JPH0532919B2 - - Google Patents
Info
- Publication number
- JPH0532919B2 JPH0532919B2 JP29912087A JP29912087A JPH0532919B2 JP H0532919 B2 JPH0532919 B2 JP H0532919B2 JP 29912087 A JP29912087 A JP 29912087A JP 29912087 A JP29912087 A JP 29912087A JP H0532919 B2 JPH0532919 B2 JP H0532919B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- layer
- conductor
- circuit pattern
- insulating plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000011889 copper foil Substances 0.000 claims description 8
- 238000007772 electroless plating Methods 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 43
- 230000007547 defect Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 241000764238 Isis Species 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29912087A JPH01140698A (ja) | 1987-11-26 | 1987-11-26 | 多層印刷配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29912087A JPH01140698A (ja) | 1987-11-26 | 1987-11-26 | 多層印刷配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01140698A JPH01140698A (ja) | 1989-06-01 |
| JPH0532919B2 true JPH0532919B2 (enrdf_load_stackoverflow) | 1993-05-18 |
Family
ID=17868376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29912087A Granted JPH01140698A (ja) | 1987-11-26 | 1987-11-26 | 多層印刷配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01140698A (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03296295A (ja) * | 1990-04-13 | 1991-12-26 | Hitachi Chem Co Ltd | 多層プリント配線板の製造法 |
| JP3303823B2 (ja) | 1999-02-23 | 2002-07-22 | 日本電気株式会社 | 電源回路 |
| CN102065651A (zh) * | 2011-01-12 | 2011-05-18 | 广州兴森快捷电路科技有限公司 | 高频材料的高密度积层印制电路板的生产方法 |
| CN105555065A (zh) * | 2016-02-02 | 2016-05-04 | 东莞翔国光电科技有限公司 | 一种电路板雕刻机六层盲孔板的制作工艺 |
-
1987
- 1987-11-26 JP JP29912087A patent/JPH01140698A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01140698A (ja) | 1989-06-01 |
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