ATE117160T1 - Starr-flexible leiterplatte und verfahren zur bildung derselben. - Google Patents
Starr-flexible leiterplatte und verfahren zur bildung derselben.Info
- Publication number
- ATE117160T1 ATE117160T1 AT91306862T AT91306862T ATE117160T1 AT E117160 T1 ATE117160 T1 AT E117160T1 AT 91306862 T AT91306862 T AT 91306862T AT 91306862 T AT91306862 T AT 91306862T AT E117160 T1 ATE117160 T1 AT E117160T1
- Authority
- AT
- Austria
- Prior art keywords
- flexible
- edges
- prepreg
- layer
- rigid
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1536—Temporarily stacked PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/565,437 US5095628A (en) | 1990-08-09 | 1990-08-09 | Process of forming a rigid-flex circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE117160T1 true ATE117160T1 (de) | 1995-01-15 |
Family
ID=24258595
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT91306862T ATE117160T1 (de) | 1990-08-09 | 1991-07-26 | Starr-flexible leiterplatte und verfahren zur bildung derselben. |
Country Status (8)
Country | Link |
---|---|
US (1) | US5095628A (de) |
EP (1) | EP0470740B1 (de) |
JP (1) | JP2832868B2 (de) |
AT (1) | ATE117160T1 (de) |
DE (1) | DE69106624T2 (de) |
DK (1) | DK0470740T3 (de) |
ES (1) | ES2066360T3 (de) |
GR (1) | GR3015668T3 (de) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5147208A (en) * | 1991-06-28 | 1992-09-15 | Rogers Corporation | Flexible printed circuit with raised contacts |
US5224023A (en) * | 1992-02-10 | 1993-06-29 | Smith Gary W | Foldable electronic assembly module |
US5295838A (en) * | 1993-01-14 | 1994-03-22 | Hughes Aircraft Company | Raised feature/gold dot pressure interconnections of rigid-flex circuits and rigid circuit boards |
US5428190A (en) * | 1993-07-02 | 1995-06-27 | Sheldahl, Inc. | Rigid-flex board with anisotropic interconnect and method of manufacture |
US5376232A (en) * | 1993-08-23 | 1994-12-27 | Parlex Corporation | Method of manufacturing a printed circuit board |
US5362534A (en) * | 1993-08-23 | 1994-11-08 | Parlex Corporation | Multiple layer printed circuit boards and method of manufacture |
US5527998A (en) * | 1993-10-22 | 1996-06-18 | Sheldahl, Inc. | Flexible multilayer printed circuit boards and methods of manufacture |
US5508558A (en) * | 1993-10-28 | 1996-04-16 | Digital Equipment Corporation | High density, high speed, semiconductor interconnect using-multilayer flexible substrate with unsupported central portion |
US5877940A (en) * | 1993-12-02 | 1999-03-02 | Teledyne Industries Inc. | Fabrication multilayer combined rigid/flex printed circuit board |
US5505321A (en) * | 1994-12-05 | 1996-04-09 | Teledyne Industries, Inc. | Fabrication multilayer combined rigid/flex printed circuit board |
US6293008B1 (en) * | 1994-03-23 | 2001-09-25 | Dyconex Pantente Ag | Method for producing foil circuit boards |
EP0675673A3 (de) * | 1994-03-30 | 1997-03-05 | Nitto Denko Corp | Verstärkung für flexible Leiterplatte und verstärkte flexible Leiterplatte. |
US5499444A (en) * | 1994-08-02 | 1996-03-19 | Coesen, Inc. | Method of manufacturing a rigid flex printed circuit board |
US5719749A (en) * | 1994-09-26 | 1998-02-17 | Sheldahl, Inc. | Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board |
US5629497A (en) * | 1994-10-04 | 1997-05-13 | Cmk Corporation | Printed wiring board and method of manufacturing in which a basefilm including conductive circuits is covered by a cured polyimide resin lay |
JPH08107266A (ja) * | 1994-10-04 | 1996-04-23 | Cmk Corp | プリント配線板 |
US5759047A (en) * | 1996-05-24 | 1998-06-02 | International Business Machines Corporation | Flexible circuitized interposer with apertured member and method for making same |
US5784782A (en) * | 1996-09-06 | 1998-07-28 | International Business Machines Corporation | Method for fabricating printed circuit boards with cavities |
US6099745A (en) * | 1998-06-05 | 2000-08-08 | Parlex Corporation | Rigid/flex printed circuit board and manufacturing method therefor |
EP1335831B1 (de) * | 2000-10-16 | 2011-01-05 | Foster-Miller, Inc. | Verfahren zur herstellung eines gewebeartikels mit elektronischer beschaltung und gewebeartikel |
