JPH02177497A - フレキシブルプリント配線板の製造方法 - Google Patents
フレキシブルプリント配線板の製造方法Info
- Publication number
- JPH02177497A JPH02177497A JP32885788A JP32885788A JPH02177497A JP H02177497 A JPH02177497 A JP H02177497A JP 32885788 A JP32885788 A JP 32885788A JP 32885788 A JP32885788 A JP 32885788A JP H02177497 A JPH02177497 A JP H02177497A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- cover lay
- printed wiring
- flexible printed
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 230000001070 adhesive effect Effects 0.000 claims abstract description 28
- 239000000853 adhesive Substances 0.000 claims abstract description 27
- 239000010410 layer Substances 0.000 claims abstract description 24
- 238000002844 melting Methods 0.000 claims abstract description 11
- 230000008018 melting Effects 0.000 claims abstract description 11
- 239000002131 composite material Substances 0.000 claims abstract description 8
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 8
- 239000002344 surface layer Substances 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 abstract description 7
- 239000000155 melt Substances 0.000 abstract description 5
- 238000011109 contamination Methods 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000007654 immersion Methods 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 230000003578 releasing effect Effects 0.000 abstract 1
- 239000004743 Polypropylene Substances 0.000 description 10
- 229920001155 polypropylene Polymers 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 229920001684 low density polyethylene Polymers 0.000 description 3
- 239000004702 low-density polyethylene Substances 0.000 description 3
- 239000002033 PVDF binder Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000012787 coverlay film Substances 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 229920001903 high density polyethylene Polymers 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- 239000002655 kraft paper Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000011116 polymethylpentene Substances 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- QIVUCLWGARAQIO-OLIXTKCUSA-N (3s)-n-[(3s,5s,6r)-6-methyl-2-oxo-1-(2,2,2-trifluoroethyl)-5-(2,3,6-trifluorophenyl)piperidin-3-yl]-2-oxospiro[1h-pyrrolo[2,3-b]pyridine-3,6'-5,7-dihydrocyclopenta[b]pyridine]-3'-carboxamide Chemical compound C1([C@H]2[C@H](N(C(=O)[C@@H](NC(=O)C=3C=C4C[C@]5(CC4=NC=3)C3=CC=CN=C3NC5=O)C2)CC(F)(F)F)C)=C(F)C=CC(F)=C1F QIVUCLWGARAQIO-OLIXTKCUSA-N 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 241000190020 Zelkova serrata Species 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- VKLYZBPBDRELST-UHFFFAOYSA-N ethene;methyl 2-methylprop-2-enoate Chemical compound C=C.COC(=O)C(C)=C VKLYZBPBDRELST-UHFFFAOYSA-N 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32885788A JPH02177497A (ja) | 1988-12-28 | 1988-12-28 | フレキシブルプリント配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32885788A JPH02177497A (ja) | 1988-12-28 | 1988-12-28 | フレキシブルプリント配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02177497A true JPH02177497A (ja) | 1990-07-10 |
| JPH0542156B2 JPH0542156B2 (enrdf_load_stackoverflow) | 1993-06-25 |
Family
ID=18214867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32885788A Granted JPH02177497A (ja) | 1988-12-28 | 1988-12-28 | フレキシブルプリント配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02177497A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009277764A (ja) * | 2008-05-13 | 2009-11-26 | San Totsukusu Kk | カバーレイフィルム熱圧着用シート |
| JP2010287781A (ja) * | 2009-06-12 | 2010-12-24 | Fujikura Ltd | フレキシブルプリント基板およびその製造方法 |
| WO2012090733A1 (ja) * | 2010-12-27 | 2012-07-05 | 株式会社クラレ | 回路基板およびその製造方法 |
| JP6240807B1 (ja) * | 2016-09-30 | 2017-11-29 | パク, サン ミンPark, Shang Minh | 改善された高透明性フィルムの製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6245133A (ja) * | 1985-08-23 | 1987-02-27 | Hitachi Ltd | ペレツト付方法 |
-
1988
- 1988-12-28 JP JP32885788A patent/JPH02177497A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6245133A (ja) * | 1985-08-23 | 1987-02-27 | Hitachi Ltd | ペレツト付方法 |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009277764A (ja) * | 2008-05-13 | 2009-11-26 | San Totsukusu Kk | カバーレイフィルム熱圧着用シート |
| JP2010287781A (ja) * | 2009-06-12 | 2010-12-24 | Fujikura Ltd | フレキシブルプリント基板およびその製造方法 |
| WO2012090733A1 (ja) * | 2010-12-27 | 2012-07-05 | 株式会社クラレ | 回路基板およびその製造方法 |
| CN103270818A (zh) * | 2010-12-27 | 2013-08-28 | 株式会社可乐丽 | 电路基板及其制造方法 |
| JPWO2012090733A1 (ja) * | 2010-12-27 | 2014-06-05 | 株式会社クラレ | 回路基板およびその製造方法 |
| US9363890B2 (en) | 2010-12-27 | 2016-06-07 | Kuraray Co., Ltd. | Circuit board and method of manufacturing same |
| KR20190003817A (ko) * | 2010-12-27 | 2019-01-09 | 주식회사 쿠라레 | 회로 기판 및 그 제조 방법 |
| US10244619B2 (en) | 2010-12-27 | 2019-03-26 | Kurarau Co., Ltd. | Circuit board |
| US10653001B2 (en) | 2010-12-27 | 2020-05-12 | Kuraray Co., Ltd. | Release material |
| JP6240807B1 (ja) * | 2016-09-30 | 2017-11-29 | パク, サン ミンPark, Shang Minh | 改善された高透明性フィルムの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0542156B2 (enrdf_load_stackoverflow) | 1993-06-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090625 Year of fee payment: 16 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090625 Year of fee payment: 16 |