JPH0542157B2 - - Google Patents
Info
- Publication number
- JPH0542157B2 JPH0542157B2 JP61029361A JP2936186A JPH0542157B2 JP H0542157 B2 JPH0542157 B2 JP H0542157B2 JP 61029361 A JP61029361 A JP 61029361A JP 2936186 A JP2936186 A JP 2936186A JP H0542157 B2 JPH0542157 B2 JP H0542157B2
- Authority
- JP
- Japan
- Prior art keywords
- catalyst
- hole
- layer
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2936186A JPS62186594A (ja) | 1986-02-12 | 1986-02-12 | 多層印刷配線板の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2936186A JPS62186594A (ja) | 1986-02-12 | 1986-02-12 | 多層印刷配線板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62186594A JPS62186594A (ja) | 1987-08-14 |
JPH0542157B2 true JPH0542157B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-06-25 |
Family
ID=12274041
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2936186A Granted JPS62186594A (ja) | 1986-02-12 | 1986-02-12 | 多層印刷配線板の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62186594A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2582142B2 (ja) * | 1988-04-27 | 1997-02-19 | 日本電信電話株式会社 | マトリクススイッチボ−ド及びマトリクススイッチボ−ド用接続ピン及びマトリクスボ−ドの製造方法 |
JPH1174651A (ja) | 1997-03-13 | 1999-03-16 | Ibiden Co Ltd | プリント配線板及びその製造方法 |
JP4482613B2 (ja) * | 2009-12-24 | 2010-06-16 | 新光電気工業株式会社 | 多層配線基板の製造方法 |
JP5751090B2 (ja) | 2011-08-22 | 2015-07-22 | ソニー株式会社 | スピーカー装置 |
US10820427B2 (en) | 2013-03-15 | 2020-10-27 | Sanmina Corporation | Simultaneous and selective wide gap partitioning of via structures using plating resist |
US9781844B2 (en) | 2013-03-15 | 2017-10-03 | Sanmina Corporation | Simultaneous and selective wide gap partitioning of via structures using plating resist |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5443568A (en) * | 1977-09-12 | 1979-04-06 | Fujitsu Ltd | Multilayer printed board |
JPS5868999A (ja) * | 1981-10-21 | 1983-04-25 | 富士通株式会社 | 多層プリント配線板の製造方法 |
-
1986
- 1986-02-12 JP JP2936186A patent/JPS62186594A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS62186594A (ja) | 1987-08-14 |