JPH05508744A - 複数の孔を有する被処理製品をその湿式化学処理時、例えば電気メッキ時に運動させる方法並びに該方法を実施する装置 - Google Patents

複数の孔を有する被処理製品をその湿式化学処理時、例えば電気メッキ時に運動させる方法並びに該方法を実施する装置

Info

Publication number
JPH05508744A
JPH05508744A JP91511324A JP51132491A JPH05508744A JP H05508744 A JPH05508744 A JP H05508744A JP 91511324 A JP91511324 A JP 91511324A JP 51132491 A JP51132491 A JP 51132491A JP H05508744 A JPH05508744 A JP H05508744A
Authority
JP
Japan
Prior art keywords
product
vibration
processing
motion
frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP91511324A
Other languages
English (en)
Japanese (ja)
Inventor
ヴァン　ケムペン，ジョス
プレール，カール―ハインツ
Original Assignee
アトテク　ドイチュラント　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アトテク　ドイチュラント　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング filed Critical アトテク　ドイチュラント　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング
Publication of JPH05508744A publication Critical patent/JPH05508744A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonics, vibrations

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Coating With Molten Metal (AREA)
JP91511324A 1990-07-06 1991-07-04 複数の孔を有する被処理製品をその湿式化学処理時、例えば電気メッキ時に運動させる方法並びに該方法を実施する装置 Pending JPH05508744A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE4021581,4 1990-07-06
DE4021581A DE4021581A1 (de) 1990-07-06 1990-07-06 Verfahren zur bewegung eines bohrungen aufweisenden gutes bei dessen nasschemischer behandlung, z.b. galvanisierung, sowie vorrichtung zur durchfuehrung des verfahrens
PCT/DE1991/000557 WO1992001088A1 (de) 1990-07-06 1991-07-04 Verfahren zur bewegung eines bohrungen aufweisenden gutes bei dessen nasschemischer behandlung, z.b. galvanisierung, sowie vorrichtung zur durchführung des verfahrens

Publications (1)

Publication Number Publication Date
JPH05508744A true JPH05508744A (ja) 1993-12-02

Family

ID=6409800

Family Applications (1)

Application Number Title Priority Date Filing Date
JP91511324A Pending JPH05508744A (ja) 1990-07-06 1991-07-04 複数の孔を有する被処理製品をその湿式化学処理時、例えば電気メッキ時に運動させる方法並びに該方法を実施する装置

Country Status (6)

Country Link
EP (1) EP0539390A1 (cs)
JP (1) JPH05508744A (cs)
KR (1) KR930701641A (cs)
CA (1) CA2086762A1 (cs)
DE (1) DE4021581A1 (cs)
WO (1) WO1992001088A1 (cs)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6261435B1 (en) 1997-10-21 2001-07-17 Nihon Techno Kabushiki Kaisha Plating method
JP2013174016A (ja) * 2007-06-06 2013-09-05 Atotech Deutschland Gmbh 板状製品の湿式化学処理用装置及び方法と、上記装置内に流量部材を取り付けるための方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4133561C2 (de) * 1991-10-10 1994-02-03 Reinhard Kissler Gmbh Verfahren und Vorrichtung zum Galvanisieren von Waren
DE4212045C1 (de) * 1992-04-07 1993-12-02 Schering Ag Verfahren und Vorrichtung zur chemischen und/oder galvanischen Behandlung von Werkstücken
JPH10512101A (ja) * 1995-01-05 1998-11-17 ヒューベル エゴン 超微細孔を有したプレート形状の加工材料の処理のための方法と装置
DE10015349A1 (de) * 2000-03-23 2001-10-25 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum Behandeln von durchgehende Löcher und/oder Vertiefungen aufweisenden Schaltungsträgern sowie Anwendung des Verfahrens und Verwendung der Vorrichtung
DE10259367A1 (de) * 2002-12-18 2004-07-08 Siemens Ag Verfahren zur Verbesserung der Wechselwirkung zwischen einem Medium und einem Bauteil
KR101303302B1 (ko) * 2011-05-27 2013-09-03 박경이 도금용 플라이트 바
KR101295339B1 (ko) * 2011-06-09 2013-08-09 박경이 도금장치
KR101346837B1 (ko) * 2011-12-30 2014-01-03 (주)포인텍 기판의 기포 제거장치 및 제거방법
DE102012021144B3 (de) * 2012-10-24 2013-10-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Erzeugung von Metallisierungen in Sackloch-Vias

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE953759C (de) * 1954-10-20 1956-12-06 W Kampschulte & Cie Dr Verfahren und Vorrichtung zum Bewegen der Werkstuecktraeger od. dgl. bei galvanischen Baedern
US2833708A (en) * 1955-05-05 1958-05-06 Rockwell Spring & Axle Co Electroplating apparatus
US3461045A (en) * 1965-10-21 1969-08-12 Teletype Corp Method of plating through holes
DE3105313A1 (de) * 1981-02-13 1982-08-19 Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen Verfahren und vorrichtung zur behandlung von werkstuecken
US4875982A (en) * 1987-02-06 1989-10-24 Velie Circuits, Inc. Plating high aspect ratio holes in circuit boards
DE3905100A1 (de) * 1989-02-20 1990-08-23 Hans Henig Verfahren und vorrichtung zum elektrolytaustausch vornehmlich in engen vertiefungen grossflaechiger werkstuecke

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6261435B1 (en) 1997-10-21 2001-07-17 Nihon Techno Kabushiki Kaisha Plating method
JP2013174016A (ja) * 2007-06-06 2013-09-05 Atotech Deutschland Gmbh 板状製品の湿式化学処理用装置及び方法と、上記装置内に流量部材を取り付けるための方法

Also Published As

Publication number Publication date
DE4021581A1 (de) 1992-01-09
CA2086762A1 (en) 1992-01-07
WO1992001088A1 (de) 1992-01-23
KR930701641A (ko) 1993-06-12
EP0539390A1 (de) 1993-05-05
DE4021581C2 (cs) 1993-09-02

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