JPH0528760Y2 - - Google Patents
Info
- Publication number
- JPH0528760Y2 JPH0528760Y2 JP1985142555U JP14255585U JPH0528760Y2 JP H0528760 Y2 JPH0528760 Y2 JP H0528760Y2 JP 1985142555 U JP1985142555 U JP 1985142555U JP 14255585 U JP14255585 U JP 14255585U JP H0528760 Y2 JPH0528760 Y2 JP H0528760Y2
- Authority
- JP
- Japan
- Prior art keywords
- pin
- semiconductor material
- chuck
- attached
- main shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 26
- 239000004065 semiconductor Substances 0.000 claims description 25
- 238000001035 drying Methods 0.000 claims description 11
- 230000000452 restraining effect Effects 0.000 claims 1
- 230000000630 rising effect Effects 0.000 claims 1
- 238000005530 etching Methods 0.000 description 2
- 229920004943 Delrin® Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Drying Of Solid Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985142555U JPH0528760Y2 (US20020095090A1-20020718-M00002.png) | 1985-09-18 | 1985-09-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985142555U JPH0528760Y2 (US20020095090A1-20020718-M00002.png) | 1985-09-18 | 1985-09-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6260028U JPS6260028U (US20020095090A1-20020718-M00002.png) | 1987-04-14 |
JPH0528760Y2 true JPH0528760Y2 (US20020095090A1-20020718-M00002.png) | 1993-07-23 |
Family
ID=31051397
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985142555U Expired - Lifetime JPH0528760Y2 (US20020095090A1-20020718-M00002.png) | 1985-09-18 | 1985-09-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0528760Y2 (US20020095090A1-20020718-M00002.png) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4502260B2 (ja) * | 2004-10-28 | 2010-07-14 | 株式会社ディスコ | スピンナー洗浄装置及びダイシング装置 |
JP6974116B2 (ja) * | 2017-10-27 | 2021-12-01 | 株式会社荏原製作所 | 基板保持装置並びに基板保持装置を備えた基板処理装置および基板処理方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5258458A (en) * | 1975-11-10 | 1977-05-13 | Hitachi Ltd | Spinner cleaning and drying mechanism |
JPS5737837A (en) * | 1980-08-20 | 1982-03-02 | Toshiba Corp | Drying device for semiconductor wafer |
JPS6064436A (ja) * | 1983-09-19 | 1985-04-13 | Fujitsu Ltd | スピンドライヤ |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60133629U (ja) * | 1984-02-17 | 1985-09-06 | 黒谷 巌 | 半導体材料の水切乾燥用回転装置 |
-
1985
- 1985-09-18 JP JP1985142555U patent/JPH0528760Y2/ja not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5258458A (en) * | 1975-11-10 | 1977-05-13 | Hitachi Ltd | Spinner cleaning and drying mechanism |
JPS5737837A (en) * | 1980-08-20 | 1982-03-02 | Toshiba Corp | Drying device for semiconductor wafer |
JPS6064436A (ja) * | 1983-09-19 | 1985-04-13 | Fujitsu Ltd | スピンドライヤ |
Also Published As
Publication number | Publication date |
---|---|
JPS6260028U (US20020095090A1-20020718-M00002.png) | 1987-04-14 |