JP2013174016A - 板状製品の湿式化学処理用装置及び方法と、上記装置内に流量部材を取り付けるための方法 - Google Patents
板状製品の湿式化学処理用装置及び方法と、上記装置内に流量部材を取り付けるための方法 Download PDFInfo
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Abstract
【解決手段】各々少なくとも一つのパドル様流量要素155を備える少なくとも一つの流量部材150を有しており、少なくとも一つの流量部材155は、製品Wの表面と向かい合った位置に置かれ、且つ製品Wの表面に実質的に平行に移動可能である。
【選択図】図2
Description
a.処理装置内に少なくとも一つの流量部材を備える工程であって、上記流量部材は各々少なくとも一つのパドル様流量要素を備えている、工程。
b.流量部材を板状製品の表面に対して動かす工程。
c.少なくとも一つの流量部材を、それが板状製品の表面に向かい合うように装置内に配置する工程。及び、
d.流量部材を板状製品の表面に実質的に平行(例えば≦±15°)に動かす工程。
i)湿式化学処理用装置を備える工程、
ii)少なくとも一つの流量部材を上記装置内に取り付ける工程であって、当該流量部材が製品表面に向かい合って配置され、且つ製品表面に実質的に平行(例えば≦±15°)に動くことが出来るように、取り付ける工程。
Claims (20)
- 板状製品(W)の湿式化学処理用装置であって、上記板状製品(W)は上記装置(100)内に置かれており、各々少なくとも一つのパドル様流量要素(155)を備えた少なくとも流量部材(150)を備えて構成される装置(100)であって、
少なくとも一つの流量部材(150)が、板状製品(W)の表面と向かい合った位置に置かれ、且つ板状製品(W)の表面とおおむね平行に移動可能である、装置において、
流量部材(150)は、板状製品(W)の両側に配置され、流量部材(150)のパドル様流量要素(155)は、板状製品(W)の両側に面して互いに喰い違うように置かれることを特徴とする、装置。 - 製品(W)が、プリント回路基板、プリント回路箔、半導体ウェハ、光電板、及びガラス板の群から選択されることを特徴とする、請求項1に記載の湿式化学処理用装置。
- 製品(W)が板形状をしており、且つ装置(100)内の処理面内に置かれること、及び、流量部材(150)が処理面の各面に面して置かれることを特徴とする、請求項1又は2に記載の湿式化学処理用装置。
- 少なくとも一つの流量部材(150)が、製品(W)の表面に実質的に平行に延びるように配置されることを特徴とする、請求項1〜3のいずれか一項に記載の湿式化学処理用装置。
- 流量部材(150)が少なくとも二つのパドル様流量要素(155)を備えて構成されること、及び、流量要素(155)は互いに平行に配置されることを特徴とする、請求項1〜4のいずれか一項に記載の湿式化学処理用装置。
- 少なくとも一つの流量部材(150)が移動路内を移動可能であること、及び、パドル様流量要素(155)が移動路を横切って延びることを特徴とする、請求項1〜5のいずれか一項に記載の湿式化学処理用装置。
- 少なくとも一つの流量部材(150)が、製品(W)の表面が完全に覆われるように前後に移動可能であることを特徴とする、請求項1〜6のいずれか一項に記載の湿式化学処理用装置。
- 少なくとも一つの流量部材(150)は、流量部材が製品(W)の全表面に渡って動かされるように、移動路内を循環するように設計されることを特徴とする、請求項1〜6のいずれか一項に記載の湿式化学処理用装置。
- 流量部材(150)の少なくとも一つのパドル様流量要素(155)が固定されることを特徴とする請求項1〜8のいずれか一項に記載の湿式化学処理用装置。
- 流量部材(150)の少なくとも一つのパドル様流量部材(155)が枢軸回転可能であることを特徴とする、請求項1〜8のいずれか一項に記載の湿式化学処理用装置。
- パドル様流量要素(155)が、製品(W)の表面に面する凸型に形成された端面を備えて構成されることを特徴とする、請求項1〜10のいずれか一項に記載の湿式化学処理用装置。
- パドル様流量要素(155)が、移動中屈曲するように設計されることを特徴とする、請求項1〜11のいずれか一項に記載の湿式化学処理用装置。
- パドル様流量要素(155)が、ストリップ及びピンの群から選択されることを特徴とする、請求項1〜12のいずれか一項に記載の湿式化学処理用装置。
- 少なくとも一つの流量部材(150)が移動路内を移動可能であって、且つ主面を備えた少なくとも一つのストリップ(155)を備えて構成されること、及び、ストリップ(155)の主面が、流量部材(150)の移動路を横切って延びることを特徴とする、請求項13に記載の湿式化学処理用装置。
- パドル様流量要素(155)が、製品(W)の表面に面している側に溝及び/又は穴形成を形成するように構成されることを特徴とする、請求項13又は14に記載の湿式化学処理用装置。
- 製品(W)が処理面に対して垂直に動くこと、及び、同時に少なくとも一つの流量部材(150)が、製品(W)から一定の間隔をあけてそれと平行に動かされることを特徴とする、請求項3〜15のいずれか一項に記載の湿式化学処理用装置。
- 請求項1〜16のいずれか一項に記載の処理装置(100)内に置かれた板状製品(W)の湿式化学処理方法であって、
a.処理装置(100)内に少なくとも一つの流量部材(150)を備える工程であって、上記流量部材は各々少なくとも一つのパドル様流量要素(155)を備えて構成される、工程と、
b.板状製品(W)の表面と向かい合うように、処理装置(100)内に少なくとも一つの流量部材(150)を配置する工程と、
c.板状製品(W)の表面に対して平行に流量部材(150)を動かす工程とを有する方法において、
流量部材(150)は、板状製品(W)の両側に配置され、流量部材(150)のパドル様流量要素(155)は、板状製品(W)の両側に面して互いに喰い違うように置かれることを特徴とする、方法。 - 少なくとも一つの流量部材(150)が、前後に且つ製品(W)の全表面に渡って動かされることを特徴とする、請求項17に記載の湿式化学処理方法。
- 少なくとも一つの流量部材(150)が、製品(W)の全表面に渡って動くように、移動路内を循環することを特徴とする、請求項17に記載の湿式化学処理方法。
- 装置(100)内に置かれた板状製品(W)の湿式化学処理のために、少なくとも一つのパドル様流量要素(155)を備えた少なくとも一つの流量部材(150)を、装置(100)内に取り付ける方法であって、
i.湿式化学処理用装置(100)を備える工程、
