KR930701641A - 습식 화학 처리 즉, 아연 도금 동안 보어를 가진 물품을 이동시키는 방법 및 상기 방법을 실시하기 위한 장치 - Google Patents
습식 화학 처리 즉, 아연 도금 동안 보어를 가진 물품을 이동시키는 방법 및 상기 방법을 실시하기 위한 장치Info
- Publication number
- KR930701641A KR930701641A KR1019930700020A KR930700020A KR930701641A KR 930701641 A KR930701641 A KR 930701641A KR 1019930700020 A KR1019930700020 A KR 1019930700020A KR 930700020 A KR930700020 A KR 930700020A KR 930701641 A KR930701641 A KR 930701641A
- Authority
- KR
- South Korea
- Prior art keywords
- article
- vibration
- frequency
- during
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
- H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/20—Electroplating using ultrasonics, vibrations
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Coating With Molten Metal (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEP4021581.4 | 1990-07-06 | ||
| DE4021581A DE4021581A1 (de) | 1990-07-06 | 1990-07-06 | Verfahren zur bewegung eines bohrungen aufweisenden gutes bei dessen nasschemischer behandlung, z.b. galvanisierung, sowie vorrichtung zur durchfuehrung des verfahrens |
| PCT/DE1991/000557 WO1992001088A1 (de) | 1990-07-06 | 1991-07-04 | Verfahren zur bewegung eines bohrungen aufweisenden gutes bei dessen nasschemischer behandlung, z.b. galvanisierung, sowie vorrichtung zur durchführung des verfahrens |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR930701641A true KR930701641A (ko) | 1993-06-12 |
Family
ID=6409800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019930700020A Ceased KR930701641A (ko) | 1990-07-06 | 1991-07-04 | 습식 화학 처리 즉, 아연 도금 동안 보어를 가진 물품을 이동시키는 방법 및 상기 방법을 실시하기 위한 장치 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0539390A1 (cs) |
| JP (1) | JPH05508744A (cs) |
| KR (1) | KR930701641A (cs) |
| CA (1) | CA2086762A1 (cs) |
| DE (1) | DE4021581A1 (cs) |
| WO (1) | WO1992001088A1 (cs) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101295339B1 (ko) * | 2011-06-09 | 2013-08-09 | 박경이 | 도금장치 |
| KR101303302B1 (ko) * | 2011-05-27 | 2013-09-03 | 박경이 | 도금용 플라이트 바 |
| KR101346837B1 (ko) * | 2011-12-30 | 2014-01-03 | (주)포인텍 | 기판의 기포 제거장치 및 제거방법 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4133561C2 (de) * | 1991-10-10 | 1994-02-03 | Reinhard Kissler Gmbh | Verfahren und Vorrichtung zum Galvanisieren von Waren |
| DE4212045C1 (de) * | 1992-04-07 | 1993-12-02 | Schering Ag | Verfahren und Vorrichtung zur chemischen und/oder galvanischen Behandlung von Werkstücken |
| JPH10512101A (ja) * | 1995-01-05 | 1998-11-17 | ヒューベル エゴン | 超微細孔を有したプレート形状の加工材料の処理のための方法と装置 |
| US6261435B1 (en) | 1997-10-21 | 2001-07-17 | Nihon Techno Kabushiki Kaisha | Plating method |
| DE10015349A1 (de) * | 2000-03-23 | 2001-10-25 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum Behandeln von durchgehende Löcher und/oder Vertiefungen aufweisenden Schaltungsträgern sowie Anwendung des Verfahrens und Verwendung der Vorrichtung |
| DE10259367A1 (de) * | 2002-12-18 | 2004-07-08 | Siemens Ag | Verfahren zur Verbesserung der Wechselwirkung zwischen einem Medium und einem Bauteil |
| DE102007026635B4 (de) * | 2007-06-06 | 2010-07-29 | Atotech Deutschland Gmbh | Vorrichtung zum nasschemischen Behandeln von Ware, Verwendung eines Strömungsorgans, Verfahren zum Einbauen eines Strömungsorgans in die Vorrichtung sowie Verfahren zur Herstellung einer nasschemisch behandelten Ware |
| DE102012021144B3 (de) * | 2012-10-24 | 2013-10-10 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Erzeugung von Metallisierungen in Sackloch-Vias |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE953759C (de) * | 1954-10-20 | 1956-12-06 | W Kampschulte & Cie Dr | Verfahren und Vorrichtung zum Bewegen der Werkstuecktraeger od. dgl. bei galvanischen Baedern |
| US2833708A (en) * | 1955-05-05 | 1958-05-06 | Rockwell Spring & Axle Co | Electroplating apparatus |
| US3461045A (en) * | 1965-10-21 | 1969-08-12 | Teletype Corp | Method of plating through holes |
| DE3105313A1 (de) * | 1981-02-13 | 1982-08-19 | Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen | Verfahren und vorrichtung zur behandlung von werkstuecken |
| US4875982A (en) * | 1987-02-06 | 1989-10-24 | Velie Circuits, Inc. | Plating high aspect ratio holes in circuit boards |
| DE3905100A1 (de) * | 1989-02-20 | 1990-08-23 | Hans Henig | Verfahren und vorrichtung zum elektrolytaustausch vornehmlich in engen vertiefungen grossflaechiger werkstuecke |
-
1990
- 1990-07-06 DE DE4021581A patent/DE4021581A1/de active Granted
-
1991
- 1991-07-04 WO PCT/DE1991/000557 patent/WO1992001088A1/de not_active Ceased
- 1991-07-04 KR KR1019930700020A patent/KR930701641A/ko not_active Ceased
- 1991-07-04 JP JP91511324A patent/JPH05508744A/ja active Pending
- 1991-07-04 CA CA002086762A patent/CA2086762A1/en not_active Abandoned
- 1991-07-04 EP EP91911680A patent/EP0539390A1/de not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101303302B1 (ko) * | 2011-05-27 | 2013-09-03 | 박경이 | 도금용 플라이트 바 |
| KR101295339B1 (ko) * | 2011-06-09 | 2013-08-09 | 박경이 | 도금장치 |
| KR101346837B1 (ko) * | 2011-12-30 | 2014-01-03 | (주)포인텍 | 기판의 기포 제거장치 및 제거방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE4021581A1 (de) | 1992-01-09 |
| CA2086762A1 (en) | 1992-01-07 |
| WO1992001088A1 (de) | 1992-01-23 |
| EP0539390A1 (de) | 1993-05-05 |
| JPH05508744A (ja) | 1993-12-02 |
| DE4021581C2 (cs) | 1993-09-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19930106 |
|
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19930309 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 19930106 Comment text: Patent Application |
|
| PG1501 | Laying open of application | ||
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 19950512 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 19950804 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 19950512 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |