JPH0546996B2 - - Google Patents

Info

Publication number
JPH0546996B2
JPH0546996B2 JP61156868A JP15686886A JPH0546996B2 JP H0546996 B2 JPH0546996 B2 JP H0546996B2 JP 61156868 A JP61156868 A JP 61156868A JP 15686886 A JP15686886 A JP 15686886A JP H0546996 B2 JPH0546996 B2 JP H0546996B2
Authority
JP
Japan
Prior art keywords
laminated
base material
guide hole
mold
inner layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61156868A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6313395A (ja
Inventor
Takashi Shin
Hisashi Kuwata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP15686886A priority Critical patent/JPS6313395A/ja
Publication of JPS6313395A publication Critical patent/JPS6313395A/ja
Publication of JPH0546996B2 publication Critical patent/JPH0546996B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP15686886A 1986-07-03 1986-07-03 多層印刷配線板の製造方法 Granted JPS6313395A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15686886A JPS6313395A (ja) 1986-07-03 1986-07-03 多層印刷配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15686886A JPS6313395A (ja) 1986-07-03 1986-07-03 多層印刷配線板の製造方法

Publications (2)

Publication Number Publication Date
JPS6313395A JPS6313395A (ja) 1988-01-20
JPH0546996B2 true JPH0546996B2 (enrdf_load_stackoverflow) 1993-07-15

Family

ID=15637143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15686886A Granted JPS6313395A (ja) 1986-07-03 1986-07-03 多層印刷配線板の製造方法

Country Status (1)

Country Link
JP (1) JPS6313395A (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3800431C2 (de) * 1988-01-09 1997-06-05 Hauni Werke Koerber & Co Kg Vorrichtung zum längsaxialen Führen von stabförmigen Artikeln der tabakverarbeitenden Industrie
JP2541706Y2 (ja) * 1989-01-08 1997-07-16 征四郎 吉原 バイクのフェアリング
JP2001129622A (ja) * 1999-10-28 2001-05-15 Honda Motor Co Ltd 超塑性成形金型の位置決め機構。
JP3931330B2 (ja) * 2001-09-14 2007-06-13 ソニー株式会社 熱プレス用プレートおよびカード製造装置
JP2006202957A (ja) * 2005-01-20 2006-08-03 Shinko Seisakusho:Kk 補強板付きプリント配線板の製造方法
WO2009034819A1 (ja) * 2007-09-11 2009-03-19 Konica Minolta Medical & Graphic, Inc. マイクロチップの製造方法、マイクロチップ、真空貼付装置
JP6867205B2 (ja) * 2017-03-22 2021-04-28 シャープ株式会社 カバー取付け構造及び表示装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS588160B2 (ja) * 1978-10-14 1983-02-14 富士通株式会社 多層印刷配線板の製造方法
JPS57193261U (enrdf_load_stackoverflow) * 1981-06-02 1982-12-07
JPS59194917U (ja) * 1983-06-15 1984-12-25 日本電気株式会社 多層印刷配線板積層用ガイドピンの樹脂剥離装置
JPS6035596A (ja) * 1983-08-08 1985-02-23 株式会社日立製作所 多層印刷配線板の積層接着用金型
JPS60171790A (ja) * 1984-02-17 1985-09-05 株式会社日立製作所 多層印刷配線板の積層接着用金型

Also Published As

Publication number Publication date
JPS6313395A (ja) 1988-01-20

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