GB2125437A - Soldering process - Google Patents
Soldering process Download PDFInfo
- Publication number
- GB2125437A GB2125437A GB08223588A GB8223588A GB2125437A GB 2125437 A GB2125437 A GB 2125437A GB 08223588 A GB08223588 A GB 08223588A GB 8223588 A GB8223588 A GB 8223588A GB 2125437 A GB2125437 A GB 2125437A
- Authority
- GB
- United Kingdom
- Prior art keywords
- solder
- vapour
- inert
- soldering
- melting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000005476 soldering Methods 0.000 title claims abstract description 17
- 229910000679 solder Inorganic materials 0.000 claims abstract description 58
- 238000009835 boiling Methods 0.000 claims abstract description 15
- 238000002844 melting Methods 0.000 claims abstract description 15
- 230000008018 melting Effects 0.000 claims abstract description 15
- 239000011248 coating agent Substances 0.000 claims abstract description 9
- 238000000576 coating method Methods 0.000 claims abstract description 9
- 229930195733 hydrocarbon Natural products 0.000 claims abstract description 9
- 150000002430 hydrocarbons Chemical class 0.000 claims abstract description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 239000007788 liquid Substances 0.000 claims abstract description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 3
- 239000001301 oxygen Substances 0.000 claims abstract description 3
- 150000007524 organic acids Chemical class 0.000 claims description 12
- 230000004907 flux Effects 0.000 claims description 10
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 8
- 239000004215 Carbon black (E152) Substances 0.000 claims description 6
- 238000010992 reflux Methods 0.000 claims description 6
- 238000007598 dipping method Methods 0.000 claims description 4
- 229910000978 Pb alloy Inorganic materials 0.000 claims description 2
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 claims description 2
- 229960005137 succinic acid Drugs 0.000 claims description 2
- 239000001384 succinic acid Substances 0.000 claims description 2
- 238000009834 vaporization Methods 0.000 claims description 2
- 238000005406 washing Methods 0.000 claims description 2
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
- B23K1/015—Vapour-condensation soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
- B23K35/386—Selection of media, e.g. special atmospheres for surrounding the working area for condensation soldering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/003—Apparatus
- C23C2/0038—Apparatus characterised by the pre-treatment chambers located immediately upstream of the bath or occurring locally before the dipping process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
- C23C2/022—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by heating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
- C23C2/024—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by cleaning or etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/088—Using a vapour or mist, e.g. cleaning using water vapor
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating With Molten Metal (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A process for soldering components to a printed circuit board (12) includes heating the printed circuit board by thermal transfer from an inert vapour in a tank (11) so as to exclude oxygen and the board is dipped in a solder bath (16) in the inert atmosphere. This enables dip soldering without the need for pre- solder coating or solder preforms. The inert vapour is produced from an inert organic liquid, e.g. fluorinated hydrocarbons, having a boiling point above the melting point of the solder, e.g. tin/lead. <IMAGE>
Description
SPECIFICATION
Soldering process
This invention relates to soldering processes, and in particular to techniques wherein piece parts are soldered in an inert atmosphere.
According to one aspect of the invention there is provided a process for applying solder to a body, the process including heating the body by thermal transfer from an inert vapour to a temperature above the melting point of the solder, and dipping the body into a bath of the molten solder whilst surrounded by said inert vapour.
According to another aspect of the invention there is provided a solder coating apparatus, including a bath for receiving a quantity of solder, means for refluxing adjacent the solder a dense organic vapour having a boiling point higher than the melting point of the solder whereby the solder is maintained in a molten state.
An embodiment of the invention will now be described with reference to the accompanying drawing in which the single figure is a schematic sectional view of a solder coating apparatus.
Referring to the drawing, the apparatus includes a tank 11 for containing a dense inert vapour whereby a piece part 12, e.g. a circuit board, to be soldered is protected from the ambient atmosphere during soldering. The inert vapour is produced from an inert organic liquid having a boiling point somewhat above the melting point of the solder to be applied to the piece part.
Typically we employ fluorinated hydrocarbons having a boiling point above 2000C in conjunction with a tin/lead solder having a melting point of about 1 800C. Vaporisation of the liquid 13 is effected by a heater 14 mounted adjacent the base of the tank, a cooling element 1 5 adjacent the upper region of the tank provides a refluxing action.
The tank 1 1 also contains an inner tank or bath 16 for receiving a quality of solder 17. We prefer to employ a 60/40 tin/lead alloy but other alloy compositions can of course be used. The solder 17 placed in the bath is heated above its melting point by thermal transfer from the vapour in contact with the solder.
Soldering of a piece part, e.g. a printed circuit board, is effected by immersing the piece part in the inert vapour whereby the part is heated to the vapour temperature. The piece part; or the relevant portion thereof, is dipped into the molten solder to effect deposition. The soldered part is then removed via the inert vapour blanket and is allowed to cool.
As the piece part is degreaced by the vapour prior to soldering the use of a flux is not essential.
Preferably however an organic acid flux such as succinic acid (Butanedioic acid) is added to the fluorinated hydrocarbon. This organic acid preferably has a boiling point above 2000C and an example of a suitable organic acid is succinic acid (Butanedioic acid) which has a boiling point of 2350C. In those applications where the use of a flux is desirable we have found that the vapour is effective in the removal of post soldering flux resides thus obviating the need for a separate washing process.
