JPH0542156B2 - - Google Patents

Info

Publication number
JPH0542156B2
JPH0542156B2 JP63328857A JP32885788A JPH0542156B2 JP H0542156 B2 JPH0542156 B2 JP H0542156B2 JP 63328857 A JP63328857 A JP 63328857A JP 32885788 A JP32885788 A JP 32885788A JP H0542156 B2 JPH0542156 B2 JP H0542156B2
Authority
JP
Japan
Prior art keywords
coverlay
adhesive
printed wiring
flexible printed
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63328857A
Other languages
English (en)
Japanese (ja)
Other versions
JPH02177497A (ja
Inventor
Keisuke Kurachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP32885788A priority Critical patent/JPH02177497A/ja
Publication of JPH02177497A publication Critical patent/JPH02177497A/ja
Publication of JPH0542156B2 publication Critical patent/JPH0542156B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP32885788A 1988-12-28 1988-12-28 フレキシブルプリント配線板の製造方法 Granted JPH02177497A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32885788A JPH02177497A (ja) 1988-12-28 1988-12-28 フレキシブルプリント配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32885788A JPH02177497A (ja) 1988-12-28 1988-12-28 フレキシブルプリント配線板の製造方法

Publications (2)

Publication Number Publication Date
JPH02177497A JPH02177497A (ja) 1990-07-10
JPH0542156B2 true JPH0542156B2 (enrdf_load_stackoverflow) 1993-06-25

Family

ID=18214867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32885788A Granted JPH02177497A (ja) 1988-12-28 1988-12-28 フレキシブルプリント配線板の製造方法

Country Status (1)

Country Link
JP (1) JPH02177497A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5093897B2 (ja) * 2008-05-13 2012-12-12 サン・トックス株式会社 カバーレイフィルム熱圧着用シート
JP5613918B2 (ja) * 2009-06-12 2014-10-29 株式会社フジクラ フレキシブルプリント基板の製造方法
JP5970377B2 (ja) * 2010-12-27 2016-08-17 株式会社クラレ 回路基板およびその製造方法
KR101713785B1 (ko) * 2016-09-30 2017-03-08 (주)레온 개선된 고투명성 투명 필름의 제조방법

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6245133A (ja) * 1985-08-23 1987-02-27 Hitachi Ltd ペレツト付方法

Also Published As

Publication number Publication date
JPH02177497A (ja) 1990-07-10

Similar Documents

Publication Publication Date Title
DE69106624D1 (de) Starr-flexible Leiterplatte und Verfahren zur Bildung derselben.
JP2006032590A (ja) 回路基板の接続構造体とその製造方法
TW200829114A (en) Laminated multi-layer circuit board
JPH0542156B2 (enrdf_load_stackoverflow)
JP3855774B2 (ja) 多層基板の製造方法
JP2004241526A (ja) 配線基板
JP3956667B2 (ja) 回路基板およびその製造方法
JPH0359597B2 (enrdf_load_stackoverflow)
JPH07212044A (ja) リジットフレキシブル複合配線板の製造方法
JPH05191050A (ja) リジッドフレックス配線板の製造方法
JPH06268354A (ja) フレキシブル回路基板の製造方法
JP3659666B2 (ja) フレキシブルプリント基板の製造方法
JPH04351546A (ja) クッション材
JP2004214502A (ja) 電気回路形成用フィルム、電気回路及び電気回路の製造方法
JP3344655B2 (ja) プリント配線板の製造方法及びプリント配線板製造用のプレス装置
JPH04201442A (ja) クッション材
JPS6065552A (ja) Icカードおよびその製造方法
JPH02310990A (ja) カバーレイフィルム貼着加工用の加圧シート
JPH06210754A (ja) 片面銅張り積層板の製造方法
JP3059342B2 (ja) ヒートシールコネクタの製造方法
JPS6041284A (ja) フレキシブルプリント配線板の製造方法
JPH11185538A (ja) フラットケーブル接合体
JPH01199495A (ja) 多層回路配線板の製造方法
JP2001230526A (ja) 実装基板の製造方法及びそれにより得られた実装基板
JP2004241425A (ja) 多数個取り配線基板

Legal Events

Date Code Title Description
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090625

Year of fee payment: 16

EXPY Cancellation because of completion of term
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090625

Year of fee payment: 16