US6745463B1 (en) * | 2000-10-24 | 2004-06-08 | Unitech Printed Circuit Board Corp. | Manufacturing method of rigid flexible printed circuit board |
DE10243637B4 (de) * | 2002-09-19 | 2007-04-26 | Ruwel Ag | Leiterplatte mit mindestens einem starren und mindestens einem flexiblen Bereich sowie Verfahren zur Herstellung von starr-flexiblen Leiterplatten |
WO2005032447A2 (en) * | 2003-08-22 | 2005-04-14 | Foster-Miller, Inc. | Physiological monitoring garment |
US20070299325A1 (en) * | 2004-08-20 | 2007-12-27 | Brian Farrell | Physiological status monitoring system |
KR20120088843A (ko) * | 2004-08-31 | 2012-08-08 | 오베르메이어 헨리 케이 | 섬유 보강 복합물에 대한 고강력 결합 시스템 |
KR100619347B1 (ko) * | 2004-10-28 | 2006-09-13 | 삼성전기주식회사 | 리지드-플렉서블 기판의 제조 방법 |
US9211085B2 (en) | 2010-05-03 | 2015-12-15 | Foster-Miller, Inc. | Respiration sensing system |
US9028404B2 (en) | 2010-07-28 | 2015-05-12 | Foster-Miller, Inc. | Physiological status monitoring system |
US8585606B2 (en) | 2010-09-23 | 2013-11-19 | QinetiQ North America, Inc. | Physiological status monitoring system |
US8683681B2 (en) * | 2010-12-07 | 2014-04-01 | Raytheon Company | Room temperature low contact pressure method |
US10406791B2 (en) * | 2011-05-12 | 2019-09-10 | Elantas Pdg, Inc. | Composite insulating film |
KR102042822B1 (ko) * | 2012-09-24 | 2019-11-08 | 한국전자통신연구원 | 전자회로 및 그 제조방법 |
CN104582325B (zh) * | 2013-10-12 | 2018-03-27 | 鹏鼎控股(深圳)股份有限公司 | 刚挠结合板及其制作方法、电路板模组 |
EP3278636A4 (de) * | 2015-03-31 | 2018-12-05 | Hewlett-Packard Development Company, L.P. | Leiterplatte |
US10595419B1 (en) | 2018-10-24 | 2020-03-17 | International Business Machines Corporation | 3-D flex circuit forming |
CN113498249B (zh) * | 2020-04-07 | 2023-11-10 | 庆鼎精密电子(淮安)有限公司 | 软硬结合电路板及其制备方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3393392A (en) * | 1966-04-27 | 1968-07-16 | Rca Corp | Printed circuit connector |
US4001466A (en) * | 1973-11-27 | 1977-01-04 | Formica International Limited | Process for preparing printed circuits |
US4037047A (en) * | 1974-12-31 | 1977-07-19 | Martin Marietta Corporation | Multilayer circuit board with integral flexible appendages |
US4191800A (en) * | 1976-05-27 | 1980-03-04 | Bell Telephone Laboratories, Incorporated | Devices employing flexible substrates and method for making same |
US4857400A (en) * | 1984-02-22 | 1989-08-15 | Gila River Products, Inc. | Stratiform press pads and methods for use thereof in laminating flexible printed circuits |
DE3624719A1 (de) * | 1986-07-22 | 1988-01-28 | Schoeller & Co Elektronik | Vorlaminat fuer starr-flexible leiterplatten |
US4800461A (en) * | 1987-11-02 | 1989-01-24 | Teledyne Industries, Inc. | Multilayer combined rigid and flex printed circuits |
US4808461A (en) * | 1987-12-14 | 1989-02-28 | Foster-Miller, Inc. | Composite structure reinforcement |
US4931134A (en) * | 1989-08-15 | 1990-06-05 | Parlex Corporation | Method of using laser routing to form a rigid/flex circuit board |
-
1990
- 1990-08-09 US US07/565,437 patent/US5095628A/en not_active Expired - Lifetime
-
1991
- 1991-04-12 JP JP3106570A patent/JP2832868B2/ja not_active Expired - Fee Related
- 1991-07-26 DK DK91306862.3T patent/DK0470740T3/da active
- 1991-07-26 AT AT91306862T patent/ATE117160T1/de not_active IP Right Cessation
- 1991-07-26 DE DE69106624T patent/DE69106624T2/de not_active Expired - Lifetime
- 1991-07-26 ES ES91306862T patent/ES2066360T3/es not_active Expired - Lifetime
- 1991-07-26 EP EP91306862A patent/EP0470740B1/de not_active Expired - Lifetime
-
1995
- 1995-04-03 GR GR950400812T patent/GR3015668T3/el unknown
Also Published As
Publication number | Publication date |
---|---|
EP0470740B1 (de) | 1995-01-11 |
EP0470740A3 (en) | 1992-12-30 |
DE69106624D1 (de) | 1995-02-23 |
EP0470740A2 (de) | 1992-02-12 |
DE69106624T2 (de) | 1995-08-10 |
GR3015668T3 (en) | 1995-07-31 |
JPH06342980A (ja) | 1994-12-13 |
US5095628A (en) | 1992-03-17 |
DK0470740T3 (da) | 1995-06-19 |
JP2832868B2 (ja) | 1998-12-09 |
ES2066360T3 (es) | 1995-03-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
UEP | Publication of translation of european patent specification | ||
EEIH | Change in the person of patent owner | ||
EELA | Cancelled due to lapse of time |