The portions of the piece parts to be soldered may be pre-tinned or they may simply comprise a clean metal surface. In some applications, e.g in the fabrication of printed circuits, solder preforms may be applied to the piece part prior to soldering. But the advantage of the present invention is that by excluding oxygen in the use of the inert vapour, in many instances pre-soldered parts and solder preforms are not necessary, thus removing a process stage from the overall process.
Claims
1. A process for applying solder to a body, the process including heating the body by thermal transfer from an inert vapour to a temperature above the melting point of the solder, and dipping the body into a bath of the molten solder whilst surrounded by said inert vapour.
2. A process as claimed in claim 1, wherein said insert vapour is protected by a blanket of a second, less dense, inert vapour.
3. A process as claimed in claim 1, wherein the inert vapour includes a fluorinated hydrocarbon.
4. A process as claimed in claim 3, wherein an organic acid flux is added to the fluorinated hydrocarbon.
5. A process as claimed in claim 4, wherein the organic acid has a boiling point above 2000C.
6. A process as claimed in claim 4 or claim 5, wherein the organic acid is succinic acid.
7. A process for applying solder to a body substantially as described herein with reference to the accompanying drawing.
8. A solder coating apparatus, including a bath for receiving a quantity of solder, means for refluxing adjacent the solder a dense organic vapour having a boiling point higher than the melting point of the solder whereby the solder is maintained in a molten state.
9. An apparatus as claimed in claim 1, and which further includes means for providing said organic vapour with a protective blanket of a further, less dense, inert vapour.
10. A solder coating apparatus substantially as described herein with reference to the accompanying drawing.
11. A body such as a printed circuit board soldered by a method or apparatus according to any preceding claim.
**WARNING** end of DESC field may overlap start of CLMS **.
Claims (11)
1. A process for applying solder to a body, the process including heating the body by thermal transfer from an inert vapour to a temperature above the melting point of the solder, and dipping the body into a bath of the molten solder whilst surrounded by said inert vapour.
2. A process as claimed in claim 1, wherein said insert vapour is protected by a blanket of a second, less dense, inert vapour.
3. A process as claimed in claim 1, wherein the inert vapour includes a fluorinated hydrocarbon.
4. A process as claimed in claim 3, wherein an organic acid flux is added to the fluorinated hydrocarbon.
5. A process as claimed in claim 4, wherein the organic acid has a boiling point above 2000C.
6. A process as claimed in claim 4 or claim 5, wherein the organic acid is succinic acid.
7. A process for applying solder to a body substantially as described herein with reference to the accompanying drawing.
8. A solder coating apparatus, including a bath for receiving a quantity of solder, means for refluxing adjacent the solder a dense organic vapour having a boiling point higher than the melting point of the solder whereby the solder is maintained in a molten state.
9. An apparatus as claimed in claim 1, and which further includes means for providing said organic vapour with a protective blanket of a further, less dense, inert vapour.
10. A solder coating apparatus substantially as described herein with reference to the accompanying drawing.
11. A body such as a printed circuit board soldered by a method or apparatus according to any preceding claim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB08223588A GB2125437B (en) | 1982-08-17 | 1982-08-17 | Soldering process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB08223588A GB2125437B (en) | 1982-08-17 | 1982-08-17 | Soldering process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB2125437A true GB2125437A (en) | 1984-03-07 |
| GB2125437B GB2125437B (en) | 1985-12-04 |
Family
ID=10532341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB08223588A Expired GB2125437B (en) | 1982-08-17 | 1982-08-17 | Soldering process |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2125437B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103817062A (en) * | 2013-12-28 | 2014-05-28 | 刘惠玲 | Method for coating preformed welding piece with coating |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1183975A (en) * | 1966-06-07 | 1970-03-11 | Metallurg D Esperance Longdoz | Method and apparatus for Continuous Galvanising |
| GB1496398A (en) * | 1974-05-24 | 1977-12-30 | Armco Steel Corp | Method of preparing a low alloy steel surface for hot dip metallic coating |
| GB1598570A (en) * | 1977-12-23 | 1981-09-23 | Bethlehem Steel Corp | Method of treating ferrous strand by hot dip coating procedure |
-
1982
- 1982-08-17 GB GB08223588A patent/GB2125437B/en not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1183975A (en) * | 1966-06-07 | 1970-03-11 | Metallurg D Esperance Longdoz | Method and apparatus for Continuous Galvanising |
| GB1496398A (en) * | 1974-05-24 | 1977-12-30 | Armco Steel Corp | Method of preparing a low alloy steel surface for hot dip metallic coating |
| GB1598570A (en) * | 1977-12-23 | 1981-09-23 | Bethlehem Steel Corp | Method of treating ferrous strand by hot dip coating procedure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103817062A (en) * | 2013-12-28 | 2014-05-28 | 刘惠玲 | Method for coating preformed welding piece with coating |
| CN103817062B (en) * | 2013-12-28 | 2015-07-08 | 深圳市福摩索金属制品有限公司 | Method for coating preformed welding piece with coating |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2125437B (en) | 1985-12-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19930817 |