JPH054184B2 - - Google Patents

Info

Publication number
JPH054184B2
JPH054184B2 JP58034592A JP3459283A JPH054184B2 JP H054184 B2 JPH054184 B2 JP H054184B2 JP 58034592 A JP58034592 A JP 58034592A JP 3459283 A JP3459283 A JP 3459283A JP H054184 B2 JPH054184 B2 JP H054184B2
Authority
JP
Japan
Prior art keywords
molten solder
fluorinert
solder
vapor
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58034592A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59163074A (ja
Inventor
Tamotsu Usami
Toshihiro Tsuboi
Shuichi Sugimoto
Yasuyuki Yamazaki
Kanji Ootsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Microcomputer System Ltd
Hitachi Ltd
Original Assignee
Hitachi Microcomputer System Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Microcomputer System Ltd, Hitachi Ltd filed Critical Hitachi Microcomputer System Ltd
Priority to JP3459283A priority Critical patent/JPS59163074A/ja
Publication of JPS59163074A publication Critical patent/JPS59163074A/ja
Publication of JPH054184B2 publication Critical patent/JPH054184B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B23K1/015—Vapour-condensation soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
JP3459283A 1983-03-04 1983-03-04 半田付け方法 Granted JPS59163074A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3459283A JPS59163074A (ja) 1983-03-04 1983-03-04 半田付け方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3459283A JPS59163074A (ja) 1983-03-04 1983-03-04 半田付け方法

Publications (2)

Publication Number Publication Date
JPS59163074A JPS59163074A (ja) 1984-09-14
JPH054184B2 true JPH054184B2 (cg-RX-API-DMAC10.html) 1993-01-19

Family

ID=12418595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3459283A Granted JPS59163074A (ja) 1983-03-04 1983-03-04 半田付け方法

Country Status (1)

Country Link
JP (1) JPS59163074A (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61238464A (ja) * 1985-04-13 1986-10-23 Eiichi Miyake 物品加熱装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5340934A (en) * 1976-09-21 1978-04-13 Jirou Imazu Doubleeroof structure for vehicle

Also Published As

Publication number Publication date
JPS59163074A (ja) 1984-09-14

Similar Documents

Publication Publication Date Title
US4032033A (en) Methods and apparatus for heating articles
CN105965120B (zh) 一种GaAs微波功放芯片的半自动共晶焊接方法及产品
US4022371A (en) Vapor bonding method
JP3617188B2 (ja) はんだ付方法
KR950035549A (ko) 온도 제어된 비산화 분위기에서 인쇄 회로 기판상에 부품을 웨이브 납땜하는 방법
US4187974A (en) Condensation soldering facility
JPH054184B2 (cg-RX-API-DMAC10.html)
CA1297209C (en) Method for processing plastic packaged electronic devices
JPS59163071A (ja) 半田付け装置
JP3346280B2 (ja) 半田の表面処理方法および半田ならびに半田付け方法
JPH0317238B2 (cg-RX-API-DMAC10.html)
JPH0456191A (ja) 表面実装型ｉｃパッケージの基板への実装方法
JPH04270181A (ja) 超伝導体繊維を銅チャンネルにはんだ付けする方法
RU2812158C1 (ru) Способ вакуумной пайки припойных шариков на выводные площадки металлокерамических корпусов матричного типа
JPS595284B2 (ja) 電気調理器の製造方法
JPH06226485A (ja) コーティングはんだおよびコーティングはんだを貼付けた半導体パッケージ封止用リッド
JPH0286152A (ja) はんだディップ装置
GB2125437A (en) Soldering process
JPS6262595A (ja) 集積回路の実装方法
JPH01151254A (ja) 半導体パッケージ及びその製造方法
JPH02117198A (ja) 混成集積回路の実装方法
JP2000150755A (ja) 樹脂封止型半導体装置のリード端子半田被覆法
JPS6231147A (ja) 半導体装置
JPS6134237B2 (cg-RX-API-DMAC10.html)
JPH03230864A (ja) 迎えはんだ付け方法