JPS62186594A - 多層印刷配線板の製造方法 - Google Patents
多層印刷配線板の製造方法Info
- Publication number
- JPS62186594A JPS62186594A JP2936186A JP2936186A JPS62186594A JP S62186594 A JPS62186594 A JP S62186594A JP 2936186 A JP2936186 A JP 2936186A JP 2936186 A JP2936186 A JP 2936186A JP S62186594 A JPS62186594 A JP S62186594A
- Authority
- JP
- Japan
- Prior art keywords
- catalyst
- layer
- printed wiring
- wiring board
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000003054 catalyst Substances 0.000 claims description 22
- 239000004020 conductor Substances 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 6
- 238000007772 electroless plating Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 43
- 238000005553 drilling Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000007847 structural defect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2936186A JPS62186594A (ja) | 1986-02-12 | 1986-02-12 | 多層印刷配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2936186A JPS62186594A (ja) | 1986-02-12 | 1986-02-12 | 多層印刷配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62186594A true JPS62186594A (ja) | 1987-08-14 |
| JPH0542157B2 JPH0542157B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-06-25 |
Family
ID=12274041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2936186A Granted JPS62186594A (ja) | 1986-02-12 | 1986-02-12 | 多層印刷配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62186594A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5017145A (en) * | 1988-04-27 | 1991-05-21 | Nippon Telegraph & Telephone Corporation | Matrix switching device and method of manufacturing the same |
| US7612295B2 (en) | 1997-03-13 | 2009-11-03 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
| JP2010068011A (ja) * | 2009-12-24 | 2010-03-25 | Shinko Electric Ind Co Ltd | 多層配線基板の製造方法 |
| US8798309B2 (en) | 2011-08-22 | 2014-08-05 | Sony Corporation | Speaker device with a magnetic gap filled with magnetic fluid and changing magnetic flux density in axial and circumferential direction |
| US9781844B2 (en) | 2013-03-15 | 2017-10-03 | Sanmina Corporation | Simultaneous and selective wide gap partitioning of via structures using plating resist |
| US10820427B2 (en) | 2013-03-15 | 2020-10-27 | Sanmina Corporation | Simultaneous and selective wide gap partitioning of via structures using plating resist |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5443568A (en) * | 1977-09-12 | 1979-04-06 | Fujitsu Ltd | Multilayer printed board |
| JPS5868999A (ja) * | 1981-10-21 | 1983-04-25 | 富士通株式会社 | 多層プリント配線板の製造方法 |
-
1986
- 1986-02-12 JP JP2936186A patent/JPS62186594A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5443568A (en) * | 1977-09-12 | 1979-04-06 | Fujitsu Ltd | Multilayer printed board |
| JPS5868999A (ja) * | 1981-10-21 | 1983-04-25 | 富士通株式会社 | 多層プリント配線板の製造方法 |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5017145A (en) * | 1988-04-27 | 1991-05-21 | Nippon Telegraph & Telephone Corporation | Matrix switching device and method of manufacturing the same |
| US7612295B2 (en) | 1997-03-13 | 2009-11-03 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
| JP2010068011A (ja) * | 2009-12-24 | 2010-03-25 | Shinko Electric Ind Co Ltd | 多層配線基板の製造方法 |
| US8798309B2 (en) | 2011-08-22 | 2014-08-05 | Sony Corporation | Speaker device with a magnetic gap filled with magnetic fluid and changing magnetic flux density in axial and circumferential direction |
| US9462392B2 (en) | 2011-08-22 | 2016-10-04 | Sony Corporation | Speaker device with a magnetic gap filled with magnetic fluid and changing magnetic flux density in axial and circumferential directions |
| US9781844B2 (en) | 2013-03-15 | 2017-10-03 | Sanmina Corporation | Simultaneous and selective wide gap partitioning of via structures using plating resist |
| US10820427B2 (en) | 2013-03-15 | 2020-10-27 | Sanmina Corporation | Simultaneous and selective wide gap partitioning of via structures using plating resist |
| US11304311B2 (en) | 2013-03-15 | 2022-04-12 | Sanmina Corporation | Simultaneous and selective wide gap partitioning of via structures using plating resist |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0542157B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-06-25 |
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