 半導体装置およびその製造方法 | |
| JPH1187424A (ja) | 半導体装置およびその製造方法 | |
| JP3702062B2 (ja) | 圧力センサ装置 | |
| JP3309832B2 (ja) | 電子部品の接続構造及び接続方法 | |
| JP2000357714A (ja) | 半導体装置及びその製造方法 | |
| JP2000021935A (ja) | 電子部品実装体及びその製造方法 | |
| JP2002118197A (ja) | 配線基板及びそれを用いた半導体装置、ならびにその製造方法 | |
| JP2000058597A (ja) | 電子部品実装方法 | |
| JP2812316B2 (ja) | 半導体装置の製造方法 | |
| JP2002016104A (ja) | 半導体装置の実装方法および半導体装置実装体の製造方法 | |
| JP2001094004A (ja) | 半導体装置、外部接続端子構造体及び半導体装置の製造方法 | |
| JP2721790B2 (ja) | 半導体装置の封止方法 | |
| JP2637684B2 (ja) | 半導体装置の封止方法 | |
| JP2841822B2 (ja) | 混成集積回路の製造方法 | |
| JP3078781B2 (ja) | 半導体装置の製造方法及び半導体装置 | |
| JP3255090B2 (ja) | チップの実装構造およびバンプの形成方法 | |
| JP2944586B2 (ja) | Ｂｇａ型半導体装置及びその製造方法 | |
| JPS58103198A (ja) | 電子部品の取付け方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |