JPH054816B2 - - Google Patents
Info
- Publication number
- JPH054816B2 JPH054816B2 JP61148570A JP14857086A JPH054816B2 JP H054816 B2 JPH054816 B2 JP H054816B2 JP 61148570 A JP61148570 A JP 61148570A JP 14857086 A JP14857086 A JP 14857086A JP H054816 B2 JPH054816 B2 JP H054816B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- insulating film
- semiconductor device
- sides
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W72/701—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61148570A JPS634637A (ja) | 1986-06-24 | 1986-06-24 | リ−ドフレ−ム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61148570A JPS634637A (ja) | 1986-06-24 | 1986-06-24 | リ−ドフレ−ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS634637A JPS634637A (ja) | 1988-01-09 |
| JPH054816B2 true JPH054816B2 (enExample) | 1993-01-20 |
Family
ID=15455698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61148570A Granted JPS634637A (ja) | 1986-06-24 | 1986-06-24 | リ−ドフレ−ム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS634637A (enExample) |
-
1986
- 1986-06-24 JP JP61148570A patent/JPS634637A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS634637A (ja) | 1988-01-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH054816B2 (enExample) | ||
| JPS6052660U (ja) | プリント基板 | |
| JP2782870B2 (ja) | リードフレーム | |
| JPH0621247Y2 (ja) | リ−ドレスチツプキヤリア | |
| JPS6046059A (ja) | リ−ド・フレ−ム | |
| KR920017219A (ko) | 반도체장치와 반도체장치의 제조방법 및 테이프 캐리어 | |
| JPS59158545A (ja) | リ−ドフレ−ム | |
| JPS63278359A (ja) | リ−ドフレ−ム | |
| JPS5813473Y2 (ja) | センシングスイッチ装置 | |
| JPS6237887B2 (enExample) | ||
| JPS58197757A (ja) | リ−ド・フレ−ム | |
| JPS60198850A (ja) | リ−ド・フレ−ム | |
| JPH0543297B2 (enExample) | ||
| JPS59109981U (ja) | 多チヤンネル形放射線検出器 | |
| JPH01210393A (ja) | 集積回路装置 | |
| JPH05259214A (ja) | 半導体装置 | |
| GB1411220A (en) | Method of securing electrical components to members | |
| JPH01256190A (ja) | 導電性リード | |
| JPS61265852A (ja) | キヤリア・テ−プ | |
| JPH0430441A (ja) | 半導体装置 | |
| JPH01155632A (ja) | テープキャリア式半導体装置 | |
| JPS61136550U (enExample) | ||
| JPS63162464U (enExample) | ||
| JPS6052964U (ja) | 部分めっき用マスキング装置 | |
| JPS6239089A (ja) | 回路基板 |