ii.少なくとも一つの流量部材(150)が板状製品(W)の表面と向かい合うように配置され、且つ板状製品(W)の表面に平行に移動可能となるように、流量部材(150)を装置(100)内に取り付ける工程、を含む方法において、
流量部材(150)は、板状製品(W)の両側に配置され、流量部材(150)のパドル様流量要素(155)は、板状製品(W)の両側に面して互いに喰い違うように置かれることを特徴とする、方法。
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DE102007026635.0 | 2007-06-06 | ||
DE102007026635A DE102007026635B4 (de) | 2007-06-06 | 2007-06-06 | Vorrichtung zum nasschemischen Behandeln von Ware, Verwendung eines Strömungsorgans, Verfahren zum Einbauen eines Strömungsorgans in die Vorrichtung sowie Verfahren zur Herstellung einer nasschemisch behandelten Ware |
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DE102007026635B4 (de) * | 2007-06-06 | 2010-07-29 | Atotech Deutschland Gmbh | Vorrichtung zum nasschemischen Behandeln von Ware, Verwendung eines Strömungsorgans, Verfahren zum Einbauen eines Strömungsorgans in die Vorrichtung sowie Verfahren zur Herstellung einer nasschemisch behandelten Ware |
DE102010033256A1 (de) | 2010-07-29 | 2012-02-02 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Methode zur Erzeugung gezielter Strömungs- und Stromdichtemuster bei der chemischen und elektrolytischen Oberflächenbehandlung |
EP2518187A1 (en) | 2011-04-26 | 2012-10-31 | Atotech Deutschland GmbH | Aqueous acidic bath for electrolytic deposition of copper |
US8920616B2 (en) * | 2012-06-18 | 2014-12-30 | Headway Technologies, Inc. | Paddle for electroplating for selectively depositing greater thickness |
US20160347643A1 (en) * | 2015-05-29 | 2016-12-01 | Asahi Glass Company, Limited | Glass substrate manufacturing method |
JP6790016B2 (ja) * | 2018-04-10 | 2020-11-25 | 上村工業株式会社 | 表面処理装置、表面処理方法及びパドル |
TWI700401B (zh) | 2018-08-21 | 2020-08-01 | 財團法人工業技術研究院 | 待電鍍的面板、使用其之電鍍製程、及以其製造之晶片 |
US11608563B2 (en) | 2019-07-19 | 2023-03-21 | Asmpt Nexx, Inc. | Electrochemical deposition systems |
JP7383441B2 (ja) | 2019-10-07 | 2023-11-20 | 上村工業株式会社 | 表面処理装置、表面処理方法及びパドル |
CN110629264B (zh) * | 2019-11-11 | 2021-09-24 | 生益电子股份有限公司 | 一种pcb电镀装置 |
CN111672452A (zh) * | 2020-06-25 | 2020-09-18 | 毛俭英 | 一种混合效果优异的可移动反应釜 |
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- 2008-06-03 AT AT08759144T patent/ATE525124T1/de active
- 2008-06-03 WO PCT/EP2008/004617 patent/WO2008148579A1/en active Application Filing
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- 2008-06-03 US US12/602,722 patent/US8277602B2/en active Active
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KR20100017633A (ko) | 2010-02-16 |
EP2167224B1 (en) | 2011-09-21 |
BRPI0812227A2 (pt) | 2014-12-16 |
CN101687154A (zh) | 2010-03-31 |
TW200906497A (en) | 2009-02-16 |
DE102007026635B4 (de) | 2010-07-29 |
JP2010529293A (ja) | 2010-08-26 |
DE102007026635A1 (de) | 2008-12-18 |
US20100176088A1 (en) | 2010-07-15 |
PL2167224T3 (pl) | 2012-01-31 |
US8277602B2 (en) | 2012-10-02 |
ATE525124T1 (de) | 2011-10-15 |
KR101526022B1 (ko) | 2015-06-04 |
EP2167224A1 (en) | 2010-03-31 |
CN101687154B (zh) | 2013-07-17 |
WO2008148579A1 (en) | 2008-12-11 |
TWI482667B (zh) | 2015-05-01 |
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